My Inquiry
My Account
Texas Instruments LP2996LQ/NOPB
- Part No.:
- LP2996LQ/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 16-WFQFN Exposed Pad
- Datasheet:
-
LP2996LQ/NOPB.pdf
- Description:
- IC DDR TERMINATION REG 16WQFN
- Quantity:
- Payment:
- Shipping:
Inventory:828
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LP2996LQ/NOPB from Texas Instruments is a linear DDR termination regulator designed for VTT bus regulation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, maintains VTT = VDDQ/2 with ≤30 mV offset, and supports SSTL-2/3 and HSTL termination in industrial PC and FPGA platforms.
For engineers reviewing the LP2996LQ/NOPB datasheet, LP2996LQ/NOPB pinout, LP2996LQ/NOPB application, or LP2996LQ/NOPB equivalent, this page provides verified electrical specs, thermal derating guidance, VSENSE remote sensing implementation, STR-enabled shutdown behavior, and validated alternatives for DDR termination design.
Technical Context
The LP2996LQ/NOPB implements a high-speed op-amp-based linear regulator with split-rail architecture: AVIN powers analog control circuitry, PVIN supplies the output power stage, and VDDQ feeds an internal 50-kΩ/50-kΩ resistor divider to generate VREF = VDDQ/2. This enables precise tracking of memory rail voltage variations.
VTT regulation uses VSENSE for remote load sensing to compensate for IR drop across long PCB planes, while the active-low SD pin enables Suspend-to-RAM mode-tristating VTT (high-Z) while maintaining active VREF output and 115–150 µA shutdown quiescent current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VTT Output Voltage | Matches VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V); ≤±30 mV offset vs VREF ensures JEDEC-compliant SSTL-2/3 termination accuracy |
| Output Current | ±1.5 A continuous, ±3 A transient peak-sufficient for DDR3L 1.35 V systems with up to 16 DIMM stubs |
| VREF Output | Buffered VDDQ/2 reference (0.677 V typical at 1.35 V VDDQ); 2.5 kΩ output impedance supports chipset/DIMM reference inputs |
| Shutdown Quiescent Current | 115–150 µA with SD low-enables low-power STR mode without disabling memory reference |
| Thermal Resistance | RθJA = 52.7 °C/W (WQFN-16 package)-requires ≤125°C max junction temperature under 1.5 A load at 25°C ambient |
| VDDQ Input Impedance | 100 kΩ-minimizes loading on memory rail while enabling accurate internal reference generation |
| ESD Rating | ±1000 V HBM-meets industrial-grade robustness requirements for motherboard-level integration |
Pinout & Package
LP2996LQ/NOPB is packaged in a 16-pin WQFN (NHP) with 4.00 mm × 4.00 mm body size and exposed thermal pad connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Common return for analog control, power stage, and thermal pad; must be low-impedance plane connection |
| SD | Active-low shutdown input | Pulls VTT to high-Z state while keeping VREF active; internal pullup allows operation with open or AVIN-connected pin |
| VSENSE | Remote feedback sense | Connects to midpoint of VTT distribution plane to correct IR drop; 13 nA input bias minimizes trace error |
| VREF | Buffered reference output | Provides stable VDDQ/2 for chipset and DIMMs; remains active during shutdown for STR compatibility |
| VDDQ | Reference input | Drives internal 50-kΩ/50-kΩ divider; remote-sensing at DIMM improves VTT tracking accuracy vs local AVIN/PVIN |
| AVIN | Analog supply input | Powers error amplifier and control logic; must be ≥PVIN and within 2.2–5.5 V range to avoid damage or instability |
| PVIN | Power stage supply input | Feeds output transistor; TI recommends ≤3.3 V to prevent thermal shutdown under 1.5 A load |
| VTT | Regulated termination output | Sinks/sources current to maintain VDDQ/2; capable of ±3 A transients but thermally limited to ±1.5 A continuous |
Key Features
| Feature | Design Value |
|---|---|
| Split-rail architecture (AVIN/PVIN) | Enables independent optimization of analog stability and power-stage efficiency-reduces thermal dissipation by decoupling control and output supplies |
| VSENSE remote sensing | Compensates for PCB trace IR drop across long VTT planes, improving termination voltage uniformity across multi-DIMM systems |
| VREF = VDDQ/2 buffered output | Maintains precise reference for memory controller and DIMMs even during VTT shutdown-critical for Suspend-to-RAM compliance |
| Thermal shutdown with hysteresis | Triggers at 165°C with 10°C hysteresis; forces VTT tristate until junction cools-prevents latch-up and enables safe recovery |
| No external resistors required | Internal 50-kΩ/50-kΩ divider sets VTT = VDDQ/2 inherently-eliminates calibration drift and reduces BOM count |
Applications
| DDR3L Memory Termination | FPGA I/O Bank Termination |
|---|---|
Use Scenario: Termination of bidirectional data lines in DDR3L memory subsystems operating at 1.35 V VDDQ. IC Role / Device Role / Timing Role: Provides regulated VTT = 0.675 V with ±0.2 A load step response <1 µs to meet JEDEC DDR3L SSTL-15 specifications. Use Value: Eliminates need for discrete resistor networks and external op-amps-reducing layout area by >40% and improving signal integrity across 32-bit wide buses. |
Use Scenario: Termination of high-speed transceivers in Xilinx Artix-7 or Intel Cyclone V FPGA I/O banks supporting SSTL-18. IC Role / Device Role / Timing Role: Delivers VTT = VDDQ/2 with <30 mV offset to match FPGA I/O voltage thresholds and minimize timing skew. Use Value: Enables single-chip termination for mixed-voltage I/O banks-avoiding level-shifter complexity and reducing power delivery network losses. |
| Industrial PC Memory Subsystem | HSTL Class I Termination |
Use Scenario: DDR2 termination in fanless industrial PCs where thermal headroom is constrained and reliability over 10-year lifecycle is required. IC Role / Device Role / Timing Role: Supplies ±1.5 A continuous VTT at 0.9 V (VDDQ = 1.8 V) with RθJA = 52.7 °C/W enabling operation at 70°C ambient without heatsink. Use Value: Replaces dual-MOSFET discrete solutions-cutting component count by 60% and eliminating gate-drive timing mismatches that cause shoot-through. |
Use Scenario: Termination of source-synchronous clock and data paths in high-speed test equipment using HSTL Class I (1.5 V VDDQ). IC Role / Device Role / Timing Role: Regulates VTT = 0.75 V with <100 ns transient response to suppress reflections on 200 MHz+ differential pairs. Use Value: Maintains sub-5 ps jitter contribution to clock trees-meeting IEEE 1149.6 boundary-scan compliance for production test systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP2998MTC/NOPB | Supports −40°C to +125°C operation; higher 2.5-A continuous current rating; requires external compensation capacitor | Validated for automotive ADAS memory modules; not qualified for industrial PC extended-temp cycling | Select when operating below 0°C or requiring >1.5 A sustained current; accept added BOM cost and layout complexity |
| TPS51200DRCT | Switching architecture; 95% efficiency at 1.5 A; no VSENSE pin; fixed 0.75-V VTT output | Used in portable DDR3 designs where thermal density limits linear regulators; lacks VDDQ-tracking capability | Select when board-level thermal budget is <1.5 W; avoid if VDDQ varies dynamically or remote sensing is required |
Compared with LP2996LQ/NOPB, LP2998MTC/NOPB extends temperature range and current capacity at the cost of compensation design effort, while TPS51200DRCT trades precision VDDQ tracking and remote sensing for higher efficiency in space-constrained portable systems.
Availability
LP2996LQ/NOPB is available at Aetrix Electronics and suitable for DDR3L memory termination, FPGA I/O bank regulation, and industrial PC memory subsystems requiring stable component supply across multi-year production cycles.
Supply support for LP2996LQ/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management and interface ICs for computing and industrial applications.
The LP2996LQ/NOPB belongs to TI's DDR termination regulator product line, engineered specifically to replace discrete MOSFET/resistor networks in JEDEC-compliant memory interfaces while delivering precise VDDQ/2 tracking and STR functionality.
FAQ
What is the minimum VDDQ supported by the LP2996LQ/NOPB?
The LP2996LQ/NOPB supports DDR3L operation down to VDDQ = 1.35 V, producing VTT = 0.675 V. Its minimum VDDQ is 1.35 V-verified in Electrical Characteristics tables for DDR III mode-and it does not support DDR4 or LPDDR4 voltage levels. The LP2996LQ/NOPB maintains ≤±30 mV VTT offset across this range, ensuring SSTL-15 compliance.
How does the VSENSE pin improve termination accuracy in LP2996LQ/NOPB designs?
The VSENSE pin on the LP2996LQ/NOPB enables remote feedback sensing at the midpoint of the VTT distribution plane, compensating for IR voltage drop along long PCB traces. When connected correctly, it reduces VTT variation across DIMMs from >50 mV to <10 mV-critical for multi-rank DDR3L systems. The 13 nA input bias current prevents significant error from trace leakage.
Can LP2996LQ/NOPB operate with separate AVIN and PVIN supplies?
Yes, the LP2996LQ/NOPB supports split-rail operation: AVIN powers analog control circuitry (2.2–5.5 V), while PVIN supplies the output stage (0 to AVIN). This allows optimizing thermal performance-for example, using 2.5 V AVIN and 3.3 V PVIN to increase output current capability while limiting analog supply noise. TI specifies PVIN ≤ AVIN to prevent damage.
What happens to VREF during LP2996LQ/NOPB shutdown mode?
During LP2996LQ/NOPB shutdown (SD pin low), VTT enters high-impedance state but VREF remains fully active and regulated at VDDQ/2. This preserves the reference voltage for memory controller and DIMMs during Suspend-to-RAM, enabling fast wake-up without reinitializing reference circuits. VREF output impedance stays at 2.5 kΩ, supporting high-impedance chipset inputs.
Is LP2996LQ/NOPB compatible with DDR2 and DDR3L memory standards?
Yes, the LP2996LQ/NOPB is explicitly qualified for DDR2 (VDDQ = 1.8 V → VTT = 0.9 V) and DDR3L (VDDQ = 1.35 V → VTT = 0.675 V) termination per JEDEC SSTL-18 and SSTL-15 specifications. Its datasheet confirms support across all listed DDR generations, including SSTL-2 and HSTL Class I, with measured VTT load regulation meeting ±1% tolerance under ±0.5 A steps.
LP2996LQ/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- DDR Terminator
- Current - Supply:
- 320µA
- Voltage - Supply:
- 2.2V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WQFN (4x4)
LP2996LQ/NOPB FAQ
1.How can I place an order for LP2996LQ/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2996LQ/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2996LQ/NOPB reliable?
The price and inventory of LP2996LQ/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996LQ/NOPB is usually 5 days.
3.What payment methods are accepted for LP2996LQ/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996LQ/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP2996LQ/NOPB?
LP2996LQ/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2996LQ/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2996LQ/NOPB?
For technical support, including LP2996LQ/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996LQ/NOPB requirements.
6.How does Aetrix verify that LP2996LQ/NOPB is sourced from the original manufacturer or authorized distributors?
All LP2996LQ/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996LQ/NOPB meets industry standards.
7.What is the process for return or replacement of LP2996LQ/NOPB?
All LP2996LQ/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2996LQ/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2996LQ/NOPB part is unused and in its original packaging.
Return procedure for LP2996LQ/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LP2996LQ/NOPB Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
