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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

Texas Instruments LM3243TMX/NOPB

Name: LM3243TMX/NOPB
Brand: Texas Instruments
SKU: LM3243TMX/NOPB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: LM3243TMX/NOPB

Manufacturer:: Texas Instruments

Category:: Power Management - Specialized

Package:: 16-WFBGA, DSBGA

Datasheet:: LM3243TMX/NOPB.pdf

Description:: IC ADJ BUCK RF PWR AMP 16DSBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

LM3243TMX/NOPB from Texas Instruments is a high-current, dynamically adjustable step-down DC-DC converter optimized for powering 2G/3G/4G RF power amplifiers (PAs) from a single Li-ion cell (2.7 V–5.5 V). It delivers up to 2.5 A output current with 0.4 V–3.6 V programmable output voltage via analog VCON control, integrated Active Current Assist and Analog Bypass (ACB), and 2.7 MHz PWM switching-enabling compact, efficient PA supply in cellular handsets.

For engineers reviewing the LM3243TMX/NOPB datasheet, LM3243TMX/NOPB pinout, LM3243TMX/NOPB application, or LM3243TMX/NOPB equivalent, key selection criteria include its ACB-enabled 1.4 A max inductor current limit, 45 mΩ typical bypass dropout resistance, PFM/PWM mode auto-transitioning, DSBGA-16 package footprint (2.049 mm × 2.049 mm), and system-level transient response compliance with 3GPP time mask requirements.

Technical Context

The LM3243TMX/NOPB implements a synchronous buck architecture with dual-mode operation: fixed-frequency 2.7 MHz PWM (MODE = LOW) for GMSK/EDGE spectral compliance and automatic PFM-to-PWM transition (MODE = HIGH) for 3G/4G efficiency optimization. Its ACB circuit provides parallel current assist above 1.4 A (typical), reducing peak inductor current while maintaining regulation across full battery and PA load ranges.

Control is analog-dynamic via VCON (2.5× gain), enabling real-time PA supply voltage adjustment to match transmit power level-reducing PA power dissipation and extending battery life. Bypass mode (BP = HIGH or VCON > VIN/2.5) engages low-dropout analog regulation (45 mΩ R_{tot_drop}) without switching, supporting seamless transition into full 100% duty-cycle operation near dropout.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.7 V to 5.5 V - supports full discharge curve of single Li-ion cell without external pre-regulation.
Output Voltage Range	0.4 V to 3.6 V (typical) - dynamically set by VCON analog input (VOUT = 2.5 × VCON), enabling PA supply voltage scaling.
Max Output Current	2.5 A - delivered via combined switcher + ACB path; inductor current limited to 1.45 A (typical) to minimize size.
Switching Frequency	2.7 MHz (average, PWM mode) - enables use of ultra-small 1.5 µH inductor and 0402/0201 capacitors.
Bypass Dropout Resistance	45 mΩ (typical) - ensures <115 mV dropout at 2.5 A, critical for maintaining PA linearity near battery EOD.
Quiescent Current	260 µA (PFM mode), 975 µA (PWM mode) - directly impacts standby and low-power transmit efficiency.
Protection Features	Current limit (1.45 A steady-state PFET, −1.5 A NFET), thermal shutdown (150°C), and shutdown current ≤4 µA - ensures robust PA supply under fault conditions.

Pinout & Package

LM3243TMX/NOPB is housed in a 16-pin DSBGA package (2.049 mm × 2.049 mm, 0.4 mm pitch), optimized for ultra-compact mobile RF front-end layouts. The bottom-side ball map supports high-current PGND/SGND/BGND separation and thermal dissipation through exposed substrate.

Pin/Terminal	Circuit Role	Design Meaning
PGND	Power ground	Return path for internal PFET/NFET switch currents; must be low-inductance connection to input/output capacitor ground plane.
SGND	Signal ground	Analog and control reference for VCON, FB, EN, MODE, BP; isolated from PGND to prevent noise coupling into feedback loop.
VDD	Analog supply	Powers internal error amplifier, comparators, and logic; requires local 1.0 µF decoupling to SGND.
SW	Switch node	Connection to external inductor; carries high di/dt switching current-requires short, wide trace to minimize EMI and voltage spikes.
EN	Enable control	Digital input (VIH = 1.2 V) with 800 kΩ pulldown; must be held LOW during power-up until PVIN ≥2.7 V to prevent UVLO-related instability.
VCON	Voltage control input	Analog input (0.16 V–1.44 V) setting VOUT = 2.5 × VCON; drives PA envelope tracking or discrete power level selection.
PVIN	Power input	Main input supply (2.7 V–5.5 V) to PFET switch and ACB circuit; requires 10 µF ceramic input capacitor to PGND.
BP	Bypass mode select	Digital input (VIH = 1.2 V); LOW enables automatic ACB-assisted analog bypass, HIGH forces full bypass regardless of load or VCON.
MODE	Operating mode select	Digital input (VIH = 1.2 V); HIGH enables PFM/PWM auto-transition, LOW locks into PWM-only for spectral-critical 2G transmission.
ACB	Analog current bypass output	High-current output connected to VOUT filter capacitor; provides parallel current path when switcher reaches 1.45 A limit.
BGND	ACB ground	Dedicated return for ACB current; must be routed separately from PGND/SGND and tied to output capacitor ground.
FB	Feedback input	Connects to VOUT at output capacitor; sets regulation point via internal 0.4 V reference-no external resistor divider needed.

Key Features

Feature	Design Value
Active Current Assist + Analog Bypass (ACB)	Enables 2.5 A total output while limiting inductor current to 1.45 A (typical), reducing solution size by >30% vs. conventional buck converters.
Dynamically Adjustable Output (0.4 V–3.6 V)	VCON-controlled output allows real-time PA supply scaling-cutting PA power loss by up to 40% during low-power transmission slots.
2.7 MHz Fixed-Frequency PWM Mode	Ensures predictable EMI profile and minimal output ripple (<3 mVpp) for GMSK/EDGE spectral mask compliance without added filtering.
Automatic PFM/PWM Transition	Switches to PFM below ~95 mA load, reducing I_q from 975 µA to 260 µA-extending talk time in 3G/4G idle and low-duty-cycle modes.
Low-Dropout Analog Bypass (45 mΩ)	Maintains regulated VOUT down to battery voltages as low as 3.1 V at 2.5 A, preserving PA linearity and ACLR performance near end-of-discharge.

Applications

Cellular Handset PA Supply	Multi-Mode RF Transceiver Power
Use Scenario: Powering 2G/3G/4G RF power amplifiers in smartphones and feature phones operating from a single Li-ion cell (3.0–4.2 V). IC Role / Device Role / Timing Role: Primary dynamic PA supply rail generator with VCON-driven envelope tracking and ACB-assisted transient current delivery. Use Value: Enables 3GPP-compliant PA operation across full battery range while reducing total solution footprint by eliminating need for oversized inductors or secondary LDOs.	Use Scenario: Providing programmable bias voltage to multi-band RF transceivers (e.g., BB/RFIC combos) requiring rapid VOUT adjustment between frequency bands. IC Role / Device Role / Timing Role: Fast-settling, low-noise programmable supply with <50 µs VOUT rise/fall time (per tRESPONSE spec) and <40 mVpk load transient response. Use Value: Supports seamless band switching without PA desense or TX leakage-critical for LTE carrier aggregation and NR dual-connectivity architectures.
Battery-Powered Portable Radio	RF PC Card / USB Dongle PA
Use Scenario: Supplying Class AB/Class E PAs in handheld two-way radios where battery life and thermal constraints limit continuous power draw. IC Role / Device Role / Timing Role: High-efficiency, thermally robust PA supply with built-in thermal shutdown (150°C) and current limiting to protect against antenna mismatch faults. Use Value: Delivers 2.5 A peak current with only 50°C/W junction-to-ambient thermal resistance-enabling fanless, sealed enclosure designs.	Use Scenario: Powering compact SMT PAs in miniaturized RF modules (e.g., LTE USB modems, WiMAX CPE) with strict PCB area budgets. IC Role / Device Role / Timing Role: Ultra-small-footprint (2.05 mm²) DSBGA DC-DC solution supporting 2.7–5.5 V input and 0.4–3.6 V output with no external compensation components. Use Value: Eliminates need for discrete FET + controller + compensation network-reducing BOM count by 7+ components and layout area by >65%.

Cellular Handset PA Supply

Multi-Mode RF Transceiver Power

Use Scenario: Powering 2G/3G/4G RF power amplifiers in smartphones and feature phones operating from a single Li-ion cell (3.0–4.2 V).

IC Role / Device Role / Timing Role: Primary dynamic PA supply rail generator with VCON-driven envelope tracking and ACB-assisted transient current delivery.

Use Value: Enables 3GPP-compliant PA operation across full battery range while reducing total solution footprint by eliminating need for oversized inductors or secondary LDOs.

Use Scenario: Providing programmable bias voltage to multi-band RF transceivers (e.g., BB/RFIC combos) requiring rapid VOUT adjustment between frequency bands.

IC Role / Device Role / Timing Role: Fast-settling, low-noise programmable supply with <50 µs VOUT rise/fall time (per tRESPONSE spec) and <40 mVpk load transient response.

Use Value: Supports seamless band switching without PA desense or TX leakage-critical for LTE carrier aggregation and NR dual-connectivity architectures.

Battery-Powered Portable Radio

RF PC Card / USB Dongle PA

Use Scenario: Supplying Class AB/Class E PAs in handheld two-way radios where battery life and thermal constraints limit continuous power draw.

IC Role / Device Role / Timing Role: High-efficiency, thermally robust PA supply with built-in thermal shutdown (150°C) and current limiting to protect against antenna mismatch faults.

Use Value: Delivers 2.5 A peak current with only 50°C/W junction-to-ambient thermal resistance-enabling fanless, sealed enclosure designs.

Use Scenario: Powering compact SMT PAs in miniaturized RF modules (e.g., LTE USB modems, WiMAX CPE) with strict PCB area budgets.

IC Role / Device Role / Timing Role: Ultra-small-footprint (2.05 mm²) DSBGA DC-DC solution supporting 2.7–5.5 V input and 0.4–3.6 V output with no external compensation components.

Use Value: Eliminates need for discrete FET + controller + compensation network-reducing BOM count by 7+ components and layout area by >65%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF PA supply applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS62260DRVR	Fixed-output (1.2 V, 1.5 V, 1.8 V) or resistor-programmable; no VCON analog control, no ACB, 2.25 MHz switching.	Lacks dynamic PA voltage scaling and ACB current assist-requires larger inductor for 2.5 A loads and cannot meet 3GPP transient specs without external circuitry.	Select only for fixed-voltage PA rails where envelope tracking is unnecessary and board space permits larger magnetics.
MAX8646ETE+	3 MHz switching, 2.5 A max, but uses digital I²C interface for output programming; no analog VCON, no integrated ACB path.	Requires microcontroller I/O and firmware overhead for PA voltage updates; slower than analog VCON for fast envelope tracking; higher solution cost.	Prefer when system already includes I²C infrastructure and precise digital control outweighs analog simplicity and transient speed.

Compared with TPS62260DRVR and MAX8646ETE+, the LM3243TMX/NOPB uniquely integrates analog VCON control and ACB to deliver 2.5 A with sub-1.5 A inductor current-making it the only option capable of meeting 3GPP-compliant PA supply requirements in space-constrained mobile designs without external assist circuitry.

Availability

LM3243TMX/NOPB is available at Aetrix Electronics and suitable for cellular handset design, portable radio development, and RF module integration requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for LM3243TMX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in mobile power solutions and RF infrastructure.

The LM3243TMX/NOPB belongs to TI's RF Power Amplifier Power Management product line, engineered specifically to replace discrete buck + LDO + bypass FET combinations in multi-mode cellular handsets-delivering smaller size, higher efficiency, and faster transient response.

FAQ

What is the primary function of the ACB pin on the LM3243TMX/NOPB?

The ACB (Analog Current Bypass) pin on the LM3243TMX/NOPB provides a parallel current path that activates when the internal switcher reaches its 1.45 A steady-state current limit. It delivers supplemental current directly from PVIN to VOUT through a low-R_DS(on) FET, enabling the LM3243TMX/NOPB to sustain 2.5 A total output while keeping inductor size minimal and maintaining regulation during PA transients. ACB also reduces dropout voltage and improves VCON slew rate.

How does the VCON input control output voltage in the LM3243TMX/NOPB?

The VCON input on the LM3243TMX/NOPB sets the output voltage linearly via a fixed 2.5× gain: VOUT = 2.5 × VCON. With VCON ranging from 0.16 V to 1.44 V, this yields a regulated output from 0.4 V to 3.6 V (typical). This analog interface enables real-time PA supply voltage adjustment-e.g., lowering VOUT during low-power transmission to reduce PA dissipation and extend battery life-without requiring digital communication or external DACs.

Can the LM3243TMX/NOPB operate without external compensation components?

Yes, the LM3243TMX/NOPB is internally compensated and requires no external compensation components. Its feedback loop is designed for stability with standard 1.5 µH inductors and the recommended ceramic output capacitor network (10 µF + 4.7 µF + 3 × 1 µF). This simplifies layout, reduces BOM count, and eliminates tuning effort-critical for high-volume mobile designs where design cycle time and yield are paramount.

What is the significance of the DSBGA-16 package for the LM3243TMX/NOPB in mobile applications?

The DSBGA-16 package (2.049 mm × 2.049 mm) of the LM3243TMX/NOPB delivers the smallest possible footprint for a 2.5 A RF PA supply IC, enabling placement directly adjacent to the PA die in ultra-thin smartphone PCB stacks. Its bottom-terminal ball grid allows optimal thermal conduction to inner ground planes and minimizes parasitic inductance in high-current paths-essential for meeting 3GPP spectral masks and maintaining ACLR performance under dynamic load conditions.

Does the LM3243TMX/NOPB include undervoltage lockout (UVLO), and how should EN be managed during power-up?

No, the LM3243TMX/NOPB does not include internal UVLO. Per the datasheet, the system controller must hold EN LOW until PVIN exceeds 2.7 V to prevent unstable startup. Once input voltage is valid, EN can be asserted HIGH to enable normal operation. This external control requirement avoids die area penalty while ensuring reliable turn-on behavior across the full Li-ion voltage range (3.0 V–4.2 V nominal, down to 2.7 V cutoff).

LM3243TMX/NOPB Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 16-WFBGA, DSBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Cellular

Current - Supply:: -

Voltage - Supply:: 2.7V ~ 5.5V

Operating Temperature:: -30°C ~ 90°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-DSBGA

LM3243TMX/NOPB FAQ

1.How can I place an order for LM3243TMX/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3243TMX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3243TMX/NOPB reliable?

The price and inventory of LM3243TMX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3243TMX/NOPB is usually 5 days.

3.What payment methods are accepted for LM3243TMX/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3243TMX/NOPB transactions.

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4.How is shipping managed for LM3243TMX/NOPB?

LM3243TMX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3243TMX/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3243TMX/NOPB?

For technical support, including LM3243TMX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3243TMX/NOPB requirements.

6.How does Aetrix verify that LM3243TMX/NOPB is sourced from the original manufacturer or authorized distributors?

All LM3243TMX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3243TMX/NOPB meets industry standards.

7.What is the process for return or replacement of LM3243TMX/NOPB?

All LM3243TMX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3243TMX/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3243TMX/NOPB part is unused and in its original packaging.

Return procedure for LM3243TMX/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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