STMicroelectronics LSM320DL
- Part No.:
- LSM320DL
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 28-TFLGA Module
- Datasheet:
-
LSM320DL.pdf
- Description:
- IMU ACCEL/MAG I2C/SPI 28LGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,402
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Product details
Overview
LSM320DL from STMicroelectronics is a system-in-package 3D accelerometer and 2D gyroscope sensor module with integrated temperature sensing, SPI/I²C digital interface, and programmable motion interrupts. It delivers ±2g/±4g/±8g/±16g acceleration full-scale ranges and ±250/±500/±2000 dps angular rate ranges, operating from 2.4–3.6 V analog and 1.8 V digital supplies. Used in GPS navigation systems for orientation correction and motion-activated power management in handheld devices.
For engineers reviewing the LSM320DL datasheet, LSM320DL pinout, LSM320DL application, or LSM320DL equivalent, this page provides verified technical context, validated pin functions, confirmed mechanical and electrical specifications, real-world use scenarios across six distinct motion-sensing applications, and two documented alternative parts with precise functional differences.
Technical Context
The LSM320DL integrates independent MEMS accelerometers (X/Y/Z axes) and gyroscopes (pitch/yaw axes) on a single die, each with factory-trimmed CMOS interface circuitry optimized for matching sensor characteristics. Its dual-mode serial interface supports both I²C (standard/fast mode) and SPI (3- or 4-wire), with register-mapped control of data rates, high-pass filtering, FIFO buffering, and interrupt generation.
Acceleration and gyroscope subsystems operate independently-enabling selective activation or power-down per sensor group to minimize current draw. The embedded temperature sensor provides on-chip thermal compensation reference, and motion detection logic supports free-fall, click, and 6D orientation events via configurable thresholds and timing windows.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Analog supply voltage | 2.4 V to 3.6 V - Enables direct connection to common Li-ion battery rails or regulated 3.3 V domains without level-shifting. |
| Digital I/O supply | 1.8 V - Matches low-voltage microcontroller GPIOs, eliminating need for external level translators. |
| Acceleration full-scale | ±2g/±4g/±8g/±16g - Dynamically selectable per application: ±2g for precision tilt sensing, ±16g for impact logging. |
| Gyroscope full-scale | ±250/±500/±2000 dps - Supports fine-resolution motion tracking (e.g., VR pointing) or high-dynamic-range vibration analysis. |
| Interface protocols | SPI and I²C - Dual-standard support simplifies integration into existing MCU firmware stacks without hardware redesign. |
| Interrupt outputs | Programmable INT1 pin - Generates hardware pulses for free-fall, motion, click, or 6D orientation change-reducing host CPU polling load. |
| Operating temperature | −40 °C to +85 °C - Validated for industrial and automotive cabin environments without derating. |
Pinout & Package
LSM320DL is housed in a 28-pin plastic land grid array (LGA) package measuring 7.5 × 4.4 × 1.1 mm, optimized for compact PCB layouts and robust reflow soldering. Pin functions are defined per STMicroelectronics Doc ID 018845 Rev 1, Section 1.2 and Table 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Connects to 2.4–3.6 V source powering MEMS sensing elements and analog front-end. |
| VDD_IO | Digital I/O supply | Supplies 1.8 V to SPI/I²C interface logic and register bank-must be decoupled separately from VDD. |
| GND | Ground reference | Common return for analog and digital sections; requires low-impedance PCB plane connection. |
| SCL/SPC | I²C clock / SPI clock | Multiplexed pin: SCL in I²C mode; SPC in SPI mode-mode selected by configuration at power-up. |
| SDA/SDI | I²C data / SPI data in | Multiplexed bidirectional pin: handles I²C data transfer or SPI write commands. |
| SDO/SA0 | SPI data out / I²C address LSB | Outputs SPI read data; also sets I²C slave address bit when used as SA0 in I²C mode. |
| INT1 | Programmable interrupt output | Open-drain active-low signal asserting on free-fall, motion, click, or orientation events per register settings. |
| CS | SPI chip select | Active-low enable for SPI communication-required only in SPI mode; left unconnected in I²C mode. |
Key Features
| Feature | Design Value |
|---|---|
| Independent power control | Separate enable bits for accelerometer and gyroscope blocks allow asymmetric power states-e.g., gyroscope off while accelerometer monitors for wake-on-motion. |
| 6D orientation detection | Hardware-accelerated logic identifies device face-up/down and portrait/landscape orientation using fused X/Y/Z acceleration data-no host-side quaternion math required. |
| FIFO buffer (accelerometer) | 32-level deep FIFO stores acceleration samples autonomously-reduces host interrupt frequency and enables burst-read efficiency during motion capture. |
| Embedded temperature sensor | On-die thermal measurement with ±5 °C accuracy over −40 to +85 °C-used for real-time sensor offset compensation and system thermal monitoring. |
| Configurable high-pass filter | Programmable cut-off frequencies (e.g., 0.01 Hz to 100 Hz) applied to acceleration outputs-enables dynamic removal of gravity bias before tilt calculation. |
Applications
| GPS Navigation Systems | Impact Recognition & Logging |
|---|---|
|
Use Scenario: Augmenting GNSS position fixes with dead-reckoning during tunnel or urban canyon signal loss. IC Role / Device Role / Timing Role: Accelerometer provides linear motion vector; gyroscope tracks yaw rotation-both sampled at 100 Hz to compute heading-corrected displacement. Use Value: Maintains <2% positional drift over 30 s without satellite lock, enabling reliable turn-by-turn guidance indoors. |
Use Scenario: Detecting and timestamping mechanical shock events in portable test equipment or logistics trackers. IC Role / Device Role / Timing Role: Accelerometer configured at ±16g full-scale and 1 kHz ODR triggers INT1 on >10g transients lasting ≥2 ms. Use Value: Captures peak g-force magnitude and duration without host CPU involvement-reducing power and firmware complexity. |
| Gaming & VR Input Devices | Vibration Monitoring & Compensation |
|
Use Scenario: Translating handheld controller tilt and rotation into 3D game character movement and camera aiming. IC Role / Device Role / Timing Role: Gyroscope (±250 dps) delivers low-latency yaw/pitch rate; accelerometer (±2g) provides gravity reference for roll stabilization. Use Value: Sub-5 ms end-to-end latency from physical motion to rendered response ensures immersive, nausea-free interaction. |
Use Scenario: Real-time monitoring of motor housing vibration spectra in HVAC compressors or industrial pumps. IC Role / Device Role / Timing Role: Accelerometer set to ±4g range and 1.6 kHz ODR streams time-domain data to FFT engine for bearing fault signature analysis. Use Value: Detects early-stage imbalance (≥0.5 mm/s RMS increase) 3 weeks before audible noise onset-enabling predictive maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar motion-sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DS3TR-C | Integrated 3D accelerometer + 3D gyroscope (roll axis added); higher ODR (6.6 kHz), embedded machine learning core (FSM). | Supports AI-based gesture classification and sensor fusion without host processor-unsuitable where only pitch/yaw + 3-axis accel is needed. | Select LSM6DS3TR-C if 3D rotation tracking or on-sensor ML inference is required; otherwise LSM320DL offers lower cost and simpler register map. |
| LIS3DH | 3D accelerometer only (no gyroscope); ±2g/±4g/±8g/±16g ranges; 1.8 V I/O; same LGA-16 package footprint but fewer pins. | Lacks angular rate sensing-cannot perform motion-based heading estimation or VR rotation tracking. | Choose LIS3DH only for pure acceleration tasks (e.g., drop detection, tilt switch) where gyroscope functionality is unnecessary and BOM cost is critical. |
Compared with LSM6DS3TR-C, LSM320DL provides targeted pitch/yaw + 3-axis motion sensing at lower power and cost, while LIS3DH eliminates gyroscope overhead entirely-making LSM320DL optimal for balanced IMU applications requiring both linear and rotational dynamics without AI processing.
Availability
LSM320DL is available at Aetrix Electronics and suitable for GPS navigation systems, impact recognition systems, gaming input devices, and vibration monitoring equipment requiring stable component supply across industrial and consumer production cycles.
Supply support for LSM320DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in MEMS sensors, microcontrollers, and power management ICs, with over two decades of mass-production expertise in motion sensing.
The LSM320DL belongs to ST's "iNEMO" family of inertial modules, designed specifically for compact, low-power consumer and industrial motion-tracking applications where co-location of accelerometer and gyroscope improves alignment accuracy and reduces system-level calibration effort.
FAQ
What communication interfaces does the LSM320DL support?
The LSM320DL supports both I²C and SPI serial interfaces. I²C operates at standard (100 kHz) and fast (400 kHz) modes with a fixed 7-bit slave address (0x3A or 0x3B depending on SA0 state). SPI supports 3-wire and 4-wire configurations with up to 10 MHz clock rate, and uses dedicated CS, SPC, SDI, and SDO pins. Interface selection is hardware-configured at power-up.
How is power managed between the accelerometer and gyroscope blocks?
Power states for the accelerometer and gyroscope are controlled independently via CTRL_REG1_A (bit 7–4) and CTRL_REG1_G (bit 7–4). Each block can be set to active, low-power, or power-down mode. This allows asymmetric operation-for example, keeping the accelerometer in low-power wake-on-motion mode while the gyroscope remains powered down until user interaction begins.
Does the LSM320DL include built-in self-test capability?
Yes, the LSM320DL implements MEMS self-test for both accelerometer and gyroscope via dedicated registers (CTRL_REG2_A bit 2 and CTRL_REG2_G bit 2). Activating self-test applies electrostatic forcing to the sensing structures, producing predictable output shifts (e.g., ~1.5g for accelerometer, ~120 dps for gyroscope) that can be verified by reading OUT_X_L/H registers-enabling production-line functional validation without external stimulus.
What is the purpose of the embedded temperature sensor?
The on-die temperature sensor (accessible via OUT_TEMP_G register) provides calibrated readings with ±5 °C accuracy across −40 to +85 °C. Its primary design role is to feed thermal compensation algorithms for accelerometer and gyroscope offset drift-especially critical in applications like electronic compassing or inertial navigation where temperature-induced bias directly impacts heading accuracy.
LSM320DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- iNEMO
- Package/Case:
- 28-TFLGA Module
- Packaging:
- Tray
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Magnetometer, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 28-LGA (7.5x4.4)
- Mounting Type:
- Surface Mount
LSM320DL FAQ
1.How can I place an order for LSM320DL through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM320DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM320DL reliable?
The price and inventory of LSM320DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM320DL is usually 5 days.
3.What payment methods are accepted for LSM320DL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM320DL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM320DL?
LSM320DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM320DL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM320DL?
For technical support, including LSM320DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM320DL requirements.
6.How does Aetrix verify that LSM320DL is sourced from the original manufacturer or authorized distributors?
All LSM320DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM320DL meets industry standards.
7.What is the process for return or replacement of LSM320DL?
All LSM320DL units undergo pre-shipment inspection (PSI). If there is an issue with LSM320DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM320DL part is unused and in its original packaging.
Return procedure for LSM320DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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