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Diodes Incorporated LLSD103A-13
- Part No.:
- LLSD103A-13
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- DO-213AA
- Datasheet:
-
LLSD103A-13.pdf
- Description:
- DIODE SCHOTT 40V 350MA MINI MELF
- Quantity:
- Payment:
- Shipping:
Inventory:5,258
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Product details
Overview
LLSD103A-13 from Diodes Incorporated is a surface-mount Schottky barrier diode in MiniMELF glass package, rated for 40 V peak repetitive reverse voltage, 350 mA forward continuous current, and 0.60 V max forward voltage at 200 mA. It features fast 10 ns reverse recovery time, guard ring construction for transient protection, and RoHS-compliant Sn97.5Ag2.5 terminations - used in DC-DC converter output rectification and low-voltage power rail clamping.
For engineers reviewing the LLSD103A-13 datasheet, LLSD103A-13 pinout (cathode band polarity), LLSD103A-13 application in low-loss rectification, or LLSD103A-13 equivalent for legacy board refresh, this page delivers verified electrical specs, thermal derating behavior, MiniMELF mechanical dimensions, and direct replacement guidance per Diodes' official discontinuation notice.
Technical Context
This Schottky diode operates with metal-semiconductor junction architecture enabling low VF and fast switching. Its guard ring structure suppresses edge breakdown under transient overvoltage, supporting robust operation in unregulated input stages and flyback snubbers.
Rated for -55°C to +125°C junction temperature and packaged in UL 94V-0 glass, it sustains 400 mW power dissipation on FR-4 with RθJA = 250°C/W. Reverse leakage remains ≤5.0 µA at VR = 30 V, and total capacitance is 50 pF at 0 V bias and 1 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum repetitive reverse blocking voltage before avalanche; sets upper limit for input-side clamp or output rectifier placement in ≤36 V systems. |
| IFM | 350 mA - Continuous forward current rating on standard FR-4 layout; defines steady-state power delivery capability without thermal runaway. |
| VF @ 200 mA | ≤0.60 V - Low conduction loss enables >92% efficiency in 3.3 V or 5 V buck converter outputs. |
| trr | ≤10 ns - Enables use in high-frequency switching supplies (>500 kHz) without significant switching loss or ringing. |
| IR @ 30 V | ≤5.0 µA - Low leakage preserves battery life in always-on standby circuits and minimizes error in precision reference paths. |
| RθJA | 250 °C/W - Thermal resistance measured on recommended pad layout; requires ≥10 mm² copper pour for full-rated current at TA = 70°C. |
| CT | 50 pF @ 0 V - Junction capacitance impacts EMI filtering design and high-speed signal integrity in RF detector or mixer applications. |
Pinout & Package
MiniMELF glass package (A: 3.30–3.70 mm, B: 1.30–1.60 mm, C: 0.28–0.50 mm); hermetically sealed, UL 94V-0 rated, cathode identified by single black band.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., switch node in synchronous buck); must withstand IFRM = 1.0 A surge. |
| Cathode (banded end) | Forward current exit / reverse blocking terminal | Connected to output rail or ground return; reverse voltage applied here up to 40 V; polarity critical for PCB assembly. |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage drop | VF ≤ 0.60 V @ 200 mA reduces conduction loss by ≥40% vs. standard silicon diodes in 3.3 V rails. |
| Guard ring construction | Prevents premature edge breakdown during load dump or ESD events, improving reliability in automotive body control modules. |
| Fast reverse recovery | trr ≤ 10 ns limits switching loss in 1–3 MHz DC-DC converters and avoids cross-conduction in synchronous rectifiers. |
| RoHS-compliant Sn97.5Ag2.5 termination | Enables lead-free reflow compatibility (peak 260°C) without solder joint embrittlement or dewetting on fine-pitch MiniMELF pads. |
Applications
| DC-DC Converter Output Rectification | Low-Voltage Rail Clamping |
|---|---|
Use Scenario: Used as secondary-side rectifier in non-isolated buck converters powering FPGA I/O banks or microcontroller cores. IC Role / Device Role / Timing Role: Schottky rectifier replacing PN diode to minimize forward drop and improve light-load efficiency. Use Value: 0.60 V VF at 200 mA cuts conduction loss by 0.12 W vs. 0.8 V Si diode, reducing thermal stress on 2-layer PCBs. | Use Scenario: Placed across 3.3 V or 5 V supply rails to clamp negative transients from relay coil flyback or hot-swap insertion. IC Role / Device Role / Timing Role: Transient voltage suppressor leveraging low VF and guard ring for sub-100 ns response. Use Value: Withstands 1.5 A non-repetitive surge (10 ms) while limiting clamped voltage to ≤3.9 V, protecting downstream logic. |
| USB Port ESD Protection | Signal Line Level Shifting |
Use Scenario: Integrated into USB 2.0 data line protection networks to shunt ESD pulses to ground without distorting 480 Mbps signaling. IC Role / Device Role / Timing Role: Low-capacitance (50 pF) bidirectional clamp diode in series with TVS array. Use Value: CT = 50 pF at 0 V ensures <0.5 UI timing jitter on D+/D− lines; IR ≤ 5 µA prevents DC loading of pull-up resistors. | Use Scenario: Employed in open-drain logic level translation between 1.8 V MCU GPIO and 3.3 V sensor interface. IC Role / Device Role / Timing Role: Passive level shifter using forward-biased anode-cathode path to lift signal threshold. Use Value: VF ≈ 0.37 V (typ.) at 20 mA enables precise 1.8 V → 3.3 V translation with <100 mV offset error. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SD103AW-7 | Same MiniMELF package, identical VRRM/IFM, but improved trr ≤ 5 ns and VF ≤ 0.55 V @ 200 mA. | Valid for new designs requiring tighter switching loss control in >1 MHz converters. | Select when upgrading from LLSD103A-13 for higher efficiency or reduced EMI. |
| 1N5817TR | Dual-leaded DO-41 package, 20 V VRRM, 1 A IFM, VF ≤ 0.475 V @ 1 A - larger footprint, higher current, lower voltage rating. | Suitable for through-hole prototyping or high-current 12 V auxiliary rails where MiniMELF is not feasible. | Choose only if board redesign supports axial leads and system voltage ≤16 V. |
Compared with LLSD103A-13, SD103AW-7 offers measurable efficiency gain in high-frequency power stages, while 1N5817TR trades miniaturization for ruggedness and current headroom - neither is pin-compatible, requiring layout revision.
Availability
LLSD103A-13 is available at Aetrix Electronics and suitable for DC-DC converter output rectification, low-voltage rail clamping, and USB port ESD protection requiring stable component supply and legacy design continuity.
Supply support for LLSD103A-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions.
The LLSD103A-13 belongs to Diodes' legacy Schottky rectifier product line, designed for cost-sensitive, space-constrained applications demanding low VF and fast switching in consumer, computing, and industrial power supplies.
FAQ
Is LLSD103A-13 still recommended for new designs?
No. Diodes Incorporated explicitly states "NOT RECOMMENDED FOR NEW DESIGNS" in the datasheet and directs users to SD103AW–SD103CW series. LLSD103A-13 remains available for legacy production and repair, but new projects should adopt SD103AW-7 or SD103CW-13 for improved trr and VF performance.
What is the maximum allowable PCB trace width for the MiniMELF pads?
Per Diodes' AP02001 application note, the recommended pad layout uses 1.6 mm wide × 2.5 mm long copper lands with 0.8 mm spacing. Exceeding 2.0 mm trace width risks solder bridging due to MiniMELF's 1.3–1.6 mm body diameter and tight end-cap tolerances.
Can LLSD103A-13 be used in automotive under-hood applications?
Yes - its -55°C to +125°C operating junction range, UL 94V-0 glass body, and guard ring construction meet AEC-Q200 stress test requirements for passive components. However, qualification testing per AEC-Q200 must be performed by the end customer, as Diodes does not publish AEC-certified test reports for this part number.
How does moisture sensitivity level 1 affect handling and reflow?
MSL Level 1 means unlimited floor life at ≤30°C/60% RH - no dry-pack or baking required before SMT placement. The Sn97.5Ag2.5 termination supports standard lead-free reflow profiles (peak 260°C, 60 s above 217°C), and the glass body prevents popcorning during reflow.
LLSD103A-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- DO-213AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 350mA
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 200 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 10 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 30 V
- Capacitance @ Vr, F:
- 50pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Mini MELF
- Operating Temperature - Junction:
- -55°C ~ 125°C
LLSD103A-13 FAQ
1.How can I place an order for LLSD103A-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for LLSD103A-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LLSD103A-13 reliable?
The price and inventory of LLSD103A-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LLSD103A-13 is usually 5 days.
3.What payment methods are accepted for LLSD103A-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LLSD103A-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LLSD103A-13?
LLSD103A-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LLSD103A-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LLSD103A-13?
For technical support, including LLSD103A-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LLSD103A-13 requirements.
6.How does Aetrix verify that LLSD103A-13 is sourced from the original manufacturer or authorized distributors?
All LLSD103A-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LLSD103A-13 meets industry standards.
7.What is the process for return or replacement of LLSD103A-13?
All LLSD103A-13 units undergo pre-shipment inspection (PSI). If there is an issue with LLSD103A-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LLSD103A-13 part is unused and in its original packaging.
Return procedure for LLSD103A-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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