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Texas Instruments LM5113SDE/NOPB

Part No.:
LM5113SDE/NOPB
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
10-WDFN Exposed Pad
Datasheet:
AetrixLM5113SDE/NOPB.pdf
Description:
IC GATE DRVR HALF-BRIDGE 10WSON
Quantity:
Payment:
Payment
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Inventory:1,277

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Product details

Overview

LM5113SDE/NOPB from Texas Instruments is a high-frequency, dual-channel GaN FET gate driver for synchronous buck and half-bridge topologies. It delivers 1.2-A peak source / 5-A peak sink current, supports up to 90-V HS voltage, features split HO/LO outputs with 0.6-Ω pulldown / 2.1-Ω pullup resistance, and achieves 28-ns typical propagation delay with 1.5-ns matching-enabling MHz-class switching in telecom rectifiers and macro RRU power stages.

For engineers reviewing the LM5113SDE/NOPB datasheet, LM5113SDE/NOPB pinout, LM5113SDE/NOPB application, or LM5113SDE/NOPB equivalent, key selection considerations include bootstrap-clamped 5.2-V HB regulation, TTL-compatible HI/LI inputs (14-V tolerant), independent turnon/turnoff strength adjustment via split outputs, and WSON-10 package thermal performance (RθJA = 37.5°C/W).

Technical Context

The LM5113SDE/NOPB integrates a level-shifted high-side driver with internal bootstrap voltage clamping at 5.2 V (±0.5 V), preventing GaN FET gate-source overvoltage during fast HS node transitions. Its dual independent TTL inputs drive split-output stages: HOH/HOL control high-side GaN turnon/turnoff separately, while LOH/LOL provide matched low-side sourcing/sinking.

Propagation delay matching of 1.5 ns (typ) between HO and LO paths ensures precise dead-time control in high-frequency synchronous converters. The device implements dual UVLO-VDD threshold at 3.8 V (200-mV hysteresis) and HB-to-HS threshold at 3.2 V-enabling robust start-up sequencing and fault-safe shutdown under supply faults.

Key Specifications

Parameter Value and Actual Design Meaning
VHS Max 90 V - Enables use with GaN FETs in 48-V input telecom and industrial DC/DC systems.
IOHL / IOLL 1.2 A / 5 A peak - Provides strong gate turnon drive and ultra-fast turnoff to suppress dv/dt-induced false triggering.
tPLH/tPHL 28 ns / 26.5 ns (typ) - Supports >1-MHz switching without timing skew limiting loop bandwidth.
Delay Matching 1.5 ns (typ) - Minimizes shoot-through risk in half-bridge configurations requiring tight dead-time control.
Rpulldown 0.6 Ω - Ensures rapid, low-impedance gate discharge critical for GaN's low Qg and high dV/dt immunity.
VHB Clamp 5.2 V (typ) - Internally limits bootstrap rail to protect enhancement-mode GaN FETs rated ≤6-V VGS,max.
VDD UVLO 3.8 V rising threshold - Prevents partial gate drive during brownout, avoiding linear-mode conduction and thermal runaway.

Pinout & Package

LM5113SDE/NOPB is packaged in a thermally enhanced 10-pin WSON (4.0 mm × 4.0 mm) with exposed pad (EP) soldered to PCB ground for improved heat dissipation (RθJC(bot) = 4.1°C/W).

Pin/Terminal Circuit Role Design Meaning
VDD 5-V gate drive supply input Local decoupling required with low-ESR/ESL capacitor; powers logic and low-side driver.
HB High-side bootstrap rail Connects to positive terminal of bootstrap capacitor; internally clamped to 5.2 V vs HS.
HOH High-side turnon output Source-current path to GaN gate; series resistor adjusts turnon speed and switch-node ringing.
HOL High-side turnoff output Sink-current path to GaN gate; low-impedance discharge prevents unintended turnon during high dv/dt.
HS High-side source reference Connects to bootstrap capacitor negative terminal and GaN source; floats up to 90 V above VSS.
HI High-side TTL input 14-V tolerant; must be tied to VDD or VSS if unused-never left floating.
LI Low-side TTL input Independent control; same voltage tolerance and tie-off requirement as HI.
LOH Low-side turnon output Source path to low-side GaN gate; complements LOL for asymmetric drive strength tuning.
LOL Low-side turnoff output Sink path to low-side GaN gate; 5-A peak capability ensures fast, reliable turnoff.
VSS Ground return All signals referenced here; EP must be connected to this ground plane for thermal and EMI performance.

Key Features

Feature Design Value
Split high-side outputs (HOH/HOL) Enables independent optimization of GaN FET turnon slew rate (via HOH + Rg,on) and turnoff immunity (via HOL + low Rg,off).
Internal HB-to-HS clamp Maintains 5.2-V bootstrap regulation without external Zener, eliminating risk of exceeding GaN VGS,max during transient HS undershoot.
TTL-compatible inputs (HI/LI) Accepts 0–14 V logic regardless of VDD level-directly interfaces with 10-V controllers like LM5025 without level-shifting buffers.
Dual UVLO with hysteresis Prevents erratic operation during brownout: VDD UVLO (3.8 V / 3.6 V) disables both outputs; HB UVLO (3.2 V / 3.0 V) disables only HOL.
Fast, matched propagation 28-ns typical delay with 1.5-ns HO/LO matching ensures precise timing control essential for MHz-class zero-voltage switching (ZVS) designs.

Applications

Merchant Telecom Rectifiers Macro Remote Radio Units (RRU)

Use Scenario: 48-V input, 12-V output, 800-kHz synchronous buck converter powering baseband processing in outdoor telecom cabinets.

IC Role / Device Role / Timing Role: Dual-channel GaN gate driver controlling high-side/low-side EPC2001 FETs; provides split outputs for optimized dv/dt control and 1.5-ns delay matching to maintain ZVS across load range.

Use Value: Enables >97% efficiency at full load by minimizing switching losses through fast, controlled GaN gate transitions and robust shoot-through prevention.

Use Scenario: High-density, air-cooled 28-V input DC/DC module supplying RF power amplifiers in 5G macro cell sites.

IC Role / Device Role / Timing Role: Half-bridge gate driver operating up to 90-V HS potential; uses internal 5.2-V HB clamp to safeguard GaN FETs during fast HS node transitions in high-dv/dt RF PA bias rails.

Use Value: Eliminates need for external bootstrap Zener, reducing BOM count and layout sensitivity while maintaining <1.5-ns HO/LO skew for stable multi-phase interleaving.

Closed-Loop Stepper Motor Drives Merchant DC/DC Converters

Use Scenario: 24-V input, 5-V/3.3-V dual-output buck converter for microstepping controller ICs and position feedback sensors in industrial automation.

IC Role / Device Role / Timing Role: High-side/low-side driver for GaN half-bridge; leverages 14-V input tolerance to interface directly with FPGA I/O banks without level shifters.

Use Value: Reduces gate drive loop inductance via split outputs and WSON-10 EP grounding-critical for suppressing EMI in motion-control EMI-sensitive environments.

Use Scenario: 36–75-V input, 12-V output, 1-MHz isolated forward converter in server PSU auxiliary supplies.

IC Role / Device Role / Timing Role: Synchronous rectifier driver for secondary-side GaN FETs; uses strong 5-A sink current to rapidly discharge gate during transition to prevent cross-conduction.

Use Value: Achieves <500-ps jitter margin on dead-time control due to 1.5-ns propagation matching-essential for maintaining isolation barrier integrity at MHz frequencies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar GaN gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
LMG1205RGET Includes integrated startup logic, level shifter, and power-off VGS clamp; higher integration but no split outputs. Better suited for new designs requiring simplified bootstrap management and enhanced reliability during power cycling. Select LMG1205RGET when bootstrapping complexity or power-cycle robustness outweighs need for independent turnon/turnoff tuning.
UCC27611DR Single-channel, 5-A/5-A symmetric driver; no high-side floating capability or bootstrap circuitry. Limited to low-side or isolated high-side applications; requires external level-shifting for half-bridge use. Choose UCC27611DR only for discrete low-side GaN drive or when paired with isolated gate drivers in transformer-coupled topologies.

Compared with LM5113SDE/NOPB, LMG1205RGET adds startup robustness and eliminates external bootstrap diode requirements but sacrifices independent gate strength control; UCC27611DR offers higher symmetric current but lacks integrated high-side floating architecture-making it unsuitable as a drop-in replacement for half-bridge GaN drive.

Availability

LM5113SDE/NOPB is available at Aetrix Electronics and suitable for merchant telecom rectifiers, macro remote radio units (RRU), and closed-loop stepper motor drives requiring stable component supply, long-term lifecycle support, and traceable GaN driver sourcing.

Supply support for LM5113SDE/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power management, signal chain, and real-time control.

The LM5113SDE/NOPB belongs to TI's high-frequency GaN gate driver product line, engineered specifically for MHz-class power conversion using enhancement-mode GaN FETs in telecom, industrial, and wireless infrastructure applications.

FAQ

What is the maximum high-side voltage rating for LM5113SDE/NOPB?

The LM5113SDE/NOPB supports a maximum HS-to-VSS voltage of 90 V, as specified in the Recommended Operating Conditions table. This enables use with 48-V and 54-V bus systems common in telecom rectifiers and industrial DC/DC converters where GaN FETs operate with high blocking voltage requirements.

Does LM5113SDE/NOPB require an external bootstrap diode?

Yes, LM5113SDE/NOPB requires an external bootstrap diode-TI recommends BAT46, BAT41, or LL4148-with a 20-Ω series resistor to charge the high-side supply on a cycle-by-cycle basis. The device includes internal clamping but does not integrate the bootstrap diode itself.

How does LM5113SDE/NOPB prevent unintended high-side turnon during fast dv/dt transitions?

The LM5113SDE/NOPB prevents unintended turnon via its 0.6-Ω pulldown resistance on HOL output, which provides a low-impedance discharge path for the GaN gate, combined with fast 5-A sink current capability. This actively pulls the gate low during high dv/dt events, suppressing Miller-induced false triggering.

What package type is used for LM5113SDE/NOPB?

LM5113SDE/NOPB uses the WSON-10 (DPR) package: 4.0 mm × 4.0 mm body with exposed thermal pad (EP). This package delivers RθJA = 37.5°C/W and RθJC(bot) = 4.1°C/W, making it suitable for thermally constrained high-power density applications.

Is LM5113SDE/NOPB pin-compatible with LMG1205RGET?

No, LM5113SDE/NOPB is not pin-compatible with LMG1205RGET. While both are GaN gate drivers from TI, LMG1205RGET uses a 16-pin QFN package with different pin assignment, added features (integrated level shifter, startup logic), and no direct pin mapping to LM5113SDE/NOPB's WSON-10 layout.

LM5113SDE/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
4.5V ~ 5.5V
Logic Voltage - VIL, VIH:
1.76V, 1.89V
Current - Peak Output (Source, Sink):
1.2A, 5A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
107 V
Rise / Fall Time (Typ):
7ns, 1.5ns
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-WSON (4x4)

LM5113SDE/NOPB FAQ

1.How can I place an order for LM5113SDE/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LM5113SDE/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM5113SDE/NOPB reliable?

The price and inventory of LM5113SDE/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM5113SDE/NOPB is usually 5 days.

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LM5113SDE/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM5113SDE/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM5113SDE/NOPB?

For technical support, including LM5113SDE/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM5113SDE/NOPB requirements.

6.How does Aetrix verify that LM5113SDE/NOPB is sourced from the original manufacturer or authorized distributors?

All LM5113SDE/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM5113SDE/NOPB meets industry standards.

7.What is the process for return or replacement of LM5113SDE/NOPB?

All LM5113SDE/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM5113SDE/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM5113SDE/NOPB part is unused and in its original packaging.

Return procedure for LM5113SDE/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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