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Texas Instruments LP2996MX/NOPB
- Part No.:
- LP2996MX/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
LP2996MX/NOPB.pdf
- Description:
- IC REGULATOR DDR TERM 8-SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,136
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Product details
Overview
LP2996MX/NOPB from Texas Instruments is a linear DDR termination regulator designed for VTT bus regulation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, maintains VTT = VDDQ/2 with ≤30 mV offset, and supports SSTL-2/3 and HSTL termination in industrial PC and FPGA applications.
For engineers reviewing the LP2996MX/NOPB datasheet, LP2996MX/NOPB pinout, LP2996MX/NOPB application, or LP2996MX/NOPB equivalent, this page provides verified electrical specs, SOIC-8 package details, DDR3L-compatible operation down to 1.35 V VDDQ, thermal shutdown behavior, and validated alternatives for memory subsystem design.
Technical Context
The LP2996MX/NOPB implements a dual-rail architecture: AVIN powers analog control circuitry (2.2–5.5 V), while PVIN supplies the output stage (≤AVIN). Its high-speed error amplifier enables fast transient response to DDR bus load steps up to ±3 A.
VDDQ feeds an internal 50 kΩ–50 kΩ resistor divider to generate VREF = VDDQ/2, which directly regulates VTT. The VSENSE pin enables remote sensing for improved load regulation across distributed termination buses, and the active-low SD pin enables Suspend-to-RAM mode with VTT tri-state and persistent VREF.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDDQ Range | 1.35 V to 2.7 V - supports DDR3L (1.35 V), DDR2 (1.8 V), and DDR1 (2.5 V) termination reference inputs |
| VTT Output Accuracy | ±30 mV offset vs VREF - ensures JEDEC-compliant SSTL-2/3 and HSTL termination voltage tolerance |
| Continuous Current | ±1.5 A - sustains steady-state DDR bus termination current without thermal derating at TJ ≤ 125°C |
| Peak Transient Current | ±3 A - handles DDR SDRAM burst-mode current spikes without output droop or recovery delay |
| Quiescent Current | 320–500 µA - enables low-power standby in memory subsystems; drops to 115–150 µA in shutdown |
| Thermal Shutdown | 165°C with 10°C hysteresis - protects against sustained overload; tri-states VTT while preserving VREF |
| Package | SOIC-8 (4.9 mm × 3.9 mm) - industry-standard footprint compatible with automated PCB assembly |
Pinout & Package
LP2996MX/NOPB is packaged in an 8-pin SOIC (D package) with exposed thermal pad (PowerPAD™). The package measures 4.90 mm × 3.90 mm and requires GND connection to the thermal pad for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Common return path for analog control, power stage, and VSENSE feedback; must connect to thermal pad |
| VTT | Regulated output | Termination voltage rail (VDDQ/2); sinks/sources up to ±3 A; tri-states during SD assertion |
| SD | Shutdown control input | Active-low signal enabling Suspend-to-RAM; internal pullup allows open-circuit enable |
| PVIN | Power stage input | Supplies output transistor; must be ≤ AVIN; TI recommends ≤3.3 V to avoid thermal limit trip |
| VSENSE | Remote feedback input | Enables precise VTT regulation at bus midpoint; must connect to VTT if remote sense not used |
| AVIN | Analog supply input | Powers internal op-amp, reference, and logic; range 2.2–5.5 V; decoupling required near pin |
| VREF | Buffered reference output | Stable VDDQ/2 voltage for chipset/DIMM reference; remains active during SD shutdown |
| VDDQ | Reference input | Memory I/O supply; internal 100 kΩ impedance; remote-sense connection improves tracking accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Split-rail architecture | Independent AVIN (control) and PVIN (power) rails reduce thermal dissipation and improve noise isolation |
| No external resistors for VTT setting | VTT = VDDQ/2 derived from precision internal 50 kΩ–50 kΩ divider - eliminates calibration and layout drift |
| Suspend-to-RAM (STR) support | Active-low SD pin tri-states VTT while maintaining VREF - enables low-power memory retention states |
| Ceramic capacitor stability | Stable with low-ESR ceramic capacitors (0.01 µF–47 µF) - reduces BOM count and board area vs tantalum |
| High-speed transient response | Operational amplifier + optimized output stage achieves <1 µs recovery from ±3 A load steps |
Applications
| DDR3L Memory Subsystem | FPGA I/O Termination |
|---|---|
Use Scenario: DDR3L DIMMs operating at 1.35 V VDDQ in industrial embedded controllers requiring JEDEC-compliant VTT regulation. IC Role / Device Role / Timing Role: Linear VTT regulator sourcing/sinking dynamic termination current while tracking VDDQ/2 with ±30 mV accuracy. Use Value: Eliminates need for discrete resistor networks and external op-amps; supports 1.35 V minimum VDDQ per LP2996A specification. |
Use Scenario: High-speed FPGA I/O banks using SSTL-18 or HSTL interfaces where clean, low-noise termination voltage is critical. IC Role / Device Role / Timing Role: Provides stable, low-offset VTT rail referenced to FPGA VCCIO; VREF output supplies reference to FPGA configuration logic. Use Value: Enables single-chip termination for multi-bank FPGA designs; VSENSE pin compensates for PCB trace IR drop across large boards. |
| SSTL-2 Server Memory | HSTL Industrial Interface |
Use Scenario: DDR2 server memory modules with 2.5 V VDDQ requiring robust termination under heavy load transients. IC Role / Device Role / Timing Role: Delivers ±1.5 A continuous and ±3 A peak current to terminate parallel stub lines per JEDEC SSTL-2 Class II. Use Value: Maintains VTT regulation within ±30 mV over full temperature range (0°C to 125°C) and load step conditions. |
Use Scenario: Industrial backplane interfaces using HSTL_15 or HSTL_18 standards with strict VTT accuracy and low quiescent power requirements. IC Role / Device Role / Timing Role: Supplies regulated termination voltage and buffered reference (VREF) to multiple HSTL receivers on same bus. Use Value: Supports HSTL compliance with 100 kΩ VDDQ input impedance and <2.5 kΩ VREF output impedance for minimal loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP2996M/NOPB | Same SOIC-8 package and pinout; rated for DDR1/DDR2 only (min VDDQ = 1.8 V); lacks DDR3L support | Not suitable for DDR3L (1.35 V) or DDR3 (1.5 V) systems; limited to legacy DDR1/DDR2 platforms | Select when designing for SSTL-2-only applications with ≥1.8 V VDDQ and no DDR3L requirement. |
| TPS51100DGQR | Switching architecture; higher efficiency; requires external inductor and compensation components | Better thermal performance at high currents; introduces switching noise unsuitable for noise-sensitive DDR3L timing paths | Prefer for high-current (>2 A avg), thermally constrained designs where EMI filtering can be implemented. |
Compared with LP2996M/NOPB, LP2996MX/NOPB extends VDDQ support down to 1.35 V for DDR3L compliance; compared with TPS51100DGQR, it offers simpler layout, lower noise, and guaranteed ±30 mV VTT accuracy without loop compensation.
Availability
LP2996MX/NOPB is available at Aetrix Electronics and suitable for DDR3L memory subsystems, FPGA I/O termination, SSTL-2 server DIMMs, and HSTL industrial interfaces requiring stable component supply and long-term lifecycle support.
Supply support for LP2996MX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in power management, signal chain, and high-reliability interface ICs.
LP2996MX/NOPB belongs to TI's DDR termination regulator product line, engineered specifically for JEDEC-compliant VTT generation in DDR1–DDR3L memory systems with emphasis on accuracy, transient response, and system-level power state control.
FAQ
What is the minimum VDDQ voltage supported by the LP2996MX/NOPB?
The LP2996MX/NOPB supports a minimum VDDQ of 1.35 V, enabling full compatibility with DDR3L memory standards. This is confirmed in the device's datasheet revision history and Electrical Characteristics table, where VREF and VTT parameters are explicitly specified for PVIN = VDDQ = 1.35 V. The LP2996MX/NOPB is the A-grade variant, distinct from the N-grade LP2996M/NOPB (1.8 V min).
Does the LP2996MX/NOPB require external resistors to set VTT voltage?
No, the LP2996MX/NOPB does not require external resistors to set VTT. It uses an internal precision 50 kΩ–50 kΩ resistor divider to generate VREF = VDDQ/2, which directly controls VTT regulation. This eliminates calibration drift, reduces component count, and ensures consistent VTT = VDDQ/2 tracking across temperature and process variation - a key feature confirmed in the Functional Block Diagram and Feature Description sections of the datasheet.
How does the SD pin function in the LP2996MX/NOPB?
The SD pin on the LP2996MX/NOPB is an active-low shutdown input that enables Suspend-to-RAM (STR) functionality. When pulled low, it tri-states the VTT output (high-impedance) while keeping VREF active. Quiescent current drops to 115–150 µA, and VDDQ maintains its 100 kΩ input impedance. The internal pullup allows enabling the device by connecting SD to AVIN or leaving it open - all behaviors documented in the Pin Functions and Device Functional Modes sections.
Can the LP2996MX/NOPB be used with ceramic output capacitors?
Yes, the LP2996MX/NOPB is stable with ceramic capacitors across its recommended range (0.01 µF to 47 µF), provided they exhibit appropriate ESR. The datasheet explicitly states "Stable With Ceramic Capacitors With Appropriate ESR" as a key feature and recommends 0.1 µF to 0.01 µF ceramics for VREF bypass. This eliminates reliance on higher-ESR tantalum or aluminum electrolytic capacitors, reducing size, cost, and failure risk in DDR termination designs.
What is the maximum continuous output current rating for the LP2996MX/NOPB?
The LP2996MX/NOPB delivers ±1.5 A continuous output current under recommended operating conditions (TJ ≤ 125°C). This rating is specified in the Applications section and reinforced in the Detailed Description, where it states the device "delivers 1.5-A continuous current and transient peaks up to 3 A." Continuous current capability depends on thermal management - the SOIC-8 package has RθJA = 119.5°C/W, requiring proper PCB copper area and airflow for sustained ±1.5 A operation.
LP2996MX/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- DDR Terminator
- Current - Supply:
- 320µA
- Voltage - Supply:
- 2.2V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
LP2996MX/NOPB FAQ
1.How can I place an order for LP2996MX/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2996MX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2996MX/NOPB reliable?
The price and inventory of LP2996MX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996MX/NOPB is usually 5 days.
3.What payment methods are accepted for LP2996MX/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996MX/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP2996MX/NOPB?
LP2996MX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2996MX/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2996MX/NOPB?
For technical support, including LP2996MX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996MX/NOPB requirements.
6.How does Aetrix verify that LP2996MX/NOPB is sourced from the original manufacturer or authorized distributors?
All LP2996MX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996MX/NOPB meets industry standards.
7.What is the process for return or replacement of LP2996MX/NOPB?
All LP2996MX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2996MX/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2996MX/NOPB part is unused and in its original packaging.
Return procedure for LP2996MX/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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