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Texas Instruments LP2995MRX
- Part No.:
- LP2995MRX
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Datasheet:
-
LP2995MRX.pdf
- Description:
- IC REGULATOR DDR TERM 8SOPWRPAD
- Quantity:
- Payment:
- Shipping:
Inventory:4,474
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Product details
Overview
LP2995MRX from Texas Instruments is a linear DDR termination regulator designed for SSTL-2 and SSTL-3 bus termination in DDR-SDRAM systems. It sources and sinks up to ±1.5A continuous current, regulates VTT to precisely VDDQ/2 (e.g., 1.25V at VDDQ = 2.5V), and provides a buffered VREF output with ±15mV offset. Its SO PowerPAD-8 package enables thermal performance critical for high-current memory interface applications.
For engineers reviewing the LP2995MRX datasheet, LP2995MRX pinout, LP2995MRX application, or LP2995MRX equivalent, key selection considerations include its dual-source/sink capability, VSENSE remote sensing for improved load regulation, VREF tracking accuracy, thermal resistance (θJA = 43°C/W), and compatibility with JEDEC-compliant DDR termination topologies.
Technical Context
The LP2995MRX integrates two independent op-amp stages: one for VREF generation (buffered VDDQ/2) and one high-speed power amplifier for VTT regulation. Its output stage prevents shoot-through while delivering fast transient response to ±3A peaks required by DDR bus switching.
AVIN powers internal control circuitry; PVIN supplies the VTT output stage; VDDQ sets the reference ratio via internal 50kΩ resistors; VSENSE enables remote-sense feedback at the bus midpoint to compensate for PCB IR drop. The device operates across 0°C to +125°C junction temperature with AVIN and PVIN input range of 2.2V–5.5V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VTT Output Voltage | Tracks VDDQ/2 (e.g., 1.25V at VDDQ = 2.5V) with ±15mV offset - ensures precise termination matching JEDEC SSTL-2/SSTL-3 thresholds. |
| Continuous Current | ±1.5A sourcing/sinking - supports full DDR-SDRAM bus loading without external boost circuitry. |
| Transient Current | Up to ±3A peak - handles fast DDR data line transitions without droop or overshoot. |
| VREF Output | Buffered VDDQ/2 (1.21–1.26V typ.) with 5kΩ output impedance - supplies stable reference to chipset and DIMM without loading error. |
| Thermal Resistance θJA | 43°C/W (SO PowerPAD-8 on JEDEC board) - enables higher sustained current vs. SOIC-8 (151°C/W) under same ambient conditions. |
| Quiescent Current | 250–400µA - minimizes standby power in memory subsystems without compromising regulation speed. |
| Load Regulation | ±0.5% over 0–±1.5A - maintains VTT stability across full DDR I/O swing without external compensation. |
Pinout & Package
LP2995MRX is packaged in SO PowerPAD-8 (DDA), featuring an exposed thermal pad (EP) connected to GND for enhanced heat dissipation. Pin 1 is marked by a beveled corner or dot; pins are numbered counterclockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No internal connection | May be used for thermal vias; no electrical function. |
| 2 (GND) | Ground reference | Common return for analog and power sections; connects to EP for thermal path. |
| 3 (VSENSE) | Remote sense input | Connects to midpoint of VTT bus to correct for trace IR drop and improve load regulation uniformity. |
| 4 (VREF) | Buffered reference output | Provides low-impedance VDDQ/2 for chipset and memory reference inputs; requires local 0.01–0.1µF bypass. |
| 5 (VDDQ) | Reference voltage source | Input to internal 50kΩ divider; determines VTT/VREF scaling (e.g., 2.5V → 1.25V); best connected remotely at DIMM. |
| 6 (AVIN) | Analog supply input | Powers VREF buffer and control circuitry; tied to PVIN for SSTL-2 operation to simplify layout. |
| 7 (PVIN) | Power supply input | Supplies VTT output stage only; must be ≥ AVIN and ≤ 5.5V; requires local 10–50µF input capacitance. |
| 8 (VTT) | Regulated termination output | Sources/sinks current to DDR bus termination resistors; capable of ±1.5A continuous, ±3A transient. |
| EP (Exposed Pad) | Thermal ground plane | Mandatory GND connection via multiple vias; primary thermal path reducing θJA to 43°C/W. |
Key Features
| Feature | Design Value |
|---|---|
| Source/sink termination topology | Single-device DDR bus termination eliminating need for discrete FET pairs or dual regulators. |
| VSENSE remote sensing | Enables <1% VTT variation across multi-drop DDR buses by compensating for PCB trace resistance. |
| No external resistors required | VTT and VREF scaling set internally (VDDQ/2), removing calibration components and layout sensitivity. |
| Low output voltage offset | ±15mV VTT-to-VREF mismatch ensures compliance with SSTL-2 (±25mV) and SSTL-3 (±30mV) tolerance bands. |
| High-speed transient response | Sub-100ns recovery from ±1.5A load steps maintains signal integrity during DDR burst transfers. |
Applications
| DDR Memory Subsystem Termination | SSTL-2 Compliant Bus Interface |
|---|---|
Use Scenario: Termination of bidirectional data/address/control lines in DDR-SDRAM modules on server motherboards. IC Role / Device Role / Timing Role: Provides active VTT termination voltage and global VREF reference synchronized to VDDQ rail. Use Value: Eliminates reflection-induced timing jitter and bit errors at DDR data rates up to 400MT/s by maintaining precise 1.25V termination with <±15mV tracking. |
Use Scenario: Termination network for JEDEC SSTL-2 compliant memory interfaces in industrial PLC controllers. IC Role / Device Role / Timing Role: Regulates VTT to exactly VDDQ/2 while sourcing/sinking dynamic current during read/write cycles. Use Value: Ensures SSTL-2 logic threshold compliance (1.25V ±25mV) across temperature and load, enabling reliable operation from −40°C to +85°C ambient. |
| SSTL-3 Memory Interface | DDR-SDRAM Reference Distribution |
Use Scenario: Termination of DDR2 SDRAM interfaces requiring SSTL-3 (1.5V VDDQ → 0.75V VTT) using external resistor scaling. IC Role / Device Role / Timing Role: Base regulator modified via series resistor on VDDQ pin to generate VTT = VDDQ × 0.45. Use Value: Enables single-part support for both SSTL-2 and SSTL-3 standards without redesigning power architecture. |
Use Scenario: Distribution of low-noise, high-impedance reference voltage to DDR controller and memory ICs on embedded compute modules. IC Role / Device Role / Timing Role: Buffers and delivers VDDQ/2 as VREF to multiple high-Z inputs with <5kΩ output impedance. Use Value: Prevents reference voltage droop under light loading, ensuring consistent setup/hold timing margins across all memory channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP2995MX/NOPB | Same silicon, SOIC-8 package (θJA = 151°C/W); no exposed thermal pad. | Limited to lower continuous current (<±0.8A typical) due to higher thermal resistance; suitable for low-density DDR designs. | Select when board space allows larger footprint and thermal budget permits reduced current capability. |
| TPS51100DGQR | Switching DDR termination regulator; 95% efficiency vs. LP2995MRX's linear operation; requires external inductor/capacitor. | Better thermal performance at high currents but introduces switching noise; requires careful EMI filtering near memory bus. | Select when >1.5A continuous current or >1W dissipation makes linear solution impractical. |
Compared with LP2995MX/NOPB, LP2995MRX delivers 3.5× lower thermal resistance enabling full ±1.5A operation in compact layouts; compared with TPS51100DGQR, LP2995MRX avoids switching noise critical for signal integrity but requires thermal management above 0.5W.
Availability
LP2995MRX is available at Aetrix Electronics and suitable for DDR-SDRAM termination, SSTL-2/SSTL-3 interface design, and memory reference distribution requiring stable component supply across industrial, computing, and communications platforms.
Supply support for LP2995MRX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic technologies with broad industrial and automotive design expertise.
The LP2995MRX belongs to TI's DDR power management product line, engineered specifically to replace discrete termination networks with integrated, JEDEC-compliant linear regulators for high-speed memory interfaces.
FAQ
What is the maximum continuous output current of the LP2995MRX?
The LP2995MRX delivers ±1.5A continuous sourcing and sinking current at VTT. This rating assumes proper thermal design - including connection of the exposed pad to a solid GND plane with multiple vias - and operation within the 0°C to +125°C junction temperature range. Peak transient capability reaches ±3A for short durations, as confirmed in the SNVS190M datasheet Figure 11 and Figure 12.
How does the LP2995MRX achieve precise VTT regulation relative to VREF?
The LP2995MRX uses an internal high-gain operational amplifier to force VTT to track VREF with ±15mV offset (VOSVTT), measured as VTT minus VREF. This tight tracking is maintained across load (0 to ±1.5A), temperature (0°C to +125°C), and line (2.2V to 5.5V AVIN/PVIN) variations, satisfying JEDEC SSTL-2 and SSTL-3 voltage tolerance requirements without external trimming.
Can the LP2995MRX be used for SSTL-3 termination where VDDQ = 1.5V?
Yes - the LP2995MRX supports SSTL-3 by modifying the internal VDDQ/2 scaling ratio. Adding an 11.1kΩ resistor in series with the VDDQ pin changes the effective divider to produce VTT ≈ VDDQ × 0.45 (e.g., 0.675V at VDDQ = 1.5V), as documented in Figure 18 of the SNVS190M datasheet. VREF tracks identically, preserving reference integrity.
What is the purpose of the VSENSE pin on the LP2995MRX?
The VSENSE pin on the LP2995MRX enables remote-sense feedback by connecting to the midpoint of the VTT termination bus. This compensates for IR voltage drop along PCB traces, ensuring uniform termination voltage across all DDR memory devices. If unused, VSENSE must be tied directly to VTT per datasheet Note on page 7.
Which package variant does LP2995MRX use, and why is it preferred over SOIC-8?
LP2995MRX uses the SO PowerPAD-8 (DDA) package with an exposed thermal pad. Its θJA of 43°C/W - versus 151°C/W for SOIC-8 - allows significantly higher continuous current (±1.5A vs. ~±0.8A) without exceeding 125°C junction temperature. The thermal pad must be soldered to a GND plane with ≥6 thermal vias for rated performance, as specified in TI's DDA0008A mechanical drawing.
LP2995MRX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- DDR Terminator
- Current - Supply:
- 250µA
- Voltage - Supply:
- 2.2V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO PowerPad
LP2995MRX FAQ
1.How can I place an order for LP2995MRX through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2995MRX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2995MRX reliable?
The price and inventory of LP2995MRX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2995MRX is usually 5 days.
3.What payment methods are accepted for LP2995MRX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2995MRX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP2995MRX?
LP2995MRX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2995MRX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2995MRX?
For technical support, including LP2995MRX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2995MRX requirements.
6.How does Aetrix verify that LP2995MRX is sourced from the original manufacturer or authorized distributors?
All LP2995MRX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2995MRX meets industry standards.
7.What is the process for return or replacement of LP2995MRX?
All LP2995MRX units undergo pre-shipment inspection (PSI). If there is an issue with LP2995MRX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2995MRX part is unused and in its original packaging.
Return procedure for LP2995MRX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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