Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Diodes Incorporated LLSD103C-13

Name: LLSD103C-13
Brand: Diodes Incorporated
SKU: LLSD103C-13
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: LLSD103C-13

Manufacturer:: Diodes Incorporated

Category:: Single Diodes

Package:: DO-213AA

Datasheet:: LLSD103C-13.pdf

Description:: DIODE SCHOTT 20V 350MA MINI MELF

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,089

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

LLSD103C-13 from Diodes Incorporated is a surface-mount Schottky barrier diode in MiniMELF glass package, rated for 20 V DC blocking voltage, 350 mA forward current, and 10 ns reverse recovery time, with low 0.60 V forward voltage at 200 mA - used in high-efficiency DC-DC converter output rectification and low-voltage power rail clamping.

For engineers reviewing the LLSD103C-13 datasheet, LLSD103C-13 pinout, LLSD103C-13 application, or LLSD103C-13 equivalent, key selection criteria include its 20 V V_R, 0.60 V V_F @ 200 mA, 10 ns t_rr, MiniMELF glass package thermal performance (R_θJA = 250 °C/W), and RoHS-compliant Sn97.5Ag2.5 termination.

Technical Context

This Schottky diode employs guard ring construction to suppress transient-induced junction breakdown and supports fast switching in low-voltage, high-frequency power conversion stages. Its glass MiniMELF case provides hermetic sealing and UL 94V-0 flammability rating, enabling reliable operation from –55 °C to +125 °C junction temperature.

The device delivers 0.37 V typical forward voltage at 20 mA and maintains ≤5.0 µA peak reverse current at 10 V reverse bias. Total capacitance is 50 pF at 0 V, supporting stable high-speed switching behavior in compact layouts without parasitic resonance concerns.

Key Specifications

Parameter	Value and Actual Design Meaning
V_R (DC Blocking)	20 V - defines maximum steady-state reverse bias before conduction in clamp or freewheeling paths
I_F (Continuous)	350 mA - sustainable forward current under FR-4 board thermal conditions with recommended pad layout
V_F @ 200 mA	0.60 V max - limits conduction loss and self-heating in 3.3 V/5 V output rectifiers
t_rr	10 ns - enables use in >1 MHz switching converters without tail-current losses
R_θJA	250 °C/W - quantifies thermal resistance from junction to ambient on standard FR-4, guiding heatsinking decisions
C_T @ 0 V	50 pF - impacts high-frequency noise coupling and snubber design in flyback or buck topologies

Pinout & Package

MiniMELF glass package (3.3–3.7 mm length × 1.3–1.6 mm diameter) with axial cathode band marking; no discrete pins - two terminals: anode and cathode, identified by single black band indicating cathode end.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry point	Connected to higher-potential node (e.g., switch node in buck, transformer secondary in flyback)
Cathode	Forward current exit / reverse-blocking terminal	Marked with black band; ties to output rail or ground return path in rectifier/clamp configurations

Key Features

Feature	Design Value
Low forward voltage	0.60 V max @ 200 mA reduces conduction loss by ~30% vs. comparable silicon diodes in 3.3 V systems
Guard ring construction	Suppresses edge leakage and improves ESD/transient robustness without external TVS in low-energy clamping
Fast reverse recovery	10 ns t_rr minimizes switching loss and prevents cross-conduction in synchronous rectifier auxiliary paths
MiniMELF glass package	Hermetic seal and 94V-0 rating support reliability in humid, high-temp industrial environments

Applications

DC-DC Converter Output Rectification

Low-Voltage Rail Clamp Protection

Use Scenario: Used as secondary-side rectifier in non-isolated buck converters supplying 1.8–3.3 V to microcontrollers or FPGAs.

IC Role / Device Role / Timing Role: Uncontrolled rectifier conducting during low-side switch off-time; no timing control required.

Use Value: 0.60 V V_F at 200 mA cuts conduction loss by 0.12 W vs. 0.85 V silicon diode, improving efficiency by ~2.5% at 1 A load.

Use Scenario: Placed across 3.3 V I/O lines to clamp ESD transients and prevent overvoltage damage to logic inputs.

IC Role / Device Role / Timing Role: Passive voltage clamp activated only during >3.3 V excursions; responds within nanoseconds.

Use Value: 20 V V_R margin allows safe clamping of ±8 kV HBM ESD events while maintaining <5 µA leakage at nominal rail voltage.

High-Frequency Flyback Snubber

USB Power Path Isolation

Use Scenario: Integrated into RCD snubber networks on primary-side MOSFETs in 500 kHz–1 MHz flyback adapters.

IC Role / Device Role / Timing Role: Fast-recovery freewheeling path for snubber capacitor discharge; critical for t_rr-limited loss reduction.

Use Value: 10 ns t_rr ensures full discharge before next switching cycle, reducing snubber dissipation by up to 40% vs. 50 ns alternatives.

Use Scenario: Positioned between USB VBUS and portable device battery charger IC to block reverse current during adapter disconnect.

IC Role / Device Role / Timing Role: Unidirectional isolation diode preventing backfeed from battery to dead VBUS line.

Use Value: 350 mA I_F rating supports 500 mA USB 2.0 charging paths with 200 mV headroom at full load, avoiding thermal derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SD103CW-7	Same MiniMELF package, 20 V V_R, but 0.45 V typ V_F @ 200 mA (vs. 0.60 V max for LLSD103C)	Lower conduction loss suits higher-efficiency 3.3 V rails; same thermal profile and footprint	Select SD103CW-7 when optimizing for minimum V_F in thermally constrained space
BAT54C-7-F	SOT-23 package, 30 V V_R, 0.33 V typ V_F @ 100 mA, but 200 mA I_F rating (vs. 350 mA)	Surface-mount compatible but lower current capacity; requires PCB redesign for footprint	Choose BAT54C-7-F only if SOT-23 layout exists and 200 mA suffices

Compared with LLSD103C-13, SD103CW-7 offers lower typical forward voltage in identical packaging for improved efficiency, while BAT54C-7-F trades higher V_R and smaller size for reduced current rating and incompatible footprint - making LLSD103C-13 optimal for legacy MiniMELF designs requiring 350 mA and proven thermal reliability.

Availability

LLSD103C-13 is available at Aetrix Electronics and suitable for DC-DC converter output rectification, low-voltage rail clamp protection, and high-frequency flyback snubber circuits requiring stable component supply and long-term industrial availability.

Supply support for LLSD103C-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The LLSD103x series belongs to Diodes' general-purpose Schottky diode product line, engineered for cost-sensitive, high-volume power management in consumer, computing, and industrial power supplies where low V_F, fast t_rr, and MiniMELF reliability are prioritized.

FAQ

Is LLSD103C-13 lead-free and RoHS compliant?

Yes. LLSD103C-13 features a Sn97.5Ag2.5 lead-free termination and complies with EU Directive 2002/95/EC (RoHS), including applicable exemptions for glass and high-temperature solder per Annex Notes 5 and 7. It meets J-STD-020C moisture sensitivity Level 1.

What is the maximum junction temperature and how is it achieved?

The absolute maximum junction temperature is +125 °C. This rating assumes mounting on an FR-4 PCB using Diodes Incorporated's recommended pad layout (document AP02001.pdf), which achieves the specified R_θJA of 250 °C/W. Exceeding recommended trace width or copper area reduces thermal margin.

Can LLSD103C-13 replace LLSD103A-13 or LLSD103B-13 in existing designs?

Yes, with voltage derating consideration. LLSD103C-13 has 20 V V_R, versus 40 V for LLSD103A-13 and 30 V for LLSD103B-13. Substitution is valid only if the circuit's peak reverse voltage remains ≤20 V; otherwise, overvoltage stress may cause premature failure.

Why is LLSD103C-13 marked "NOT RECOMMENDED FOR NEW DESIGNS"?

Diodes Incorporated recommends SD103AW–SD103CW as successors due to improved forward voltage consistency and tighter process control. LLSD103C-13 remains fully qualified and supported for legacy production, but new designs should use the SD103Cx series for better V_F distribution and long-term supply assurance.

LLSD103C-13 Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: DO-213AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Technology:: Schottky

Voltage - DC Reverse (Vr) (Max):: 20 V

Current - Average Rectified (Io):: 350mA

Voltage - Forward (Vf) (Max) @ If:: 600 mV @ 200 mA

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: 10 ns

Current - Reverse Leakage @ Vr:: 5 µA @ 10 V

Capacitance @ Vr, F:: 50pF @ 0V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: Mini MELF

Operating Temperature - Junction:: -

LLSD103C-13 FAQ

1.How can I place an order for LLSD103C-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for LLSD103C-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LLSD103C-13 reliable?

The price and inventory of LLSD103C-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LLSD103C-13 is usually 5 days.

3.What payment methods are accepted for LLSD103C-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LLSD103C-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LLSD103C-13?

LLSD103C-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LLSD103C-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LLSD103C-13?

For technical support, including LLSD103C-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LLSD103C-13 requirements.

6.How does Aetrix verify that LLSD103C-13 is sourced from the original manufacturer or authorized distributors?

All LLSD103C-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LLSD103C-13 meets industry standards.

7.What is the process for return or replacement of LLSD103C-13?

All LLSD103C-13 units undergo pre-shipment inspection (PSI). If there is an issue with LLSD103C-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LLSD103C-13 part is unused and in its original packaging.

Return procedure for LLSD103C-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…