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Texas Instruments LP2995M

Part No.:
LP2995M
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixLP2995M.pdf
Description:
IC REGULATOR DDR TERM 8-SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,911

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Product details

Overview

LP2995M from Texas Instruments is a linear DDR termination regulator designed for SSTL-2 and SSTL-3 bus termination in DDR-SDRAM systems. It delivers ±1.5A continuous output current with ±3A transient capability, regulates VTT to VDDQ/2 (e.g., 1.25V at VDDQ = 2.5V), and provides a buffered VREF reference. It operates from AVIN/PVIN = 2.2–5.5V and supports SOIC-8 packaging.

For engineers reviewing the LP2995M datasheet, LP2995M pinout, LP2995M application, or LP2995M equivalent, this page delivers verified electrical specifications, JEDEC-compliant termination behavior, thermal derating guidance for SOIC-8, and validated alternatives for DDR memory power integrity design.

Technical Context

The LP2995M integrates two high-speed operational amplifiers: one controls the VTT output stage to source/sink current while preventing shoot-through, and the other buffers VREF as a precise VDDQ/2 reference. Its dual-supply architecture separates analog control (AVIN) from power delivery (PVIN) to minimize noise coupling.

VSENSE enables remote load regulation by sensing voltage at the bus midpoint, compensating for IR drop across long PCB traces. Internal 50kΩ resistor dividers set VTT and VREF tracking to VDDQ/2, with optional external resistor modification for SSTL-3 scaling (e.g., VDDQ × 0.45).

Key Specifications

ParameterValue and Actual Design Meaning
VTT Output Voltage1.25V nominal (VDDQ/2); ±15mV offset ensures SSTL-2 compliance at 2.5V VDDQ.
Continuous Output Current±1.5A; sufficient for full DDR-SDRAM DIMM termination under steady-state conditions.
Transient Current Capability±3A peak; handles fast DDR data bus switching transients without regulation loss.
VREF Output Impedance5kΩ; low enough to drive chipset reference inputs without significant droop under light loading.
Quiescent Current250–400µA; enables low-power standby operation while maintaining regulation readiness.
Input Voltage Range (AVIN/PVIN)2.2V to 5.5V; supports 2.5V, 3.3V, and 5V system rails with proper derating.
Thermal Resistance (SOIC-8)151°C/W (JEDEC board); requires thermal derating above 0°C ambient for sustained >1A loads.

Pinout & Package

LP2995M is packaged in an 8-pin SOIC (D) with exposed thermal pad (PowerPAD variant uses DDA package; standard LP2995M uses D package per TI packaging addendum). Pin 1 is marked with a notch or dot; EP (exposed pad) is internally connected to GND and must be soldered to PCB ground plane for thermal performance.

PinCircuit RoleDesign Meaning
1NCNo internal connection; usable for thermal vias or routing clearance only.
2GNDPower and signal ground reference; connects to exposed pad for thermal conduction.
3VSENSERemote feedback node; connects to center of VTT termination bus to correct trace IR drop.
4VREFBuffered VDDQ/2 reference output; supplies stable 1.25V to chipset and memory reference inputs.
5VDDQReference input rail; sets VTT/VREF via internal 50kΩ divider; must be tied to DDR memory VDDQ.
6AVINAnalog supply for op-amps and control circuitry; tied to PVIN for SSTL-2 2.5V operation.
7PVINPower supply for VTT output stage; decoupled locally to sustain ±3A transients.
8VTTRegulated termination output; sources/sinks current to maintain VDDQ/2 at DDR bus nodes.

Key Features

FeatureDesign Value
JEDEC SSTL-2/SSTL-3 ComplianceGuarantees VTT regulation within ±15mV offset and fast transient response required for DDR-SDRAM signaling integrity.
VSENSE Remote SensingEnables <1% load regulation error across 6-inch PCB traces by closing feedback loop at bus midpoint.
Dual-Supply ArchitectureSeparates AVIN (control logic) and PVIN (power stage) to suppress supply noise coupling into VREF/VTT paths.
No External Resistors RequiredInternal 50kΩ divider eliminates BOM cost and layout area for VDDQ/2 generation; simplifies SSTL-2 implementation.
Shoot-Through PreventionOutput stage logic ensures complementary FETs never conduct simultaneously, avoiding destructive current spikes during VTT transitions.

Applications

DDR Memory Subsystem TerminationSSTL-2 Compliant Bus Interface

Use Scenario: Termination of 2.5V DDR-SDRAM data/address/control buses on desktop/server motherboards.

IC Role / Device Role / Timing Role: Provides regulated VTT = 1.25V and buffered VREF = 1.25V to match JEDEC SSTL-2 thresholds and eliminate signal reflections.

Use Value: Enables reliable 200–400 MT/s DDR operation by maintaining <±15mV VTT tolerance across ±1.5A load steps.

Use Scenario: Reference and termination supply for Northbridge-to-DIMM interconnect in legacy DDR1 systems.

IC Role / Device Role / Timing Role: Generates synchronized VREF and VTT from VDDQ to ensure setup/hold timing margins meet SSTL-2 spec.

Use Value: Eliminates need for discrete resistor dividers and op-amp buffers, reducing component count by ≥4 parts per channel.

SSTL-3 Adjustable ReferenceDDR-SDRAM Power Integrity

Use Scenario: Termination for 3.3V DDR-SDRAM systems requiring VTT = VDDQ × 0.45 (e.g., 1.485V).

IC Role / Device Role / Timing Role: Uses external series resistor on VDDQ pin to reconfigure internal divider ratio while retaining VREF buffering.

Use Value: Achieves SSTL-3 compliance without redesigning reference circuitry-only one 11.1kΩ resistor added.

Use Scenario: Maintaining stable termination voltage during burst-mode DDR reads/writes with >2A peak current demand.

IC Role / Device Role / Timing Role: Sources/sinks transient current up to ±3A while holding VTT within ±20mV window per JEDEC test conditions.

Use Value: Prevents data corruption from VTT droop/surge during 10ms load pulses, verified in TI Figure 9 performance curves.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LP2995MR/NOPBSame die, SO PowerPAD-8 (DDA) package with enhanced θJA = 51°C/W vs. 151°C/W for LP2995M.Required for high-current (>1A continuous) or high-ambient (>60°C) DDR designs needing better thermal performance.Select LP2995MR/NOPB when board layout allows thermal pad connection and continuous load exceeds 0.8A.
TPS7H1101AQPWPRQ1Automotive-grade 3A sink/source LDO with adjustable VREF; no integrated VDDQ/2 divider; requires external resistors.Used in automotive DDR modules where AEC-Q100 qualification and wider temp range (−40°C to +125°C) are mandatory.Choose TPS7H1101AQPWPRQ1 only if AEC-Q100 compliance and extended temperature operation are required.

Compared with LP2995MR/NOPB, the LP2995M offers lower cost and simpler layout but requires stricter thermal management; versus TPS7H1101AQPWPRQ1, LP2995M provides plug-and-play SSTL-2 support without external components but lacks automotive qualification.

Availability

LP2995M is available at Aetrix Electronics and suitable for DDR-SDRAM termination, SSTL-2 interface design, and memory subsystem power integrity applications requiring stable component supply and long-term industrial availability.

Supply support for LP2995M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal technologies, with over 50 years of leadership in power management ICs.

The LP2995M belongs to TI's DDR termination regulator product line, engineered specifically to meet JEDEC SSTL-2/SSTL-3 specifications for DDR-SDRAM memory interfaces with minimal external components.

FAQ

What is the maximum continuous output current rating for the LP2995M in SOIC-8 package?

The LP2995M supports ±1.5A continuous output current in SOIC-8 package under JEDEC-standard thermal conditions (θJA = 151°C/W). Sustained operation above 1A requires derating based on ambient temperature and PCB copper area; see TI SNVS190M Figure 10 for VIN-dependent limits.

How does the LP2995M achieve SSTL-2 compliance without external resistors?

The LP2995M achieves SSTL-2 compliance using internal matched 50kΩ resistors to generate VREF and regulate VTT precisely to VDDQ/2. This eliminates external resistor networks while ensuring ≤±15mV output offset and fast transient response-key requirements defined in JEDEC JESD8-15A.

Can the LP2995M be used for SSTL-3 applications, and how is the reference voltage adjusted?

Yes, the LP2995M supports SSTL-3 by adding a series resistor (e.g., 11.1kΩ) between VDDQ and the LP2995M VDDQ pin. This modifies the internal resistor divider ratio to produce VREF = VDDQ × 0.45, enabling 1.485V termination for 3.3V DDR systems per JEDEC JESD8-16.

What is the function of the VSENSE pin on the LP2995M, and where should it be connected?

The VSENSE pin on the LP2995M provides remote feedback for improved load regulation. It must be connected to the midpoint of the VTT termination bus (e.g., center of DDR data lines) to compensate for IR drop across PCB traces; if unused, it must be shorted to VTT per TI SNVS190M Section 8.3.3.

Does the LP2995M require input or output capacitors, and what values are recommended?

The LP2995M does not require input capacitance for stability but recommends ≥10µF ceramic (X5R) near PVIN for transient suppression. Output capacitance is flexible: ≥100µF low-ESR aluminum or hybrid capacitor is recommended for DDR-SDRAM to limit VTT droop during ±3A transients, per TI application guidance.

LP2995M Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Bulk
Product Status:
Obsolete
Applications:
DDR Terminator
Current - Supply:
250µA
Voltage - Supply:
2.2V ~ 5.5V
Operating Temperature:
0°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

LP2995M FAQ

1.How can I place an order for LP2995M through Aetrix?

Please submit a Request for Quotation (RFQ) for LP2995M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LP2995M reliable?

The price and inventory of LP2995M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2995M is usually 5 days.

3.What payment methods are accepted for LP2995M?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2995M transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LP2995M?

LP2995M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LP2995M order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LP2995M?

For technical support, including LP2995M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2995M requirements.

6.How does Aetrix verify that LP2995M is sourced from the original manufacturer or authorized distributors?

All LP2995M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2995M meets industry standards.

7.What is the process for return or replacement of LP2995M?

All LP2995M units undergo pre-shipment inspection (PSI). If there is an issue with LP2995M, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LP2995M part is unused and in its original packaging.

Return procedure for LP2995M:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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