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Texas Instruments LP2996AMRE/NOPB

Part No.:
LP2996AMRE/NOPB
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
8-PowerSOIC (0.154", 3.90mm Width)
Datasheet:
AetrixLP2996AMRE/NOPB.pdf
Description:
IC DDR TERMINATION REG 8SOPWRPAD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:411

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Product details

Overview

LP2996AMRE/NOPB from Texas Instruments is a linear DDR termination regulator designed for VTT bus regulation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, regulates VTT to precisely VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V), and features integrated VREF buffer and VSENSE remote sensing for SSTL-2/3 and HSTL termination in server, industrial PC, and FPGA memory subsystems.

For engineers reviewing the LP2996AMRE/NOPB datasheet, LP2996AMRE/NOPB pinout, LP2996AMRE/NOPB application, or LP2996AMRE/NOPB equivalent, key selection criteria include VDDQ tracking accuracy (±30 mV VTT offset), thermal shutdown (165°C), shutdown quiescent current (115–150 µA), ceramic capacitor stability, and support for DDR3L's 1.35 V VDDQ minimum.

Technical Context

The LP2996AMRE/NOPB implements a high-speed op-amp error amplifier with split-rail architecture-AVIN powers analog control circuitry while PVIN supplies the output power stage-enabling independent optimization of noise immunity and thermal performance. Its internal 50-kΩ/50-kΩ resistor divider ensures precise VDDQ/2 reference generation without external components.

VSENSE enables remote load regulation by connecting to the midpoint of the VTT distribution plane, compensating for IR drop across long PCB traces. The active-low SD pin provides Suspend-to-RAM functionality: VTT tri-states while VREF remains active, maintaining chipset reference integrity during low-power states.

Key Specifications

Parameter Value and Actual Design Meaning
VTT Output Voltage Exactly VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V); tracks VDDQ with ±30 mV offset over load and temperature.
Output Current ±1.5 A continuous, ±3 A transient peak; supports DDR-SDRAM bus termination under dynamic switching loads.
VREF Output Buffered VDDQ/2 reference (e.g., 0.75 V); low 2.5 kΩ output impedance ensures stable reference for chipset/DIMM inputs.
Shutdown Quiescent Current 115–150 µA; enables low-power STR mode while preserving VREF functionality and VDDQ 100 kΩ input impedance.
Thermal Shutdown 165°C with 10°C hysteresis; protects against thermal runaway during sustained high-current operation or poor PCB thermal design.
Input Voltage Range (AVIN) 2.2 V to 5.5 V; allows flexible biasing separate from PVIN, reducing internal power dissipation in high-VTT applications.
VSENSE Input Bias Current 13 nA; enables accurate remote sensing without significant voltage error from trace leakage or capacitive loading.

Pinout & Package

LP2996AMRE/NOPB is packaged in an 8-pin SOIC with PowerPAD (DDA package), 4.90 mm × 3.90 mm body size, with exposed thermal pad connected to GND for enhanced thermal performance.

Pin/Terminal Circuit Role Design Meaning
GND Ground reference Common return for analog control, power stage, and thermal pad; must be low-impedance connection to minimize noise and thermal resistance.
SD Active-low shutdown input Pulls VTT to high-impedance state while keeping VREF active; internal pullup allows enable by open-circuit or AVIN tie.
VSENSE Remote feedback input Connects to VTT plane midpoint to correct IR drop; 13 nA bias current minimizes sensing error on long traces.
PVIN Power stage input Supplies output transistor rail; TI recommends ≤3.3 V to avoid thermal limit trip due to RDS(ON) loss at high VIN–VOUT.
AVIN Analog supply input Powers internal op-amp and reference circuitry; can be independently biased from PVIN for optimal noise/thermal trade-off.
VREF Buffered reference output Provides stable VDDQ/2 for Northbridge and DIMMs; remains active during shutdown for STR compatibility.
VDDQ Reference input Direct connection to DDR memory rail; internal 50-kΩ/50-kΩ divider sets VTT = VDDQ/2 with no external resistors.
VTT Termination output Sinks/sources up to ±3 A; regulated to VDDQ/2 with fast transient response for DDR bus signal integrity.

Key Features

Feature Design Value
VDDQ/2 tracking without external resistors Internal matched 50-kΩ/50-kΩ divider eliminates calibration drift and layout sensitivity in DDR reference generation.
Stable with ceramic capacitors Designed for low-ESR ceramic bypassing (0.01–47 µF), reducing BOM count and board space vs. electrolytic/tantalum solutions.
Suspend-to-RAM (STR) support VTT tri-state on SD assertion preserves system low-power state while VREF remains live for memory retention.
Split-rail architecture (AVIN/PVIN) Decouples analog control supply from power stage input, enabling optimized thermal management and noise isolation.
Remote load regulation via VSENSE Compensates for PCB trace IR drop by sensing VTT at bus midpoint, ensuring uniform termination voltage across memory modules.

Applications

DDR3L Memory Subsystem FPGA Memory Interface

Use Scenario: DDR3L DIMM termination in industrial embedded controllers requiring 1.35 V VDDQ and 0.675 V VTT.

IC Role / Device Role / Timing Role: Linear VTT regulator sourcing/sinking dynamic bus currents while maintaining JEDEC-compliant SSTL-15 termination voltage.

Use Value: Enables reliable high-speed data transfer at 1600 MT/s with <±30 mV VTT regulation error and no external resistor network.

Use Scenario: Termination of bidirectional memory buses in Xilinx/Intel FPGA-based accelerators with mixed DDR2/DDR3 interfaces.

IC Role / Device Role / Timing Role: Dual-role regulator providing VTT for memory I/O and buffered VREF for FPGA I/O banks.

Use Value: Single-component solution supporting multiple DDR standards reduces layout complexity and improves signal integrity margin.

Server Memory Module HSTL Bus Termination

Use Scenario: High-density RDIMM/LRDIMM termination where thermal management and remote sensing are critical.

IC Role / Device Role / Timing Role: High-current (±3 A peak) VTT source with VSENSE-connected mid-plane feedback for uniform bus voltage.

Use Value: Maintains <1% VTT deviation across 24-inch memory bus with 47 µF bulk + 0.1 µF ceramic decoupling.

Use Scenario: Termination of high-speed HSTL Class I/II logic in test equipment and telecom backplanes.

IC Role / Device Role / Timing Role: Precision VTT generator referenced to VDDQ, compatible with HSTL's 1.5 V supply and 0.75 V termination target.

Use Value: Eliminates need for discrete resistor dividers and op-amp buffers, reducing component count and calibration overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
LP2998MRE/NOPB Supports extended temperature range (–40°C to 125°C) and automotive qualification (AEC-Q100); higher thermal robustness with RθJA = 56.5°C/W (SOIC). Required for automotive DDR applications and industrial environments below 0°C; not qualified for commercial-grade use only. Select LP2998MRE/NOPB when operating below 0°C or requiring automotive reliability; LP2996AMRE/NOPB suffices for standard commercial/industrial PCs.
TPS51200DRCT Switching architecture with 95% efficiency; requires external inductor and compensation components; supports 1.5–5.5 V VDDQ range. Better suited for high-power DDR3/DDR4 systems where thermal limits constrain linear regulators; adds EMI filtering complexity. Choose TPS51200DRCT for >2 A average load or thermally constrained designs; LP2996AMRE/NOPB preferred for low-noise, low-component-count DDR2/DDR3L.

Compared with LP2998MRE/NOPB, LP2996AMRE/NOPB offers lower cost and simpler layout but lacks automotive qualification and sub-zero operation. Against TPS51200DRCT, it trades efficiency for noise-free regulation and zero-inductor design-critical for sensitive memory timing margins.

Availability

LP2996AMRE/NOPB is available at Aetrix Electronics and suitable for DDR3L memory modules, FPGA-based computing platforms, and industrial PC motherboard designs requiring stable component supply, JEDEC-compliant termination, and long-term lifecycle support.

Supply support for LP2996AMRE/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of DDR interface expertise and JEDEC-compliant design heritage.

The LP2996A product line targets DDR memory termination in cost-sensitive, thermally constrained computing systems-designed specifically for SSTL-2/3 and HSTL compliance with minimal external components and robust transient response.

FAQ

What is the minimum VDDQ supported by LP2996AMRE/NOPB?

The LP2996AMRE/NOPB supports a minimum VDDQ of 1.35 V, enabling full compatibility with DDR3L memory standards. At this voltage, it regulates VTT to 0.675 V (VDDQ/2) with ±30 mV offset across temperature and load. This specification is confirmed in the Electrical Characteristics table for DDR III operation, where VDDQ = 1.35 V yields VTT = 0.656–0.698 V at IOUT = 0 A.

Does LP2996AMRE/NOPB require external resistors to set VTT voltage?

No, LP2996AMRE/NOPB does not require external resistors to set VTT voltage. It uses an internal matched 50-kΩ/50-kΩ resistor divider to generate VTT = VDDQ/2 directly. This eliminates calibration drift, layout sensitivity, and component count-confirmed in the Feature Description and Pin Functions sections of the datasheet.

How does the VSENSE pin improve regulation in LP2996AMRE/NOPB?

The VSENSE pin in LP2996AMRE/NOPB enables remote load regulation by connecting to the midpoint of the VTT distribution plane. This compensates for IR drop across long PCB traces, ensuring uniform termination voltage across all memory devices. With only 13 nA input bias current, VSENSE introduces negligible error even on high-impedance sensing paths.

What happens to VREF during shutdown of LP2996AMRE/NOPB?

During shutdown (SD pin pulled low), LP2996AMRE/NOPB tri-states the VTT output but keeps VREF fully active. This supports Suspend-to-RAM functionality by maintaining the buffered VDDQ/2 reference for the chipset and DIMMs while reducing total system power. VREF remains stable with 2.5 kΩ output impedance and continues sourcing/sinking up to ±30 µA.

Can LP2996AMRE/NOPB be used for HSTL termination?

Yes, LP2996AMRE/NOPB is explicitly qualified for HSTL termination per the Applications section of the datasheet. When VDDQ = 1.5 V, it delivers VTT = 0.75 V-matching HSTL Class I/II requirements-and supports the necessary ±1.5 A continuous current with fast transient response to maintain signal integrity on high-speed parallel buses.

LP2996AMRE/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-PowerSOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
DDR Terminator
Current - Supply:
320µA
Voltage - Supply:
2.2V ~ 5.5V
Operating Temperature:
0°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO PowerPad

LP2996AMRE/NOPB FAQ

1.How can I place an order for LP2996AMRE/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LP2996AMRE/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LP2996AMRE/NOPB reliable?

The price and inventory of LP2996AMRE/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996AMRE/NOPB is usually 5 days.

3.What payment methods are accepted for LP2996AMRE/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996AMRE/NOPB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LP2996AMRE/NOPB?

LP2996AMRE/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LP2996AMRE/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LP2996AMRE/NOPB?

For technical support, including LP2996AMRE/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996AMRE/NOPB requirements.

6.How does Aetrix verify that LP2996AMRE/NOPB is sourced from the original manufacturer or authorized distributors?

All LP2996AMRE/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996AMRE/NOPB meets industry standards.

7.What is the process for return or replacement of LP2996AMRE/NOPB?

All LP2996AMRE/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2996AMRE/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LP2996AMRE/NOPB part is unused and in its original packaging.

Return procedure for LP2996AMRE/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LP2996AMRE/NOPB Tags

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