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Texas Instruments LP2996LQX
- Part No.:
- LP2996LQX
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 16-WFQFN Exposed Pad
- Datasheet:
-
LP2996LQX.pdf
- Description:
- IC REGULATOR DDR TERM 16WQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,949
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Product details
Overview
LP2996LQX from Texas Instruments is a linear DDR termination regulator designed for VTT bus regulation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, regulates VTT to precisely VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V), and features active-low shutdown with Suspend-to-RAM support. It is used in high-speed memory subsystems requiring tight load regulation and low output voltage offset.
For engineers reviewing the LP2996LQX datasheet, LP2996LQX pinout, LP2996LQX application, or LP2996LQX equivalent, this page provides verified technical context, JEDEC-compliant DDR termination specifications, validated pin functions for WQFN-16 package, real-world load regulation behavior, and direct alternatives for DDR3L-compatible termination designs.
Technical Context
The LP2996LQX implements a dual-rail linear topology: AVIN powers analog control circuitry (2.2–5.5 V), while PVIN supplies the output stage (≤AVIN) - enabling thermal optimization and reduced internal dissipation. Its high-speed error amplifier and shoot-through-protected output stage deliver fast transient response to ±3 A load steps required by DDR memory buses.
VDDQ feeds an internal 50-kΩ/50-kΩ resistor divider to generate VREF = VDDQ/2, which is buffered and supplied to chipset/DIMM reference inputs. The VSENSE pin enables remote-sense feedback for improved load regulation across distributed termination planes, and SD asserts low to tri-state VTT while maintaining active VREF for STR mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VTT Output Voltage | 0.656–0.773 V (DDR3L @ VDDQ = 1.35–1.6 V); tracks VDDQ/2 with ≤±30 mV offset under ±0.5 A load |
| Continuous Current | ±1.5 A sourcing/sinking; supports sustained DDR3L termination loads without thermal shutdown at proper layout |
| Peak Transient Current | ±3 A; handles DDR memory burst current demands while maintaining regulation within 10 ms |
| VREF Output | Buffered VDDQ/2 reference (e.g., 0.758 V @ VDDQ = 1.5 V); 2.5 kΩ output impedance; remains active during SD shutdown |
| Shutdown Quiescent Current | 115–150 µA; reduces system power during Suspend-to-RAM while preserving reference integrity |
| Thermal Shutdown | 165°C with 10°C hysteresis; protects against overheating during high-current operation or poor PCB thermal design |
| Input Voltage Ranges | AVIN: 2.2–5.5 V; PVIN ≤ AVIN; VDDQ: −0.3–6 V; supports split-rail flexibility for thermal and noise isolation |
Pinout & Package
LP2996LQX is packaged in a 16-pin WQFN (NHP) with 4.0 mm × 4.0 mm body and exposed thermal pad. Pinout conforms to TI's NHP package mapping: pins 1–16 assigned as GND, SD, VSENSE, VREF, VDDQ, PVIN (×2), AVIN, VTT (×2), NC (×6), and thermal pad connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 2) | Ground reference | Common return for analog control, power stage, and sense circuitry; must be low-impedance connection to PCB ground plane |
| SD (Pin 4) | Active-low shutdown input | Pulls VTT to high-impedance state when low; internal pullup allows tie-to-AVIN or open-circuit enable; enables Suspend-to-RAM |
| VSENSE (Pin 5) | Remote feedback input | Connects to midpoint of VTT distribution plane to correct IR drop; improves load regulation accuracy across long memory buses |
| VREF (Pin 7) | Buffered reference output | Provides stable VDDQ/2 (e.g., 0.758 V) to chipset and DIMMs; remains active in shutdown; requires local 0.01–0.1 µF ceramic bypass |
| VDDQ (Pin 8) | Reference voltage input | Feeds internal 50-kΩ/50-kΩ divider; must be routed as remote sense from DDR memory rail to ensure precise VTT tracking |
| PVIN (Pins 11, 12) | Power input for output stage | Supplies pass transistor; higher PVIN increases max continuous current but raises thermal load; TI recommends ≤3.3 V |
| AVIN (Pin 10) | Analog supply input | Powers error amplifier and bias circuitry; independent of PVIN for noise isolation; range 2.2–5.5 V |
| VTT (Pins 14, 15) | Termination voltage output | Regulated output tied to DDR bus termination resistors; capable of bidirectional ±3 A transients; connects to VSENSE for remote sensing |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC-compliant DDR termination | Fully supports SSTL-2, SSTL-3, HSTL, DDR1–DDR3L VTT requirements per JEDEC specs; VTT = VDDQ/2 with <±30 mV offset |
| Dual-rail power architecture | Separate AVIN (control) and PVIN (power) rails reduce noise coupling and allow thermal optimization - e.g., lower PVIN for less dissipation |
| Suspend-to-RAM (STR) support | Active-low SD pin tri-states VTT while keeping VREF active; quiescent current drops to 115–150 µA for low-power memory retention |
| Stable with ceramic capacitors | Designed for low-ESR ceramic output caps (no electrolytic required); supports compact, high-reliability DDR motherboard layouts |
| No external resistors needed | VTT setpoint determined solely by VDDQ via internal matched 50-kΩ resistors; eliminates calibration drift and BOM count |
Applications
| DDR3L Memory Subsystems | SSTL-2 Termination for DDR2 |
|---|---|
Use Scenario: High-density server memory modules using DDR3L (1.35 V) requiring precise, low-noise VTT regulation across 72-bit data buses. IC Role / Device Role / Timing Role: Linear VTT regulator delivering ±1.5 A continuous and ±3 A transient current while maintaining VTT = VDDQ/2 = 0.675 V ±15 mV. Use Value: Eliminates need for external resistor dividers and discrete op-amps; enables single-chip termination with remote sensing for uniform signal integrity across full bus length. |
Use Scenario: Industrial PC motherboards implementing DDR2-800 with SSTL-2 signaling (VDDQ = 1.8 V). IC Role / Device Role / Timing Role: Provides VTT = 0.9 V with <±30 mV load regulation and fast transient response to memory read/write bursts. Use Value: Reduces component count vs. discrete solutions; VSENSE pin compensates for PCB trace IR drop, ensuring consistent termination at all DRAM locations. |
| HSTL Bus Termination | FPGA Memory Interfaces |
Use Scenario: High-speed FPGA I/O banks configured for HSTL Class I or III, requiring stable 0.75–1.5 V termination referenced to VDDQ. IC Role / Device Role / Timing Role: Supplies regulated VTT matching VDDQ/2 across multiple HSTL channels; maintains VREF for FPGA reference inputs during STR. Use Value: Enables single-device termination for multi-bank FPGA designs; SD pin synchronizes VTT disable with FPGA sleep mode without losing reference stability. |
Use Scenario: Xilinx or Intel FPGA-based embedded vision systems interfacing to DDR3L SODIMMs in space-constrained edge devices. IC Role / Device Role / Timing Role: Delivers low-noise, thermally robust VTT regulation in 4×4 mm WQFN package; supports remote VDDQ sensing from SODIMM connector. Use Value: Minimizes PCB area and thermal footprint; ceramic-capacitor compatibility simplifies layout for high-frequency signal integrity and EMI compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP2998MRE/NOPB | Supports wider VDDQ range (1.2–2.5 V); rated for −40°C to +125°C; includes soft-start; higher max continuous current (±2 A) | Targeted for automotive and extended-temp industrial DDR3/DDR4; not qualified for DDR3L-specific low-voltage precision | Select LP2998MRE/NOPB when operating below 0°C or requiring enhanced thermal margin and soft-start for inrush control |
| TPS51200DRCT | Switching-based DDR termination IC; higher efficiency (>90%); supports DDR3/DDR3L; integrated MOSFETs; requires external inductor | Better suited for high-power, thermally constrained systems where linear dropout loss is unacceptable | Choose TPS51200DRCT when board-level thermal budget is tight and inductor integration is acceptable for efficiency gains |
Compared with LP2996LQX, LP2998MRE/NOPB offers broader temperature and voltage range but lacks DDR3L-optimized low-VDDQ accuracy, while TPS51200DRCT trades linearity and simplicity for switching efficiency - making LP2996LQX optimal for cost-sensitive, space-constrained DDR3L designs needing guaranteed ±30 mV VTT regulation.
Availability
LP2996LQX is available at Aetrix Electronics and suitable for DDR3L memory subsystems, industrial PCs, FPGA-based embedded vision platforms, and medical imaging equipment requiring stable, JEDEC-compliant termination voltage supply.
Supply support for LP2996LQX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of DDR interface expertise and JEDEC-compliant product development.
The LP2996LQX belongs to TI's DDR termination regulator product line, engineered specifically for low-offset, bidirectional VTT regulation in DDR1–DDR3L memory interfaces - emphasizing precision tracking, remote sensing, and Suspend-to-RAM functionality.
FAQ
What is the minimum VDDQ voltage supported by the LP2996LQX for DDR3L operation?
The LP2996LQX supports DDR3L operation down to VDDQ = 1.35 V, producing VTT = 0.675 V nominal with ±30 mV maximum offset over temperature and load. This meets JEDEC DDR3L specification requirements and is confirmed in the Electrical Characteristics table for DDR III mode under "VTT output voltage (DDR III)" test conditions.
Does the LP2996LQX require external resistors to set the VTT output voltage?
No, the LP2996LQX does not require external resistors. It uses two internal matched 50-kΩ resistors to form a precision divider from VDDQ, generating VREF = VDDQ/2 and regulating VTT to that exact value. This eliminates calibration drift, reduces BOM count, and ensures consistent VTT tracking across temperature and process variation.
How does the VSENSE pin improve performance in DDR memory applications?
The VSENSE pin enables remote-sense feedback by connecting to the midpoint of the VTT distribution plane. This compensates for IR drop along long PCB traces, ensuring accurate VTT regulation at the memory devices rather than just at the LP2996LQX output. Without VSENSE, regulation error can exceed ±50 mV across a 6-inch bus; with it, error is maintained within ±15 mV.
What happens to VREF and VTT when the SD pin is asserted low on the LP2996LQX?
When SD is pulled low, the LP2996LQX tri-states the VTT output (high-impedance), but VREF remains fully active and continues supplying VDDQ/2 to the chipset and DIMMs. This supports Suspend-to-RAM functionality: memory retains data via stable reference while termination current is disabled to save power.
Can the LP2996LQX be used for HSTL or SSTL-3 termination, or is it limited to DDR standards?
Yes, the LP2996LQX is explicitly qualified for HSTL and SSTL-3 termination per its Applications section and Detailed Description. Its ability to regulate VTT = VDDQ/2 across VDDQ = 1.5–2.7 V makes it suitable for HSTL Class I (1.5 V), SSTL-3 (2.5 V), and SSTL-2 (2.5 V) - in addition to DDR1–DDR3L - provided VDDQ and PVIN are within specified operating ranges.
LP2996LQX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- DDR Terminator
- Current - Supply:
- 320µA
- Voltage - Supply:
- 2.2V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WQFN (4x4)
LP2996LQX FAQ
1.How can I place an order for LP2996LQX through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2996LQX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2996LQX reliable?
The price and inventory of LP2996LQX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996LQX is usually 5 days.
3.What payment methods are accepted for LP2996LQX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996LQX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP2996LQX?
LP2996LQX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2996LQX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2996LQX?
For technical support, including LP2996LQX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996LQX requirements.
6.How does Aetrix verify that LP2996LQX is sourced from the original manufacturer or authorized distributors?
All LP2996LQX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996LQX meets industry standards.
7.What is the process for return or replacement of LP2996LQX?
All LP2996LQX units undergo pre-shipment inspection (PSI). If there is an issue with LP2996LQX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2996LQX part is unused and in its original packaging.
Return procedure for LP2996LQX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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