Diodes Incorporated LSC04065Q8

Overview

LSC04065Q8 from Littelfuse is a silicon carbide Schottky diode rated for 650 V repetitive peak reverse voltage and 4 A average forward current at TC = 130°C, featuring near-zero reverse recovery charge (QC = 11 nC), 175°C maximum junction temperature, and DFN8080 surface-mount package - used as output rectifier in high-efficiency 650 V PFC stages.

For engineers reviewing the LSC04065Q8 datasheet, LSC04065Q8 pinout, LSC04065Q8 application, or LSC04065Q8 equivalent, key selection criteria include its 1.70 V forward voltage at 4 A and 175°C, 550 µA leakage at 650 V/175°C, 140 pF junction capacitance, and thermal resistance of 6°C/W (junction-to-case) - critical for thermally constrained SMPS and PFC designs.

Technical Context

This SiC Schottky diode operates with zero minority-carrier injection, eliminating reverse recovery losses and enabling operation up to 175°C junction temperature. Its positive temperature coefficient of VF ensures inherent current sharing when paralleled.

Dynamic performance is defined by 11 nC total capacitive charge under 400 V reverse bias and 250 A/µs dI/dt, with junction capacitance stable across 1–1000 V (140 pF @ 1 V, ~20 pF @ 400 V), supporting high-frequency switching above 100 kHz without snubber dependency.

Key Specifications

Pinout & Package

Package: DFN8080 (8.0 × 8.0 × 1.0 mm), lead-free, halogen-free, RoHS-compliant, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Compared with C3D04065E-TR and SDT40N65S, LSC04065Q8 delivers the lowest thermal resistance (6°C/W), tightest VF distribution (1.70 V typ), and lowest QC (11 nC), making it optimal for space-constrained, high-frequency, high-temperature PFC and DC-DC designs where thermal headroom and EMI control are critical.

Availability

LSC04065Q8 is available at Aetrix Electronics and suitable for power factor correction modules, switching-mode power supplies, and solar microinverters requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for LSC04065Q8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Littelfuse is a global leader in circuit protection, power control, and sensing technologies, with over 90 years of expertise in high-reliability semiconductor components for industrial, automotive, and energy systems.

LSC04065Q8 belongs to Littelfuse's LSIC series of silicon carbide Schottky diodes, engineered specifically for high-efficiency, high-temperature, high-frequency power conversion in next-generation PFC, EV charging, and renewable energy systems.

FAQ

What is the recommended PCB layout for thermal performance?

Use a minimum 40 mm × 40 mm solid copper pour on the bottom layer, connected via ≥8 thermal vias (0.3 mm diameter, 0.6 mm pitch) to inner ground planes. The exposed thermal pad must be soldered directly to this copper area - incomplete solder coverage increases RthJC by >40% and risks premature thermal failure at 4 A continuous.

Can LSC04065Q8 replace standard silicon diodes in existing designs?

Yes, but only after verifying layout thermal capability and gate-drive robustness. Its lack of reverse recovery eliminates snubber circuits but exposes MOSFETs to higher dv/dt - verify driver slew rate and Miller clamp stability. Also confirm that 1.70 V VF does not exceed voltage margin in low-Vin conditions.

Is LSC04065Q8 suitable for bidirectional power flow applications?

No - it is a unidirectional Schottky diode with no body diode or reverse conduction capability. For bidirectional AC/DC or DC/AC operation, use a complementary SiC MOSFET pair or a dedicated bidirectional switch; this device functions only as a high-efficiency rectifier.

What is the impact of moisture sensitivity level (MSL) 1 on assembly?

MSL 1 means the device has unlimited floor life and requires no baking before reflow. It can be stored indefinitely at ≤30°C/60% RH and processed using standard lead-free reflow profiles (peak 260°C) without popcorn cracking or delamination risk - ideal for high-mix manufacturing environments.