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Texas Instruments LP2996LQX/NOPB

Part No.:
LP2996LQX/NOPB
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
16-WFQFN Exposed Pad
Datasheet:
AetrixLP2996LQX/NOPB.pdf
Description:
IC REGULATOR DDR TERM 16WQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,219

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Product details

Overview

LP2996LQX/NOPB from Texas Instruments is a linear DDR termination regulator designed for precise VTT generation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, regulates VTT to exactly VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V), features active-low SD pin for Suspend-to-RAM mode, and maintains VREF output during shutdown. It supports SSTL-2, SSTL-3, and HSTL termination in industrial PC and FPGA platforms.

For engineers reviewing the LP2996LQX/NOPB datasheet, LP2996LQX/NOPB pinout, LP2996LQX/NOPB application, or LP2996LQX/NOPB equivalent, key selection criteria include VDDQ tracking accuracy (±30 mV VTT offset), thermal shutdown threshold (165°C), dual-rail architecture (AVIN/PVIN separation), ceramic-capacitor stability, and DDR3L compatibility down to 1.35 V VDDQ.

Technical Context

The LP2996LQX/NOPB implements a high-speed operational amplifier feedback loop with internal 50-kΩ resistor divider to generate VREF = VDDQ/2, enabling precise VTT regulation independent of AVIN or PVIN. Its dual-rail design isolates analog control circuitry (AVIN) from power output stage (PVIN), reducing thermal coupling and enabling optimized voltage selection-e.g., AVIN = 2.5 V for control while PVIN ≤ 3.3 V for thermal safety.

It operates in three functional modes: startup (with inrush mitigation via VDDQ slew-rate control), normal operation (fast transient response to ±3 A load steps), and active-low shutdown (VTT tri-stated, VREF retained, IQ reduced to 115–150 µA). VSENSE enables remote-sense load regulation, critical for uniform VTT distribution across long DDR bus planes.

Key Specifications

Parameter Value and Actual Design Meaning
VTT Output Voltage Exactly VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V); tracks VDDQ with ±30 mV offset over load/temp
Continuous Current ±1.5 A sink/source; enables full DDR3L termination without external boost stages
Peak Transient Current ±3 A; handles DDR memory bus switching transients without droop or overshoot
VREF Output Buffered VDDQ/2 reference; remains active during SD shutdown for chipset continuity
Thermal Shutdown 165°C with 10°C hysteresis; prevents damage during sustained high-current operation
Quiescent Current 320–500 µA (active), 115–150 µA (shutdown); enables low-power STR mode in memory subsystems
Input Voltage Range AVIN: 2.2–5.5 V; PVIN ≤ AVIN; supports split-rail optimization for thermal management

Pinout & Package

LP2996LQX/NOPB is packaged in an 8-pin WSON (4.0 mm × 4.0 mm) with exposed thermal pad. Pin functions are validated per TI SNOSA40K Rev K datasheet.

Pin/Terminal Circuit Role Design Meaning
GND Ground reference Common return for analog control, power stage, and sense circuitry; must connect to low-impedance ground plane
SD Active-low shutdown input Pulls VTT to high-impedance state while retaining VREF; internal pullup allows floating-high enable
VSENSE Remote feedback input Enables precise VTT regulation at DDR bus midpoint; required for <1% load regulation across long traces
PVIN Power input for output stage Supplies pass transistor; higher PVIN increases max current but raises thermal dissipation-TI recommends ≤3.3 V
AVIN Analog supply input Powers internal op-amp and reference circuitry; can be independently set from PVIN for thermal optimization
VREF Buffered reference output Provides stable VDDQ/2 for Northbridge and DIMMs; remains active in shutdown for STR compliance
VDDQ Reference voltage input Defines VTT target (VDDQ/2); internal 100 kΩ impedance enables remote sensing from DIMM rail
VTT Regulated termination output Sinks/sources current to maintain VDDQ/2; capable of ±3 A transients with fast response to DDR bus switching

Key Features

Feature Design Value
VDDQ-tracking regulation Internal matched 50-kΩ resistor divider ensures VTT = VDDQ/2 with ±30 mV error across temperature and load
Dual-rail architecture Separate AVIN (control) and PVIN (power) inputs allow thermal-aware voltage partitioning-e.g., AVIN = 2.5 V, PVIN = 3.3 V
Suspend-to-RAM support Active-low SD pin tri-states VTT while preserving VREF, reducing system quiescent current by >75% in standby
Ceramic capacitor stability Stable with low-ESR ceramic capacitors (0.01–47 µF); eliminates need for electrolytic or tantalum bulk caps
Remote-sense load regulation VSENSE pin compensates for IR drop across PCB plane, ensuring <±5 mV VTT variation across 6-inch DDR bus

Applications

DDR3L Memory Termination FPGA I/O Bank Termination

Use Scenario: Termination of DDR3L memory interface on industrial embedded motherboard with VDDQ = 1.35 V.

IC Role / Device Role / Timing Role: Generates precise VTT = 0.675 V and buffered VREF = 0.675 V for memory controller and DIMMs.

Use Value: Enables JEDEC-compliant SSTL-15 termination with ±30 mV VTT accuracy and ±3 A transient handling, eliminating signal reflection errors at 1600 MT/s.

Use Scenario: Termination of multi-voltage FPGA I/O banks supporting mixed DDR2/DDR3 protocols.

IC Role / Device Role / Timing Role: Provides programmable VTT referenced to each bank's VDDIO, using VDDQ pin as dynamic input.

Use Value: Supports seamless protocol switching (SSTL-18/SSTL-15) via single VDDQ adjustment; no external resistors or DACs required.

SSTL-3 Server DIMM Interface HSTL Logic Termination

Use Scenario: Termination of high-density server DIMMs operating at SSTL-3 (VDDQ = 1.5 V).

IC Role / Device Role / Timing Role: Delivers VTT = 0.75 V with remote sensing via VSENSE connected at bus center point.

Use Value: Maintains <±5 mV VTT uniformity across 12-inch memory channel, meeting JEDEC SSTL-3 load regulation spec.

Use Scenario: Termination of high-speed HSTL logic in test equipment backplane with strict noise floor requirements.

IC Role / Device Role / Timing Role: Supplies low-noise VTT = 0.75 V (at VDDQ = 1.5 V) with VREF buffered output for reference routing.

Use Value: Achieves <10 µV RMS output noise with 0.1 µF ceramic bypass on VREF, enabling sub-100 ps timing margin integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
LP2996N/NOPB Minimum VDDQ = 1.8 V; supports DDR1/DDR2 only; lacks DDR3L capability Not suitable for DDR3L (1.35 V) or DDR3 (1.5 V) systems requiring VDDQ < 1.8 V Select LP2996LQX/NOPB when DDR3L support, lower VDDQ headroom, or WSON package is required.
TPS51100DGQR Switching topology; higher efficiency (>90% at 1.5 A); requires external inductor and compensation Better thermal performance at high currents but introduces switching noise incompatible with noise-sensitive DDR PHYs Choose LP2996LQX/NOPB for low-noise linear regulation where EMI sensitivity or layout simplicity outweighs efficiency needs.

Compared with LP2996N/NOPB, LP2996LQX/NOPB adds DDR3L support and WSON packaging for space-constrained designs; versus TPS51100DGQR, it eliminates inductor-related EMI and layout complexity at the cost of thermal derating above 1.2 A continuous load.

Availability

LP2996LQX/NOPB is available at Aetrix Electronics and suitable for DDR3L memory termination, FPGA I/O bank regulation, and SSTL-3/HSTL logic interfaces requiring stable component supply, JEDEC-compliant voltage accuracy, and industrial temperature range support.

Supply support for LP2996LQX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability power management solutions for industrial, automotive, and communications markets.

The LP2996LQX/NOPB belongs to TI's DDR termination regulator product line, engineered specifically for JEDEC-compliant memory interface power delivery with emphasis on precision tracking, low noise, and Suspend-to-RAM functionality.

FAQ

What is the minimum VDDQ voltage supported by the LP2996LQX/NOPB?

The LP2996LQX/NOPB supports a minimum VDDQ of 1.35 V, enabling full compliance with DDR3L memory specifications. This is confirmed in the Electrical Characteristics table of the TI SNOSA40K datasheet, where VREF and VTT values are specified for PVIN = VDDQ = 1.35 V. The LP2996LQX/NOPB achieves this via its internal 50-kΩ resistor divider, ensuring VTT = VDDQ/2 = 0.675 V with ±30 mV offset. This capability distinguishes it from the LP2996N/NOPB, which requires ≥1.8 V VDDQ.

How does the LP2996LQX/NOPB handle thermal management during high-current operation?

The LP2996LQX/NOPB incorporates thermal shutdown at 165°C with 10°C hysteresis and is characterized for RθJA = 52.7°C/W in its WSON-8 package. During ±1.5 A continuous operation, internal power dissipation must be calculated using (PVIN − VTT) × IOUT; TI recommends limiting PVIN to ≤3.3 V to avoid exceeding junction temperature limits. The device also supports thermal derating curves in Figure 10–16 of the datasheet, allowing designers to determine maximum sustainable current based on ambient temperature and PCB copper area.

Can the LP2996LQX/NOPB be used for SSTL-3 termination, and what VDDQ voltage is required?

Yes, the LP2996LQX/NOPB supports SSTL-3 termination with VDDQ = 1.5 V, producing VTT = 0.75 V and VREF = 0.75 V. This is explicitly listed in the Applications section of the datasheet and verified in the Electrical Characteristics table under "VTT output voltage (DDR I)" with VDD = VDDQ = 1.5 V. The device's ±30 mV VTT offset and VSENSE remote-sense capability ensure compliance with SSTL-3 load regulation requirements across distributed memory buses.

What is the function of the VSENSE pin on the LP2996LQX/NOPB, and how should it be connected?

The VSENSE pin on the LP2996LQX/NOPB provides remote feedback for improved load regulation, compensating for IR drop along long PCB traces. It must be connected to the midpoint of the VTT distribution plane-typically at the center of the DDR bus-to ensure uniform termination voltage across all memory devices. If remote sensing is not implemented, VSENSE must still be tied directly to VTT. A 0.1 µF ceramic capacitor placed adjacent to the VSENSE pin suppresses high-frequency noise that could destabilize regulation.

Does the LP2996LQX/NOPB require external resistors to set its output voltage?

No, the LP2996LQX/NOPB requires no external resistors to set VTT or VREF. Its output voltage is determined solely by the VDDQ input applied to the VDDQ pin, via an internal matched pair of 50-kΩ resistors that divide VDDQ by two. This architecture guarantees VTT = VDDQ/2 and VREF = VDDQ/2 with minimal drift, eliminating calibration components and reducing BOM count. All necessary compensation is achieved with standard ceramic bypass capacitors on AVIN, PVIN, VREF, and VTT.

LP2996LQX/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
16-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Applications:
DDR Terminator
Current - Supply:
320µA
Voltage - Supply:
2.2V ~ 5.5V
Operating Temperature:
0°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-WQFN (4x4)

LP2996LQX/NOPB FAQ

1.How can I place an order for LP2996LQX/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LP2996LQX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LP2996LQX/NOPB reliable?

The price and inventory of LP2996LQX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996LQX/NOPB is usually 5 days.

3.What payment methods are accepted for LP2996LQX/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996LQX/NOPB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LP2996LQX/NOPB?

LP2996LQX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LP2996LQX/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LP2996LQX/NOPB?

For technical support, including LP2996LQX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996LQX/NOPB requirements.

6.How does Aetrix verify that LP2996LQX/NOPB is sourced from the original manufacturer or authorized distributors?

All LP2996LQX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996LQX/NOPB meets industry standards.

7.What is the process for return or replacement of LP2996LQX/NOPB?

All LP2996LQX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2996LQX/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LP2996LQX/NOPB part is unused and in its original packaging.

Return procedure for LP2996LQX/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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