Texas Instruments LM10507TMX-A/NOPB

Overview

LM10507TMX-A/NOPB from Texas Instruments is a triple-buck + LDO power management unit (PMU) for ASIC/SoC systems, integrating three synchronous buck regulators (Buck1: 1.6A, 0.9–3.4V; Buck2: 1A, 0.9–3.4V; Buck3: 1A, 0.865–1.5V) and one 2.5V/250mA LDO in a single 2.82 mm × 2.82 mm DSBGA-34 package. It delivers four regulated rails with ±3% feedback accuracy, 2 MHz switching frequency, and SPI-programmable voltage control - optimized for solid-state drives and flash memory controllers.

For engineers reviewing the LM10507TMX-A/NOPB datasheet, LM10507TMX-A/NOPB pinout, LM10507TMX-A/NOPB application, or LM10507TMX-A/NOPB equivalent, key selection considerations include phase-shifted 120° buck operation for reduced input ripple, hardware ENABLE/PWR_OK signaling, fast 3.5 ms startup to PWR_OK, programmable PFM/PWM mode, and integrated thermal/overcurrent protection.

Technical Context

The LM10507TMX-A/NOPB implements voltage-mode control with synchronous rectification across all three bucks, enabling high efficiency (up to 95%) and stable operation with recommended 2.2 µH inductors and 10–100 µF ceramic output capacitors. Its 2 MHz fixed-frequency PWM supports compact filter design and low output ripple.

Phase interleaving (120° offset) among Buck1–Buck3 reduces input current ripple and minimizes required input capacitance. The device integrates an SPI-configurable comparator block, hardware reset (active-low), DEVSLP sleep control, and automatic soft-start with power-on reset - all coordinated via internal sequencer logic without external timing components.

Key Specifications

Pinout & Package

LM10507TMX-A/NOPB uses a 34-bump DSBGA package (2.82 mm × 2.82 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are defined per TI SNVS999 datasheet Rev. May 2014.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-rail PMU applications.

Compared with TPS65270RGET and ISL95210IRZ, LM10507TMX-A/NOPB uniquely combines SPI-based dynamic voltage scaling, integrated 2.5 V LDO, and phase-interleaved triple-buck architecture in a sub-3 mm² package - making it optimal for compact, programmable SSD power solutions where rail coordination and fast startup are mandatory.

Availability

LM10507TMX-A/NOPB is available at Aetrix Electronics and suitable for solid-state drive controllers, flash memory modules, embedded storage ASICs, and industrial data logger designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for LM10507TMX-A/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion and system-level power architecture.

The LM10507TMX-A/NOPB belongs to TI's precision PMU product line, engineered specifically for high-density, low-power storage applications requiring multi-rail coordination, programmable sequencing, and robust protection in constrained form factors.

FAQ

What is the maximum supported SPI clock frequency for configuring the LM10507TMX-A/NOPB?

The LM10507TMX-A/NOPB supports SPI communication up to 10 MHz, as specified in the General Electrical Characteristics table of the SNVS999 datasheet. This allows rapid register writes for dynamic voltage scaling during operational mode transitions. All SPI transactions must respect setup/hold timing relative to VIN_IO, and the interface remains functional across the full 1.75–3.6 V VIN_IO range. The LM10507TMX-A/NOPB does not require external level-shifting when interfacing with 1.8 V or 3.3 V ASIC controllers.

Does the LM10507TMX-A/NOPB support independent enable/disable control of each buck regulator?

Yes, the LM10507TMX-A/NOPB allows individual buck regulator enable/disable via SPI register configuration - Buck1, Buck2, and Buck3 can be powered independently while maintaining LDO operation. Hardware ENABLE pin controls overall device activation but does not override per-rail SPI settings. Each buck retains its programmed output voltage and soft-start behavior upon re-enable. This capability is essential for power gating in SSD firmware-defined low-power states. The LM10507TMX-A/NOPB datasheet confirms this functionality in Section 8.5 (Programming) and Register Map Table 11.

What is the minimum input voltage required for the LM10507TMX-A/NOPB to regulate Buck3 at 1.5 V?

The LM10507TMX-A/NOPB requires VIN ≥ VOUT + 1.0 V for stable buck operation, per Section 7.6 footnote (3) of the datasheet. To regulate Buck3 at its maximum 1.5 V output, the minimum valid input is 2.5 V. However, the recommended operating condition specifies VIN_B3 ≥ 3.0 V, and absolute maximum ratings limit VIN to ≤5.5 V. Operation below 3.0 V may compromise regulation margin, transient response, and efficiency. The LM10507TMX-A/NOPB maintains regulation down to 2.5 V input only if VOUT ≤ 1.5 V and load is light; full 1 A capability requires ≥3.0 V input.

How does the LM10507TMX-A/NOPB handle power-good sequencing across its four outputs?

The LM10507TMX-A/NOPB asserts the open-drain PWR_OK signal only after all three buck regulators and the LDO have reached ≥95% of their target voltages and remain stable for a built-in delay. Sequencing order is fixed: Buck1 → Buck2 → Buck3 → LDO, with internal soft-start timers ensuring monotonic rise. No external sequencing IC is needed. The PWR_OK pulse width exceeds 100 µs, compatible with standard FPGA/CPU power-good inputs. This behavior is verified in Figure 4 (POK Plot) and Section 8.4.3 of the LM10507TMX-A/NOPB datasheet.

Can the LM10507TMX-A/NOPB operate with ceramic output capacitors only, or are electrolytic types required?

The LM10507TMX-A/NOPB is fully characterized and specified for use with low-ESR multilayer ceramic capacitors (MLCCs) only - no electrolytic or tantalum capacitors are required or recommended. The datasheet explicitly states "Capacitors: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics" in footnotes across Sections 7.5–7.9. Typical designs use 10–100 µF X5R/X7R MLCCs for buck outputs and 4.7 µF for the LDO. Using non-ceramic capacitors risks instability, poor transient response, and failure to meet ±3% regulation spec. The LM10507TMX-A/NOPB's internal compensation is optimized exclusively for ceramic-based output networks.