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Texas Instruments LM10507TME-A/NOPB
- Part No.:
- LM10507TME-A/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 34-WFBGA, DSBGA
- Datasheet:
-
LM10507TME-A/NOPB.pdf
- Description:
- IC BUCK PMU TRPL + LDO 34DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,700
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Product details
Overview
LM10507TME-A/NOPB from Texas Instruments is a triple-buck + LDO power management unit (PMU) for ASIC/SoC supply in solid-state drives and flash storage systems. It integrates three synchronous buck regulators (Buck1: 1.6A, 0.9–3.4V; Buck2: 1A, 0.9–3.4V; Buck3: 1A, 0.865–1.5V) and one 2.5V/250mA LDO, all controlled via SPI interface with 2MHz switching frequency and ±3% feedback accuracy.
For engineers reviewing the LM10507TME-A/NOPB datasheet, LM10507TME-A/NOPB pinout, LM10507TME-A/NOPB application, or LM10507TME-A/NOPB equivalent, key selection considerations include programmable rail sequencing, phase-shifted buck operation to reduce input ripple, fast 3.5ms PWR_OK assertion, hardware ENABLE/PWR_OK signaling, and DSBGA-34 (2.82 × 2.82 mm) packaging for high-density SSD layouts.
Technical Context
The LM10507TME-A/NOPB implements voltage-mode control with synchronous rectification across all three bucks, operating at 1.75–2.3 MHz with internal compensation optimized for 2.2 µH inductors and 10–100 µF ceramic output capacitors. Each buck features independent enable, feedback, switch-node, and input-voltage pins, with phase-shifted 120° timing to minimize input current ripple.
It integrates an SPI-configurable comparator block, automatic soft-start (0.1–0.5 ms), undervoltage/overvoltage lockout (UVLO: 2.5–2.95 V rising; OVLO: 5.7–5.9 V rising), thermal shutdown (140°C trip), and PFM mode for light-load efficiency. The 2.5V LDO provides low-noise (35–65 µVRMS), high-PSRR (40–45 dB) auxiliary power with 200–260 mV dropout at 250 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck1 Output Current | 1.6 A continuous - supports core logic or memory I/O rails requiring high-current, low-voltage regulation |
| Buck3 Output Range | 0.865–1.5 V - targets modern low-voltage SoC cores (e.g., ARM Cortex-A series) with tight tolerance |
| Switching Frequency | 2 MHz typical - enables compact 2.2 µH inductors and reduces EMI compared to sub-1 MHz PMUs |
| LDO Output | 2.5 V ±3%, 250 mA - supplies noise-sensitive analog/IO circuitry with 40–45 dB PSRR up to 10 kHz |
| Feedback Accuracy | ±3% - ensures stable voltage regulation under load transients and temperature variation (−30°C to +125°C) |
| SPI Interface Speed | Up to 10 MHz - allows rapid rail reconfiguration during dynamic voltage/frequency scaling (DVFS) |
| Package | DSBGA-34, 2.82 × 2.82 mm, 0.4 mm pitch - matches fine-pitch BGA SoC footprints in ultra-thin SSD modules |
Pinout & Package
LM10507TME-A/NOPB uses a 34-bump DSBGA package (2.82 mm × 2.82 mm, 0.4 mm pitch) with exposed thermal pad (GND-connected). Pin functions are validated per TI SNVS999 datasheet Rev. May 2014.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN_B1, VIN_B2, VIN_B3 | Buck input supply pins | Accept 3.0–5.5 V input per regulator; tie unused VIN_Bx to GND to minimize leakage |
| SW_B1, SW_B2, SW_B3 | Buck switch-node outputs | Connect directly to external inductors; require low-ESR ceramic caps and tight layout for EMI control |
| FB_B1, FB_B2, FB_B3 | Output voltage feedback inputs | Resistor-divider inputs for precise programmable regulation; bias current ≤5 µA enables high-R dividers |
| ENABLE, DEVSLP, RESET | Digital control inputs | Active-high ENABLE with internal pull-down; active-high DEVSLP for sleep entry; active-low RESET with internal pull-up |
| PWR_OK | Power-good status output | Open-drain digital flag asserting when all four rails (Buck1–3 + LDO) reach 95% of target within 3.5 ms |
| SPI_CS, SPI_DI, SPI_DO, SPI_CLK | SPI interface signals | 4-wire interface for real-time rail configuration, sequencing control, and fault register readback |
| LDO | LDO output | 2.5 V regulated output; requires 4.7 µF ceramic capacitor (CLDO) for stability and transient response |
Key Features
| Feature | Design Value |
|---|---|
| Phase-shifted triple-buck architecture | 120° inter-buck phase offset reduces peak input current by ~40% and cuts required input capacitance |
| Hardware PWR_OK with fast startup | Asserts within 3.5 ms of ENABLE - enables deterministic boot timing for SSD controllers and NAND interfaces |
| Integrated soft-start and protection | Internal 0.1–0.5 ms soft-start prevents inrush; UVLO/OVLO, thermal shutdown, and current limiting ensure robustness |
| PFM/PWM dual-mode operation | Automatic transition to PFM below ~100 mA load - maintains >85% efficiency down to µA-level standby currents |
| SPI-programmable comparator block | Configurable threshold monitoring with interrupt output - supports custom fault detection beyond standard rail monitoring |
Applications
| Solid-State Drive (SSD) Power Management | NAND Flash Controller Supply |
|---|---|
Use Scenario: Powering multi-rail SSD controller SoCs (e.g., Marvell 88SS, Phison E18) with dynamic voltage scaling during read/write/erase cycles. IC Role / Device Role / Timing Role: PMU providing three independently programmable buck outputs (core, I/O, cache) plus LDO for PHY reference, sequenced via SPI during state transitions. Use Value: Enables 20% lower system power vs fixed-output PMUs through adaptive rail tuning, while maintaining <10 µs transient response for NAND command latency. |
Use Scenario: Supplying NAND flash interface (1.2V/1.8V I/O), controller core (0.85–1.1V), and buffer SRAM (1.2V) in embedded eMMC/UFS modules. IC Role / Device Role / Timing Role: Centralized voltage source with hardware PWR_OK coordination between NAND die and host controller during power-up/reset. Use Value: Eliminates discrete LDOs and sequencing ICs - reduces BOM count by 4 components and PCB area by 22 mm² in 11.5 × 13 mm SSD modules. |
| ASIC-Based Storage Accelerator | Low-Power Embedded Flash Subsystem |
Use Scenario: Powering FPGA-based storage accelerators (e.g., Xilinx Kria KV260) with real-time rail reconfiguration during workload shifts (compression → encryption → deduplication). IC Role / Device Role / Timing Role: SPI-controlled PMU delivering 0.9V core, 1.2V transceiver, and 3.3V interface rails with <50 µs reprogramming latency. Use Value: Supports DVFS-driven power savings up to 35% in burst-mode workloads without firmware intervention or external sequencers. |
Use Scenario: Supplying microcontroller + serial NOR/Quad-SPI flash in industrial logging devices requiring 10-year battery life and cold-temperature operation. IC Role / Device Role / Timing Role: Ultra-low-quiescent (50 µA standby) PMU with PFM mode and thermal-aware shutdown for unattended field deployment. Use Value: Extends coin-cell battery life to >120 months at −30°C ambient by minimizing no-load losses and enabling deep-sleep rail shutdown via DEVSLP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail PMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65023RGZR | Triple buck + dual LDO; 2.25–6.5 V input; no SPI programmability; fixed 1.2/1.5/1.8/2.8/3.3 V outputs | Targeted at OMAP/ARM9 platforms; lacks rail reconfiguration and phase-shifting for SSD input ripple reduction | Choose for cost-sensitive, fixed-rail applications where SPI control and adaptive sequencing are unnecessary |
| ISL95210IRZ | Dual buck + dual LDO; 3–24 V input; SMBus interface; supports Intel VR12.5/VR12.6 protocols | Designed for notebook CPU/GPU VRMs; incompatible pinout and sequencing logic for SSD ASIC use cases | Choose only for x86 platform designs requiring IMVP-6/7 compliance; not suitable as drop-in replacement |
Compared with TPS65023RGZR and ISL95210IRZ, LM10507TME-A/NOPB uniquely combines SPI-based rail programmability, 120° phase-shifted bucks for minimized input capacitance, and SSD-optimized fast PWR_OK - making it the only option supporting dynamic voltage scaling in NAND-based storage SoCs.
Availability
LM10507TME-A/NOPB is available at Aetrix Electronics and suitable for solid-state drives, NAND flash controllers, and ASIC-based storage accelerators requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for LM10507TME-A/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability power solutions.
The LM10507TME-A/NOPB belongs to TI's high-efficiency PMU product line, engineered specifically for space-constrained, thermally demanding storage applications requiring multi-rail programmability, fast sequencing, and SPI-based system-level power orchestration.
FAQ
What is the maximum supported SPI clock frequency for LM10507TME-A/NOPB?
The LM10507TME-A/NOPB supports SPI clock frequencies up to 10 MHz, enabling rapid register writes for dynamic voltage scaling and real-time rail reconfiguration. This speed ensures sub-50 µs latency for full rail updates, critical for SSD workload adaptation. All SPI transactions must comply with CPOL = 0 and CPHA = 0 timing. The LM10507TME-A/NOPB does not support daisy-chaining or multi-drop configurations.
Does LM10507TME-A/NOPB support independent enable/disable of each buck regulator?
Yes, LM10507TME-A/NOPB allows individual enable/disable of Buck1, Buck2, and Buck3 via dedicated SPI registers - no hardware pin per rail is required. Each buck can be powered down independently while others remain active, enabling selective rail shutdown during low-power states. The LDO remains always-on unless disabled via SPI. This capability is confirmed in Section 8.5 (Programming) of the SNVS999 datasheet.
What is the thermal resistance (θJA) of LM10507TME-A/NOPB in a standard 4-layer PCB layout?
The LM10507TME-A/NOPB has a junction-to-ambient thermal resistance (θJA) of 44.5°C/W under standard JEDEC 51-7 4-layer board conditions (1-inch² copper, 2 oz, 2 internal layers). This value assumes proper thermal via placement beneath the exposed pad and adherence to TI's layout guidelines in Section 11. TI recommends ≥8 thermal vias (0.3 mm diameter) connecting the GND pad to inner ground planes. Exceeding 0.9 W total dissipation requires ambient derating per Equation TA-MAX = 125°C – (44.5 × PD).
Can LM10507TME-A/NOPB operate with input voltage below 3.0 V?
No, LM10507TME-A/NOPB requires VIN ≥ 3.0 V per Recommended Operating Conditions (Section 7.3). Below this, UVLO activates and disables all regulators. While absolute maximum rating allows VIN down to −0.3 V, functional operation is not guaranteed below 3.0 V. Buck operation further requires VIN ≥ VOUT + 1.0 V (e.g., 1.5 V output needs ≥2.5 V input), but system-level reliability mandates staying within 3.0–5.5 V range. The LM10507TME-A/NOPB does not support battery-backed or single-cell Li-ion direct input.
How does the phase-shifted operation of LM10507TME-A/NOPB reduce input capacitance requirements?
By operating Buck1, Buck2, and Buck3 with 120° phase offsets, LM10507TME-A/NOPB staggers their switching current peaks, reducing RMS and peak input current ripple by ~40% versus in-phase operation. This allows designers to use smaller total input capacitance - typically 3 × 4.7 µF instead of a single 22 µF bulk cap - saving PCB area and cost while improving reliability. The effect is verified in Figure 12 (Input Current Ripple) of the SNVS999 datasheet.
LM10507TME-A/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 34-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Applications:
- Solid State Drives (SSD)
- Current - Supply:
- 50µA
- Voltage - Supply:
- 3V ~ 5.5V
- Operating Temperature:
- -30°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 34-DSBGA
LM10507TME-A/NOPB FAQ
1.How can I place an order for LM10507TME-A/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM10507TME-A/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM10507TME-A/NOPB reliable?
The price and inventory of LM10507TME-A/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM10507TME-A/NOPB is usually 5 days.
3.What payment methods are accepted for LM10507TME-A/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM10507TME-A/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM10507TME-A/NOPB?
LM10507TME-A/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM10507TME-A/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM10507TME-A/NOPB?
For technical support, including LM10507TME-A/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM10507TME-A/NOPB requirements.
6.How does Aetrix verify that LM10507TME-A/NOPB is sourced from the original manufacturer or authorized distributors?
All LM10507TME-A/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM10507TME-A/NOPB meets industry standards.
7.What is the process for return or replacement of LM10507TME-A/NOPB?
All LM10507TME-A/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM10507TME-A/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM10507TME-A/NOPB part is unused and in its original packaging.
Return procedure for LM10507TME-A/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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