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Diodes Incorporated LLSD103B-13
- Part No.:
- LLSD103B-13
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- DO-213AA
- Datasheet:
-
LLSD103B-13.pdf
- Description:
- DIODE SCHOTT 30V 350MA MINI MELF
- Quantity:
- Payment:
- Shipping:
Inventory:2,373
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Product details
Overview
LLSD103B-13 from Diodes Incorporated is a surface-mount Schottky barrier diode in MiniMELF glass package, rated for 30 V peak repetitive reverse voltage, 350 mA forward continuous current, and 0.60 V max forward voltage at 200 mA. It features fast 10 ns reverse recovery time, guard ring construction for transient protection, and RoHS-compliant Sn97.5Ag2.5 terminations - used in DC-DC converter output rectification and low-voltage power rail clamping.
For engineers reviewing the LLSD103B-13 datasheet, LLSD103B-13 pinout, LLSD103B-13 application, or LLSD103B-13 equivalent, key selection criteria include its 30 V blocking capability, low VF at high IF, MiniMELF thermal performance (RθJA = 250 °C/W), and compatibility with automated SMT assembly on FR-4 boards using recommended pad layout AP02001.
Technical Context
This Schottky diode operates as a unidirectional low-loss rectifier with metal-semiconductor junction enabling minimal conduction loss. Its guard ring structure enhances ESD and surge immunity without requiring external TVS devices in compact power rails.
Designed for operation from –55 °C to +125 °C junction temperature, it delivers stable VF and IR across industrial temperature ranges, with 5.0 µA max reverse leakage at VR = 20 V and 50 pF typical junction capacitance at 0 V bias - critical for high-frequency switching node integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - maximum repetitive reverse voltage before breakdown; sets safe operating limit in 24 V system clamping |
| IFM | 350 mA - continuous forward current rating; defines steady-state power delivery capacity |
| VF @ 200 mA | 0.60 V max - low conduction loss enables >92% efficiency in 3.3 V–5 V synchronous rectifier auxiliary paths |
| trr | 10 ns - ultrafast recovery minimizes switching loss and ringing in >500 kHz DC-DC converters |
| RθJA | 250 °C/W - thermal resistance measured on FR-4 board; requires minimum copper area per AP02001 for thermal reliability |
| CT @ 0 V | 50 pF - low junction capacitance preserves signal edge integrity in high-speed clamp applications |
| IR @ 20 V | 5.0 µA max - low leakage maintains voltage hold in battery-backed backup circuits |
Pinout & Package
MiniMELF glass package (3.3–3.7 mm length × 1.3–1.6 mm diameter) with axial cathode band polarity marking; no discrete pins - two axial terminals: anode and cathode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to higher-potential node (e.g., switch node or input rail); must withstand 1.5 A non-repetitive surge |
| Cathode | Forward current exit / reverse blocking terminal | Marked by visible band; ties to lower-potential node (e.g., ground or output capacitor); blocks up to 30 V reverse |
Key Features
| Feature | Design Value |
|---|---|
| Low VF at high IF | 0.60 V max @ 200 mA - reduces I²R loss by ≥40% vs. standard silicon diodes in 3.3 V rail clamping |
| Guard ring construction | Integrated transient protection - eliminates need for separate TVS in space-constrained USB or sensor power inputs |
| MiniMELF glass package | UL 94V-0 rated, 0.05 g mass - supports reflow compatibility and flame-retardant compliance in Class II consumer enclosures |
| Fast trr | 10 ns - enables clean turn-off in 1–2 MHz buck converter freewheeling paths without snubber networks |
Applications
| USB Power Input Protection | Industrial Sensor Supply Clamp |
|---|---|
Use Scenario: 5 V USB-powered IoT node with hot-plug risk and ESD exposure. IC Role / Device Role / Timing Role: Reverse polarity and ESD clamp at VBUS input, placed before LDO regulator. Use Value: Guard ring structure absorbs ±8 kV HBM transients; 30 V VRRM safely handles load dump spikes up to 28 V RMS. | Use Scenario: 24 V loop-powered analog sensor with 4–20 mA output and microcontroller interface. IC Role / Device Role / Timing Role: Low-leakage reverse-blocking element protecting ADC reference rail from backfeed during sensor disconnect. Use Value: 5.0 µA IR at 20 V ensures <1 mV reference shift over full temperature range; MiniMELF fits tight 3.5 mm pitch layouts. |
| DC-DC Converter Output Rectifier | Low-Voltage Logic-Level Clamping |
Use Scenario: 1.2 V/3 A buck converter for FPGA core supply with 1 MHz switching frequency. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacement in cost-sensitive designs where MOSFET gate drive complexity is prohibitive. Use Value: 10 ns trr prevents shoot-through overlap; 0.60 V VF limits conduction loss to <360 mW at 3 A peak. | Use Scenario: 3.3 V I²C bus level translation between MCU and EEPROM with bidirectional signal integrity requirements. IC Role / Device Role / Timing Role: Bidirectional clamp limiting voltage excursion to ±0.6 V beyond rail, preventing latch-up in mixed-voltage interfaces. Use Value: 50 pF CT avoids signal rise-time degradation; low VF ensures clamping threshold remains below 0.6 V even at 10 mA transient currents. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SD103BW-7 | Same MiniMELF package; 30 V VRRM; 0.55 V VF typ @ 200 mA (0.05 V lower) | Optimized for higher-efficiency 3.3 V systems; slightly tighter VF distribution | Select when VF consistency across batch is critical for thermal margin in sealed enclosures |
| 1N5817TR | Dual-in-line DO-41 package; 20 V VRRM; 0.45 V VF @ 1 A; RθJA ≈ 120 °C/W | Higher-current, lower-frequency use (≤100 kHz); requires larger PCB area and through-hole assembly | Choose only for legacy through-hole designs or where higher IFM (1 A) outweighs SMT compatibility and size constraints |
Compared with SD103BW-7, LLSD103B-13 offers identical ratings but wider VF tolerance (0.60 V max vs. 0.55 V typ), while 1N5817TR trades MiniMELF miniaturization and 10 ns speed for higher current and lower thermal resistance - making LLSD103B-13 optimal for space-constrained, high-frequency 24 V and below rectification.
Availability
LLSD103B-13 is available at Aetrix Electronics and suitable for USB power input protection, industrial sensor supply clamp, and DC-DC converter output rectification requiring stable component supply and long-term industrial lifecycle support.
Supply support for LLSD103B-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management and signal integrity solutions for industrial, computing, and consumer markets.
The LLSD103x series belongs to Diodes' MiniMELF Schottky rectifier product line, engineered specifically for compact, high-efficiency low-voltage power conversion and transient-protected clamping in space- and thermally constrained applications.
FAQ
Is LLSD103B-13 compatible with lead-free reflow soldering profiles?
Yes. LLSD103B-13 uses Sn97.5Ag2.5 terminations and meets MIL-STD-202 Method 208 solderability requirements. It is qualified for standard JEDEC J-STD-020C Level 1 moisture sensitivity and withstands peak reflow temperatures up to 260 °C with no preconditioning needed.
What is the maximum allowable PCB pad size for thermal performance?
The recommended pad layout is defined in Diodes Application Note AP02001. For optimal RθJA = 250 °C/W, use 2.0 mm × 2.0 mm copper pads per terminal with ≥10 mm² total thermal land area and at least two internal ground planes connected via ≥4 vias per pad.
Can LLSD103B-13 replace LLSD103A-13 in a 40 V circuit?
No. LLSD103B-13 has 30 V VRRM, not 40 V. Using it in a 40 V circuit risks reverse breakdown and catastrophic failure. For 40 V applications, LLSD103A-13 (40 V VRRM) or SD103AW-13 must be selected - both share identical MiniMELF packaging and thermal characteristics.
Does LLSD103B-13 require derating above 70 °C ambient?
Yes. Per Figure 3 in DS30068, VRRM derates linearly from 30 V at 25 °C to ~22 V at 100 °C ambient. At 125 °C case temperature, VRRM drops to approximately 18 V. Designers must apply voltage margin and verify worst-case blocking under actual board thermal conditions.
LLSD103B-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- DO-213AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 350mA
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 200 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 10 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 20 V
- Capacitance @ Vr, F:
- 50pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Mini MELF
- Operating Temperature - Junction:
- -55°C ~ 125°C
LLSD103B-13 FAQ
1.How can I place an order for LLSD103B-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for LLSD103B-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LLSD103B-13 reliable?
The price and inventory of LLSD103B-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LLSD103B-13 is usually 5 days.
3.What payment methods are accepted for LLSD103B-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LLSD103B-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LLSD103B-13?
LLSD103B-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LLSD103B-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LLSD103B-13?
For technical support, including LLSD103B-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LLSD103B-13 requirements.
6.How does Aetrix verify that LLSD103B-13 is sourced from the original manufacturer or authorized distributors?
All LLSD103B-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LLSD103B-13 meets industry standards.
7.What is the process for return or replacement of LLSD103B-13?
All LLSD103B-13 units undergo pre-shipment inspection (PSI). If there is an issue with LLSD103B-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LLSD103B-13 part is unused and in its original packaging.
Return procedure for LLSD103B-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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