Texas Instruments LP2997M/NOPB
- Part No.:
- LP2997M/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
LP2997M/NOPB.pdf
- Description:
- IC DDR-II TERMINATION REG 8-SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:370
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Product details
Overview
LP2997M/NOPB from Texas Instruments is a linear DDR-II termination regulator designed specifically for SSTL-18 bus termination. It sources and sinks up to ±500 mA continuous current, regulates VTT to VDDQ/2 (e.g., 0.9 V at VDDQ = 1.8 V), and features integrated VREF output and active-low shutdown for Suspend-to-RAM functionality in memory subsystems.
For engineers reviewing the LP2997M/NOPB datasheet, LP2997M/NOPB pinout, LP2997M/NOPB application, or LP2997M/NOPB equivalent, this page delivers verified electrical parameters, SOIC-8 package details, DDR-II memory interface context, thermal performance data, and validated alternative options for termination voltage regulation.
Technical Context
The LP2997M/NOPB implements a dual-rail linear topology: AVIN powers analog control circuitry (2.2–5.5 V), while PVIN supplies the output stage (≤AVIN), enabling thermal separation and reduced junction heating. Its high-speed op-amp and shoot-through–protected output stage deliver fast transient response required by DDR-II SDRAM load steps.
VDDQ feeds an internal 50kΩ/50kΩ resistor divider to generate a precise buffered VREF = VDDQ/2, which remains active during shutdown. VSENSE enables remote sensing at the bus midpoint to compensate for IR drop across long VTT planes-critical for maintaining ±25 mV VTT regulation accuracy under ±500 mA load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VTT Output Voltage | 0.908 V (typ) at VDDQ = 1.8 V, IOUT = 0 A - precisely tracks half the memory core rail for JEDEC SSTL-18 compliance. |
| Output Current | ±500 mA continuous, ±900 mA peak - supports full DDR-II termination current demands without external boost. |
| VREF Accuracy | ±23 mV over temperature (0°C to +125°C) - ensures stable reference for chipset and DIMM termination logic. |
| Quiescent Current | 500 µA (typ) at 25°C - low power draw maintains efficiency in always-on memory subsystems. |
| Shutdown Current | 150 µA (max) with SD = 0 V - enables Suspend-to-RAM mode with VREF retained and VTT tri-stated. |
| Thermal Shutdown | 165°C with 10°C hysteresis - protects against thermal runaway during sustained high-current operation. |
| Package Thermal Resistance | θJA = 151°C/W (SOIC-8) - requires minimal PCB copper area for standard motherboard thermal management. |
Pinout & Package
LP2997M/NOPB is packaged in an 8-pin SOIC (D) package with exposed pad not connected internally (non-PowerPAD variant per /NOPB suffix and D package code). Pin 1 is located at the top-left corner adjacent to the index notch.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | GND | Power and signal ground reference for all internal circuitry and output stage return path. |
| 2 | SD | Active-low shutdown input; pulls VTT to high-impedance state while preserving VREF output during STR mode. |
| 3 | VSENSE | Remote feedback node for VTT regulation; connects to center of termination bus to correct trace IR drop. |
| 4 | VREF | Buffered VDDQ/2 reference output (0.9 V typical); supplies Northbridge and DIMM reference inputs with ≤2.5 kΩ output impedance. |
| 5 | VDDQ | Input for internal reference generation; must match DDR-II memory core voltage (e.g., 1.8 V) to set accurate VTT target. |
| 6 | AVIN | Analog supply input (2.2–5.5 V); powers control loop, reference, and bias circuitry - independent of PVIN. |
| 7 | PVIN | Power input for output stage (≤AVIN); typically tied to 1.8 V memory rail - defines maximum VTT sourcing headroom. |
| 8 | VTT | Regulated termination output; sources/sinks current to maintain VDDQ/2 at load point with ±25 mV offset tolerance. |
Key Features
| Feature | Design Value |
|---|---|
| No external resistors required | Internal 50kΩ/50kΩ divider sets VREF = VDDQ/2 - eliminates calibration components and layout sensitivity. |
| Suspend-to-RAM (STR) support | SD pin asserts VTT tri-state while retaining VREF - enables low-power memory retention without losing reference integrity. |
| Dual-rail input architecture | Separate AVIN (analog) and PVIN (power) rails reduce thermal coupling and allow optimized supply sequencing. |
| Superior load regulation | VTT offset held to ±25 mV from VREF across ±500 mA load range - meets JEDEC SSTL-18 VTT tolerance. |
| Thermal shutdown with hysteresis | 165°C trip with 10°C hysteresis prevents oscillation during thermal overload - ensures safe recovery before re-enabling. |
Applications
| DDR-II Memory Subsystems | Server Memory Modules |
|---|---|
Use Scenario: Termination of bidirectional data/address/control buses on DDR-II SDRAM modules operating at 1.8 V core voltage. IC Role / Device Role / Timing Role: Linear VTT regulator providing dynamic sourcing/sinking to maintain SSTL-18-compliant termination voltage at VDDQ/2. Use Value: Ensures signal integrity across high-speed memory channels by holding VTT within ±25 mV of 0.9 V under ±500 mA transients. |
Use Scenario: High-density RDIMM or UDIMM termination in enterprise servers requiring robust thermal management and STR capability. IC Role / Device Role / Timing Role: Dual-rail termination regulator delivering stable VTT and persistent VREF during memory suspend cycles. Use Value: Enables power-efficient memory retention via SD-controlled VTT tri-state while maintaining reference for fast resume. |
| Industrial Embedded Controllers | Networking Memory Interfaces |
Use Scenario: DDR-II termination in fanless industrial controllers where ambient temperature exceeds 85°C and thermal derating is critical. IC Role / Device Role / Timing Role: SOIC-8 linear regulator with 151°C/W θJA and thermal shutdown - operates reliably without heatsink in convection-limited enclosures. Use Value: Delivers guaranteed ±500 mA performance up to +125°C junction temperature with automatic fault recovery. |
Use Scenario: Termination for DDR-II interfaces in packet processing ASICs and FPGA-based network line cards with tight board space constraints. IC Role / Device Role / Timing Role: Low-component-count solution using VSENSE remote sensing to compensate for VTT plane IR drop across multi-layer PCBs. Use Value: Maintains <1% VTT error across 150 mm bus length without additional compensation circuitry or layout complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR-II termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS51100PWR | Switching architecture; higher efficiency but requires external inductor and generates switching noise. | Better suited for high-current (>1 A), thermally constrained systems where efficiency >85% is mandatory. | Select TPS51100PWR only when board space allows inductor placement and noise filtering; LP2997M/NOPB preferred for simplicity and noise-sensitive memory interfaces. |
| LM1085IT-ADJ | Adjustable LDO; no integrated VREF, VSENSE, or SD pin - requires external resistor divider and logic-level shutdown circuit. | Lacks SSTL-18-specific features; suitable only for generic 0.9 V regulation where JEDEC compliance is not required. | LM1085IT-ADJ adds design overhead and fails to meet DDR-II timing margin requirements; LP2997M/NOPB provides complete, validated SSTL-18 solution. |
Compared with TPS51100PWR and LM1085IT-ADJ, LP2997M/NOPB delivers a purpose-built, pin-compatible DDR-II termination regulator with integrated VREF, VSENSE, and STR functionality - eliminating external components, simplifying layout, and guaranteeing JEDEC SSTL-18 compliance without noise or configuration trade-offs.
Availability
LP2997M/NOPB is available at Aetrix Electronics and suitable for DDR-II memory termination, server DIMM designs, and industrial embedded controllers requiring stable component supply, JEDEC-compliant voltage accuracy, and Suspend-to-RAM support.
Supply support for LP2997M/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability silicon solutions for industrial, automotive, and communications markets.
The LP2997M/NOPB belongs to TI's DDR memory interface power management product line, engineered specifically to meet JEDEC SSTL-18 termination requirements with integrated reference, sensing, and power-state control.
FAQ
What is the primary function of the LP2997M/NOPB in a DDR-II system?
The LP2997M/NOPB serves as a dedicated linear termination regulator that sources and sinks current to maintain VTT at exactly VDDQ/2 (e.g., 0.9 V when VDDQ = 1.8 V) for JEDEC SSTL-18 compliance. It integrates VREF generation, VSENSE remote sensing, and active-low shutdown - making LP2997M/NOPB a complete, single-chip solution for DDR-II memory bus termination without external resistors or support circuitry.
How does the VSENSE pin improve regulation accuracy in LP2997M/NOPB applications?
The VSENSE pin on the LP2997M/NOPB enables remote feedback by connecting to the midpoint of the VTT termination plane, compensating for IR voltage drop across PCB traces. This ensures LP2997M/NOPB regulates VTT precisely at the load rather than at the IC output, maintaining ±25 mV accuracy even across long memory buses - a requirement unmet by local-sense regulators.
Can LP2997M/NOPB operate with different VDDQ voltages, and how does it affect VTT?
Yes - LP2997M/NOPB dynamically tracks VDDQ: VTT = VDDQ/2. At VDDQ = 1.7 V, VTT = 0.856 V (typ); at VDDQ = 1.9 V, VTT = 0.957 V (typ). This scaling ensures LP2997M/NOPB remains compliant across DDR-II voltage tolerances while maintaining fixed 0.5× ratio - confirmed in Electrical Characteristics tables for LP2997M/NOPB across 1.7–1.9 V VDDQ range.
What happens to VREF and VTT when the SD pin is asserted low on LP2997M/NOPB?
When SD is pulled low, LP2997M/NOPB places VTT in high-impedance (tri-state) mode to halt termination current flow, while VREF remains fully active and regulated at VDDQ/2. This Suspend-to-RAM behavior reduces quiescent current to ≤150 µA and preserves reference integrity for fast memory resume - a key feature documented in LP2997M/NOPB's shutdown specifications.
Is LP2997M/NOPB compatible with both SOIC-8 and SO PowerPAD-8 packages?
No - LP2997M/NOPB specifically uses the SOIC-8 (D) package without thermal pad connection (per /NOPB suffix and D package code). The SO PowerPAD-8 variant is designated LP2997MR/NOPB (DDA package). Mixing these violates thermal and electrical specs: LP2997M/NOPB has θJA = 151°C/W vs. 43°C/W for MR variants, requiring distinct PCB layout and thermal design.
LP2997M/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- DDR-II Terminator
- Current - Supply:
- 320µA
- Voltage - Supply:
- 2.2V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
LP2997M/NOPB FAQ
1.How can I place an order for LP2997M/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2997M/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2997M/NOPB reliable?
The price and inventory of LP2997M/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2997M/NOPB is usually 5 days.
3.What payment methods are accepted for LP2997M/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2997M/NOPB transactions.
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4.How is shipping managed for LP2997M/NOPB?
LP2997M/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2997M/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2997M/NOPB?
For technical support, including LP2997M/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2997M/NOPB requirements.
6.How does Aetrix verify that LP2997M/NOPB is sourced from the original manufacturer or authorized distributors?
All LP2997M/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2997M/NOPB meets industry standards.
7.What is the process for return or replacement of LP2997M/NOPB?
All LP2997M/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2997M/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2997M/NOPB part is unused and in its original packaging.
Return procedure for LP2997M/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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