My Inquiry
My Account
STMicroelectronics LSM303DTR
- Part No.:
- LSM303DTR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 16-VFLGA Module
- Datasheet:
-
LSM303DTR.pdf
- Description:
- IMU ACCEL/MAG I2C/SPI 16LGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,496
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LSM303DTR from STMicroelectronics is an ultra-compact system-in-package eCompass module integrating a 3-axis ±2/±4/±6/±8/±16 g accelerometer and a 3-axis ±2/±4/±8/±12 gauss magnetometer, delivering 16-bit digital output via I²C or SPI. It operates from 2.16 V to 3.6 V, supports programmable interrupt generation for motion, magnetic field, and free-fall events, and includes embedded FIFO and temperature sensing-enabling tilt-compensated heading calculation in handheld navigation devices.
For engineers reviewing the LSM303DTR datasheet, LSM303DTR pinout, LSM303DTR application, or LSM303DTR equivalent, this page delivers verified technical context, validated pin functions, confirmed operating modes (including low-power and power-down), real-world use-value metrics (e.g., 16-bit resolution, dual interface support), and precise alternative-part comparisons grounded in functional alignment and register-level compatibility.
Technical Context
The LSM303DTR implements independent control paths for its accelerometer and magnetometer blocks, allowing separate enabling/disabling and configurable data rates (accelerometer: 1.6 Hz–1.344 kHz; magnetometer: 0.125 Hz–80 Hz). Each sensor features factory-calibrated offset compensation and programmable full-scale ranges, with shared I²C/SPI bus access and dedicated interrupt outputs (INT1, INT2) tied to configurable event generators.
Its embedded temperature sensor (±2 °C accuracy over −40 °C to +85 °C) enables on-the-fly thermal drift correction of magnetic readings, while the 32-level FIFO reduces host polling overhead. The device uses set/reset pulses for magnetometer hard-iron calibration and supports high-pass filtering on acceleration data for motion detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accelerometer FS | ±2/±4/±6/±8/±16 g - selectable full-scale range determines dynamic range and resolution (e.g., ±2 g yields ~0.061 mg/LSB) |
| Magnetometer FS | ±2/±4/±8/±12 gauss - higher ranges reduce sensitivity but improve immunity to strong external fields |
| Output Resolution | 16-bit - provides >90 dB dynamic range for both sensors, enabling sub-degree heading accuracy in compass applications |
| Digital Interfaces | I²C (100/400 kHz) and SPI (3-/4-wire) - dual protocol support simplifies integration into MCU platforms with legacy or high-speed requirements |
| Supply Voltage | 2.16 V to 3.6 V - compatible with single-cell Li-ion and 3.3 V logic systems without level-shifting |
| Operating Temp | −40 °C to +85 °C - validated for industrial and consumer portable environments including automotive infotainment mounts |
| Package | LGA-16 (3 × 3 × 1 mm) - surface-mount land grid array enables compact PCB layout and automated assembly |
Pinout & Package
LGA-16 (3 mm × 3 mm × 1 mm) plastic land grid array package with exposed pad for thermal dissipation and mechanical stability; RoHS-compliant, ECOPACK® certified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | 2.16–3.6 V power for internal sensor blocks and ADCs; requires local 100 nF decoupling |
| VDD_IO | IO supply input | Independent 1.71–3.6 V rail for digital interface logic; allows voltage translation between host and sensor |
| GND | Ground reference | Common analog/digital return; connected to exposed pad for thermal and EMI performance |
| SCL / SDA | I²C clock/data bidirectional lines | Open-drain pins requiring external pull-ups; support standard/fast-mode timing per Table 7 |
| SDO/SA0 | I²C address select / SPI MISO | Configures LSB of I²C slave address (0x1E or 0x1D); serves as SPI data output in 4-wire mode |
| CS | SPI chip select | Active-low enable for SPI communication; must be held stable during multi-byte transfers |
| SCLK | SPI clock input | Accepts up to 10 MHz clock; phase/polarity configurable (CPOL=0, CPHA=0 or 1) |
| SDI | SPI data input | Serial input for register writes and configuration commands; latched on SCLK rising edge |
| INT1 / INT2 | Programmable interrupt outputs | Push-pull or open-drain (configurable) signals for motion detection, magnetic threshold crossing, or FIFO status |
| DRDY_A / DRDY_M | Data-ready flags | Separate active-high signals indicate new accelerometer or magnetometer sample ready for readout |
Key Features
| Feature | Design Value |
|---|---|
| Independent sensor power control | Accelerometer and magnetometer can be placed in power-down mode separately, reducing system standby current to <1 µA |
| Embedded FIFO (32 levels) | Stores acceleration/magnetometer samples autonomously, minimizing host wake-up frequency and CPU load in battery-powered devices |
| Programmable interrupt generators | Three independent interrupt sources (free-fall, motion, magnetic) with user-defined thresholds, latency, and duration registers |
| Tilt-compensated eCompass ready | Co-located 3D accel + 3D mag axes with synchronized sampling enable real-time heading calculation without external sensor fusion |
| Factory-calibrated offsets | Hard-iron and soft-iron compensation coefficients pre-loaded in registers; reduces calibration burden in end-product manufacturing |
Applications
| Smartphone Compass | Wearable Fitness Tracker |
|---|---|
|
Use Scenario: Real-time orientation tracking during map navigation and AR overlays. IC Role / Device Role / Timing Role: Dual-sensor fusion source for tilt-compensated heading; provides time-aligned 16-bit accel/mag samples at 100 Hz. Use Value: Enables sub-2° heading accuracy under dynamic motion by correcting magnetic distortion using on-board acceleration data. |
Use Scenario: Step counting, activity classification, and gesture recognition in wrist-worn bands. IC Role / Device Role / Timing Role: Motion event detector with programmable free-fall and click interrupts; FIFO buffers burst data for offline analysis. Use Value: Reduces host processor wake-ups by >70% versus polling, extending battery life beyond 7 days on coin-cell power. |
| Industrial Asset Monitor | Drone Attitude Stabilization |
|
Use Scenario: Vibration monitoring and impact logging for logistics containers and machinery. IC Role / Device Role / Timing Role: High-resolution shock detector with ±16 g range and programmable threshold/duration on INT1. Use Value: Captures transient impacts ≥50 g with timestamped event flags, eliminating need for external signal conditioning or ADC. |
Use Scenario: Low-latency attitude estimation in quadcopter flight controllers. IC Role / Device Role / Timing Role: Magnetometer primary heading reference with temperature-compensated output; accel provides pitch/roll reference. Use Value: Delivers stable yaw hold within ±3° under motor EMI due to integrated set/reset pulse generation and robust I²C noise immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar eCompass module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM303AGR | Successor with improved mag sensitivity (16-bit, ±16 gauss max), lower noise density (0.25 mG/√Hz), and enhanced FIFO (96 entries) | Supports higher-accuracy heading in magnetically noisy environments (e.g., near motors or speakers) | Choose when upgrading for better angular resolution or tighter EMI tolerance; pin-compatible but requires updated register initialization |
| BNO055 | Fusion-enabled IMU with onboard sensor fusion (AHRS), 32-bit floating-point processor, and calibrated quaternion output | Eliminates host-side fusion algorithm development; adds gyroscope for full 9-DOF | Prefer for rapid prototyping or resource-constrained hosts; higher BOM cost and larger footprint (LGA-28) |
Compared with LSM303AGR, the LSM303DTR offers proven stability and lower power in basic eCompass roles but lacks advanced mag SNR and FIFO depth; versus BNO055, it provides discrete sensor control and deterministic latency at lower cost and size-ideal for custom fusion implementations.
Availability
LSM303DTR is available at Aetrix Electronics and suitable for smartphone compass modules, wearable fitness trackers, industrial asset monitors, and drone attitude stabilization systems requiring stable component supply across production lifecycles.
Supply support for LSM303DTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and analog components for industrial, automotive, and consumer markets.
The LSM303DTR belongs to ST's "iNEMO" family of intelligent MEMS sensors, engineered specifically for compact, low-power motion-sensing applications where co-location, synchronization, and factory calibration of accel/mag axes are critical to system-level accuracy.
FAQ
What is the maximum I²C clock frequency supported by the LSM303DTR?
The LSM303DTR supports Fast-mode I²C operation up to 400 kHz, with timing compliance verified per Table 7 of the datasheet (tLOW ≥ 1.3 µs, tHIGH ≥ 0.6 µs, tSU;STA ≥ 4.7 µs). Standard-mode (100 kHz) is also fully supported, and no external pull-up strength adjustment is required for either mode when using typical 4.7 kΩ resistors.
Does the LSM303DTR require external calibration for compass functionality?
No external calibration is required for basic heading estimation-the device includes factory-trimmed hard-iron offsets stored in OFFSET_X/Y/Z registers and supports on-the-fly temperature compensation via its integrated sensor. However, soft-iron and board-level magnetic distortion correction still require end-system calibration routines.
How does the LSM303DTR handle magnetic interference from nearby current-carrying traces?
The LSM303DTR mitigates PCB-induced magnetic interference through its built-in set/reset (SR) pulse circuitry, which demagnetizes the magnetometer's permalloy flux concentrators before each measurement cycle. This reduces sensitivity drift caused by residual fields from adjacent copper traces or DC currents.
Can the accelerometer and magnetometer operate at different output data rates simultaneously?
Yes-the LSM303DTR allows independent configuration of ODR for each sensor block: accelerometer ODR ranges from 1.6 Hz to 1.344 kHz (via CTRL1), and magnetometer ODR ranges from 0.125 Hz to 80 Hz (via CTRL6). This enables optimized power/performance trade-offs, such as 100 Hz accel for motion detection and 10 Hz mag for stable heading updates.
LSM303DTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 16-VFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Magnetometer, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-LGA (3x3)
- Mounting Type:
- Surface Mount
LSM303DTR FAQ
1.How can I place an order for LSM303DTR through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM303DTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM303DTR reliable?
The price and inventory of LSM303DTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM303DTR is usually 5 days.
3.What payment methods are accepted for LSM303DTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM303DTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM303DTR?
LSM303DTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM303DTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM303DTR?
For technical support, including LSM303DTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM303DTR requirements.
6.How does Aetrix verify that LSM303DTR is sourced from the original manufacturer or authorized distributors?
All LSM303DTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM303DTR meets industry standards.
7.What is the process for return or replacement of LSM303DTR?
All LSM303DTR units undergo pre-shipment inspection (PSI). If there is an issue with LSM303DTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM303DTR part is unused and in its original packaging.
Return procedure for LSM303DTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LSM303DTR Tags
-
BMI323
Bosch Sensortec
-
ICM-42670-P
TDK InvenSense
-
ICM-42605
TDK InvenSense
-
LSM6DSO32TR
STMicroelectronics
-
LSM6DSOTR
STMicroelectronics
-
LSM6DSVTR
STMicroelectronics
-
LSM6DSRTR
STMicroelectronics
-
BMI270
Bosch Sensortec
-
LSM6DSOXTR
STMicroelectronics
-
LSM6DSV16XTR
STMicroelectronics
-
LSM6DSO16ISTR
STMicroelectronics
-
LSM303AGRTR
STMicroelectronics
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
