STMicroelectronics L99DZ80EP
- Part No.:
- L99DZ80EP
- Manufacturer:
- STMicroelectronics
- Category:
- Power Management - Specialized
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
L99DZ80EP.pdf
- Description:
- IC DOOR MODULE DRIVER 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,462
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Product details
Overview
L99DZ80EP from STMicroelectronics is an AEC-Q100 qualified automotive door actuator driver IC with six integrated half-bridge outputs (including one 6 A full bridge), five high-side drivers (up to 5 A), and dedicated electrochromic mirror control logic. It integrates SPI-based diagnostics, programmable soft-start, open-load/overcurrent detection, and a central two-stage charge pump for motor drive down to 6 V supply. Used in dual-door lock, mirror fold/axis, and defroster control systems.
For engineers reviewing the L99DZ80EP datasheet, L99DZ80EP pinout, L99DZ80EP application, or L99DZ80EP equivalent, this page delivers verified functional architecture, real-world diagnostic capabilities (e.g., current monitor output per high-side driver), thermal protection thresholds (Tj ≤ 150 °C shutdown), and SPI register-mapped control-critical for automotive body control module (BCM) integration and fail-safe system validation.
Technical Context
The L99DZ80EP implements a microcontroller-driven, SPI-configurable multi-output driver architecture with segregated power domains: VS1 powers OUT1–OUT3, OUT7–OUT11, and internal circuitry; VS2 powers OUT4–OUT6. Its central two-stage charge pump enables full RDS(on) operation of the main H-bridge down to 6 V, while independent slew-rate control on gate drivers mitigates EMI during switching transitions.
All 11 power outputs feature per-channel diagnostics: open-load detection via voltage monitoring, overcurrent protection with configurable recovery mode, and current-sense feedback via analog CM output. The electrochromic control block supports bidirectional discharge (via ECFD pin) and integrates SPI-accessible configuration registers for PWM timing, fault masking, and watchdog window settings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Configuration | One 6 A full bridge (RON = 150 mΩ), two 3 A half bridges (RON = 300 mΩ), two 0.5 A half bridges (RON = 1600 mΩ), five high-side drivers (max 5 A, RON = 100 mΩ) |
| Supply Voltage Range | VS1/VS2: 5.5 V to 28 V; supports reverse-battery protection design; operational down to 6 V with full RDS(on) due to integrated charge pump |
| Standby Current | IS < 6 µA typical at Tj ≤ 85 °C - enables low-power wake-up architectures in automotive always-on domains |
| Diagnostic Coverage | Per-output open-load detection, overcurrent protection with auto-retry or latch-off, temperature warning (145 °C) and shutdown (150 °C), and current monitor output (0.5 V/A scaling) |
| SPI Interface | ST-SPI 3.1 protocol (4-wire, CSN/DI/CLK/DO); supports read/write of 8 control registers and 4 status registers for real-time fault reporting and configuration |
| Package | TQFP-64 (10 × 10 mm, 0.5 mm pitch); ECOPACK® RoHS-compliant; θJA = 30 °C/W (4-layer PCB, 100 cm² copper) |
Pinout & Package
TQFP-64 package with exposed thermal pad (EPAD) for enhanced thermal dissipation; requires soldering EPAD to PCB ground plane per STMicroelectronics layout guidelines (DocID18260 Rev 6, Section 6.2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VS1 / VS2 (Pins 2,3,11,12,23,36,37,45,46,51,52) | Power supply inputs | VS1 powers OUT1–3, OUT7–11, and internal logic; VS2 powers OUT4–6; both require local ceramic decoupling and external reverse-polarity protection |
| GND1 / GND2 (Pins 17,18,26,31,32,57,58) | Ground reference planes | GND1 supplies OUT1–3; GND2 supplies OUT4–6; internal connection exists but external star grounding at both sets is mandatory for full-current capability |
| OUT1–OUT6 (Pins 19–30,48–50,55,56,59,60) | Half-bridge outputs | Configurable as high-side, low-side, or full H-bridge; each includes parasitic bulk-drain diodes and integrated overcurrent/open-load sensing |
| OUT7–OUT11 (Pins 48–50,59,60) | High-side driver outputs | Designed for resistive loads (no internal GND-referenced freewheeling diode); include current monitor output and thermal foldback |
| ECV / ECFD (Pins 41,42) | Electrochromic mirror interface | ECV drives positive terminal; ECFD enables negative discharge path for mirror glass - supports bidirectional voltage control without external H-bridge |
| CSN / DI / CLK / DO (Pins 33,35,38,40) | SPI interface signals | 3.3 V tolerant; DO is 3-state when CSN high; supports daisy-chaining multiple L99DZ80EPs via shared bus with individual chip select |
Key Features
| Feature | Design Value |
|---|---|
| Programmable soft-start | Adjustable current-limit threshold during turn-on prevents inrush-induced voltage droop in battery-supplied door modules |
| Central two-stage charge pump | Maintains full gate drive for H-bridge MOSFETs down to 6 V VS supply - eliminates need for external boost circuitry |
| Per-output current monitor | Analog CM output (0.5 V/A) for all five high-side drivers enables real-time load profiling and predictive maintenance in BCM firmware |
| Dual power domain isolation | VS1/VS2 separation allows independent supply routing and fault containment - critical for ASIL-B compliant door actuator designs |
| Electrochromic discharge path | ECFD pin provides controlled negative discharge path for mirror glass, eliminating need for external bipolar driver or relay |
Applications
| Door Lock Actuation | Mirror Fold & Axis Control |
|---|---|
Use Scenario: Simultaneous control of left/right door lock motors and latch solenoids in premium vehicle platforms. IC Role / Device Role / Timing Role: L99DZ80EP provides six half-bridge outputs - three per door - enabling independent forward/reverse/brake control with cross-current protection and stall detection. Use Value: Integrated open-load detection confirms mechanical engagement; programmable PWM timing ensures smooth, noise-free actuation without external timing components. | Use Scenario: Bidirectional folding/unfolding and multi-axis positioning (vertical/horizontal tilt) of exterior mirrors. IC Role / Device Role / Timing Role: Dedicated half-bridges drive small DC motors; SPI-controlled slew-rate limits EMI during rapid direction reversal; current monitor validates position feedback. Use Value: Eliminates discrete H-bridge ICs and external current-sense amplifiers - reduces BOM count by ≥4 components per mirror axis. |
| Mirror Defroster & LED Control | Electrochromic Mirror Dimming |
Use Scenario: High-side switching of resistive defroster traces and LED lighting circuits in side-view mirrors. IC Role / Device Role / Timing Role: Five high-side drivers deliver up to 5 A (OUT7), 1.5 A (configurable OUT8/OUT9), and 0.7 A (OUT10/OUT11) with thermal foldback and current monitoring. Use Value: Low RON (100 mΩ max) minimizes power loss in 12 V defroster paths; standby IS < 6 µA extends battery life during vehicle sleep mode. | Use Scenario: Precise voltage ramping and polarity reversal for electrochromic (EC) glass dimming in auto-dimming rearview and side mirrors. IC Role / Device Role / Timing Role: ECV/ECFD pins + internal SPI-controlled charge pump generate ±12 V across EC element; discharge path avoids capacitor overvoltage. Use Value: Fully integrated EC driver replaces 8+ discrete components (MOSFETs, op-amps, charge pumps); supports fail-safe discharge on ignition-off. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive door actuator driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BD15101GUL | Single-package 5-channel high-side driver (max 1.5 A/channel); no half-bridge or electrochromic support; SPI interface absent | Limited to simple resistive load switching (bulbs, heaters); cannot drive DC motors or EC glass | Select only for cost-sensitive non-motorized door modules requiring basic diagnostics and low channel count |
| VNQ5E160K-E | Quad-channel high-side driver with 160 mΩ RON; includes current sense and thermal shutdown; no SPI, no motor bridge, no EC control | Targeted at generic body electronics (window lift, seat control); lacks integrated diagnostics granularity and multi-bridge coordination | Choose when system-level MCU handles all sequencing and diagnostics - L99DZ80EP preferred when centralized SPI-managed coordination is required |
Compared with BD15101GUL and VNQ5E160K-E, the L99DZ80EP uniquely integrates motor bridge control, electrochromic management, and SPI-based system-level diagnostics in a single AEC-Q100 device - reducing inter-IC communication overhead and enabling deterministic fault response in ASIL-B door systems.
Availability
L99DZ80EP is available at Aetrix Electronics and suitable for automotive door control modules, electrochromic mirror subsystems, and body control unit (BCU) designs requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.
Supply support for L99DZ80EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, and automotive-grade analog/mixed-signal devices since 1987.
The L99DZ80EP belongs to ST's Automotive Power Driver family, engineered specifically for intelligent body electronics - delivering integrated motor control, diagnostics, and fail-safe features to accelerate ASIL-B-compliant door and mirror system development.
FAQ
What is the maximum continuous current rating for the full-bridge output (OUT1–OUT3)?
The L99DZ80EP's primary full-bridge (configured using OUT1–OUT3) supports 6 A continuous current with RON = 150 mΩ at Tj = 25 °C. Derating applies above 85 °C junction temperature per Figure 6 in DocID18260 Rev 6; thermal design must maintain θJA ≤ 30 °C/W on 4-layer PCB to sustain full load.
How does the electrochromic mirror discharge function work?
The ECFD pin provides a dedicated low-impedance path to discharge electrochromic glass negatively - enabling rapid dimming reversal without external components. When activated via SPI register bit ECFD_EN, it sinks current from the mirror's floating electrode through an internal DMOS switch referenced to VS, avoiding voltage overshoot during discharge.
Can the L99DZ80EP drive external power MOSFETs in H-bridge configuration?
Yes - pins GSH1–GSH4 and GSL1–GSL4 provide gate-drive outputs for four external N-channel MOSFETs in H-bridge topology. These drivers support programmable slew-rate control and feature drain-source monitoring (DSMON) for short-circuit detection, as defined in Table 15 and Figure 15 of the datasheet.
Is the SPI interface compatible with standard 3.3 V microcontrollers?
Yes - all SPI pins (CSN, DI, CLK, DO) are 3.3 V tolerant with VIH(min) = 2.0 V and VIL(max) = 0.8 V. The interface uses ST-SPI 3.1 protocol with fixed 8-bit command byte format and supports read/write access to 8 control and 4 status registers without external level-shifting.
L99DZ80EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 64-TQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 4µA
- Voltage - Supply:
- 5V ~ 28V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TQFP
L99DZ80EP FAQ
1.How can I place an order for L99DZ80EP through Aetrix?
Please submit a Request for Quotation (RFQ) for L99DZ80EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L99DZ80EP reliable?
The price and inventory of L99DZ80EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L99DZ80EP is usually 5 days.
3.What payment methods are accepted for L99DZ80EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L99DZ80EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L99DZ80EP?
L99DZ80EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L99DZ80EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L99DZ80EP?
For technical support, including L99DZ80EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L99DZ80EP requirements.
6.How does Aetrix verify that L99DZ80EP is sourced from the original manufacturer or authorized distributors?
All L99DZ80EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L99DZ80EP meets industry standards.
7.What is the process for return or replacement of L99DZ80EP?
All L99DZ80EP units undergo pre-shipment inspection (PSI). If there is an issue with L99DZ80EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L99DZ80EP part is unused and in its original packaging.
Return procedure for L99DZ80EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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