Diodes Incorporated LSC06065Q8

Overview

LSC06065Q8 from Littelfuse is a silicon carbide Schottky diode rated for 650 V repetitive peak reverse voltage and 6 A average forward current at TC = 120°C, featuring near-zero reverse recovery, 175°C maximum junction temperature, and DFN8080 surface-mount packaging-used in high-efficiency PFC stages and DC-DC output rectification of industrial SMPS.

For engineers reviewing the LSC06065Q8 datasheet, LSC06065Q8 pinout, LSC06065Q8 application, or LSC06065Q8 equivalent, key selection criteria include its 1.70 V forward voltage at 6 A and 175°C, 640 µA leakage at 650 V/175°C, 195 pF junction capacitance, 15 nC total capacitive charge, and thermal resistance of 4°C/W (junction-to-case) under defined copper heatsink conditions.

Technical Context

This SiC Schottky diode replaces conventional silicon fast recovery diodes in high-frequency switching topologies by eliminating minority-carrier storage delay. Its unipolar conduction mechanism ensures zero reverse recovery charge (Qrr ≈ 0) and temperature-independent switching speed.

Designed for operation up to 175°C junction temperature, it maintains stable VF and IR across temperature with positive TC for VF and IR-enabling parallel operation without current-sharing resistors and simplifying thermal design in compact power converters.

Key Specifications

Pinout & Package

Package: DFN8080 (8.0 mm × 8.0 mm × 1.1 mm), thermally enhanced exposed copper pad, RoHS-compliant lead-free finish, MSL 1.

Key Features

Applications

Availability

LSC06065Q8 is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, onboard EV chargers, and renewable energy inverters requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for LSC06065Q8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Littelfuse is a global manufacturer of circuit protection, power control, and sensing technologies, headquartered in Chicago, Illinois, with R&D centers across North America, Europe, and Asia.

The LSC series is Littelfuse's dedicated silicon carbide Schottky diode product line targeting high-efficiency, high-reliability power conversion in industrial, automotive, and renewable energy systems.

FAQ

What is the recommended PCB layout for thermal performance?

Use a minimum 75 mm × 75 mm × 1.9 mm copper heatsink pad connected to the central cathode pad via ≥6 thermal vias (0.3 mm diameter, filled and plated). Maintain ≥0.5 mm solder mask opening around the exposed pad to maximize solder wetting area and minimize thermal resistance.

Can LSC06065Q8 be paralleled with identical units?

Yes-its positive temperature coefficient of forward voltage ensures natural current sharing. Use matched trace lengths, symmetric layout, and common-source grounding. No external ballast resistors are required, but ensure ±5% matching of mounting pressure and thermal interface material thickness across devices.

Is this device suitable for use with GaN or SiC MOSFETs in totem-pole PFC?

Yes-LSC06065Q8 is specifically validated for anti-parallel operation with 650 V GaN HEMTs and SiC MOSFETs in totem-pole PFC. Its zero Qrr prevents shoot-through during high dv/dt commutation, and its 175°C rating matches wide-bandgap device thermal envelopes.

What is the maximum allowable reflow profile peak temperature?

The LSC06065Q8 is rated MSL 1 and supports standard lead-free reflow per IPC/JEDEC J-STD-020. Peak temperature must not exceed 260°C for ≤30 seconds, with ramp-up rate ≤3°C/s and ramp-down rate ≤6°C/s. Preheat and soak phases must stay below 220°C for ≤120 seconds.