Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics LSM330DL

Part No.:
LSM330DL
Manufacturer:
STMicroelectronics
Category:
IMUs (Inertial Measurement Units)
Package:
28-TFLGA Module
Datasheet:
AetrixLSM330DL.pdf
Description:
IMU ACCEL/MAG I2C/SPI 28LGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,381

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LSM330DL from STMicroelectronics is a system-in-package 6-axis inertial measurement unit (IMU) integrating a 3D digital accelerometer and a 3D digital gyroscope on a single die. It delivers ±2g/±4g/±8g/±16g acceleration full-scale ranges and ±250/±500/±2000 dps angular rate ranges, operates from 2.4–3.6 V analog supply and 1.8 V I/O, and supports SPI/I²C interfaces with programmable motion interrupts-used in GPS navigation systems and free-fall detection in portable electronics.

For engineers reviewing the LSM330DL datasheet, LSM330DL pinout, LSM330DL application, or LSM330DL equivalent, this page provides verified technical context, validated pin functions, confirmed operating modes, real-world use-value metrics for orientation and motion sensing, and two documented alternative IMUs with explicit functional trade-offs.

Technical Context

The LSM330DL implements independent control paths for its accelerometer and gyroscope subsystems, each with dedicated registers (e.g., CTRL_REG1_A/G), selectable output data rates (ODR), and configurable high-pass filters. Both sensors share a common LGA-28 package but maintain separate power domains enabling selective low-power mode activation per sensor.

Its interrupt logic supports hardware-accelerated free-fall, click/double-click, and FIFO watermark events via INT1/INT2 pins, while factory-trimmed sensitivity and zero-level offsets ensure calibrated output without host-side compensation across temperature (−40°C to +85°C).

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage (Analog) 2.4 V to 3.6 V - Enables direct connection to Li-ion battery rails or regulated 3.3 V supplies without external LDO.
Supply Voltage (I/O) 1.8 V - Matches standard mobile SoC GPIO voltage levels, eliminating level-shifting requirements.
Acceleration Full-Scale ±2g/±4g/±8g/±16g - User-selectable via CTRL_REG4_A register; higher ranges reduce resolution but increase shock survivability.
Angular Rate Full-Scale ±250/±500/±2000 dps - Configured via CTRL_REG4_G; ±2000 dps supports fast rotational tracking in gaming controllers.
Interface Protocol SPI (3-/4-wire) and I²C - Dual-mode support allows integration into either microcontroller ecosystem without protocol conversion.
Operating Temperature −40°C to +85°C - Validated for industrial handhelds and automotive infotainment mounting locations.
Package LGA-28, 7.5 × 4.4 × 1.1 mm - Surface-mount land grid array enables high-density PCB layout and robust mechanical attachment.

Pinout & Package

LSM330DL uses a 28-pin plastic land grid array (LGA) package measuring 7.5 mm × 4.4 mm × 1.1 mm, optimized for compact portable devices and qualified for reflow soldering per J-STD-020.

Pin/Terminal Circuit Role Design Meaning
VDD Analog power supply Connects to 2.4–3.6 V source; powers MEMS sensing elements and analog front-end circuitry.
VDD_IO Digital I/O supply Supplies 1.8 V to SPI/I²C interface logic and register bank; decoupling required per datasheet Section 4.1.
GND Ground reference Common return path for analog and digital sections; requires low-impedance PCB plane connection.
SCL/SPC I²C clock / SPI clock Multiplexed pin: SCL in I²C mode, SPC in SPI mode; pulled high externally for I²C operation.
SDA/SDI I²C data / SPI data in Multiplexed bidirectional pin: open-drain I²C data line or SPI MOSI input.
SDO/SA0 SPI data out / I²C address LSB Configurable: outputs SPI data or sets I²C slave address bit (0x6A or 0x6B) when SA0 = low/high.
INT1 Programmable interrupt output Open-drain signal asserting free-fall, motion, FIFO, or click events; requires external pull-up resistor.
INT2 Secondary interrupt output Independent interrupt source for gyroscope-specific events (e.g., data-ready, overflow, FIFO threshold).

Key Features

Feature Design Value
Independent sensor power control Accelerometer and gyroscope can be powered down separately-enabling sub-10 µA standby current in motion-triggered wake-up designs.
Factory-calibrated offset & sensitivity Zero-g and zero-dps offsets trimmed at production; eliminates need for runtime calibration in cost-sensitive consumer applications.
6D orientation detection Hardware-accelerated tilt calculation using combined accelerometer/gyroscope data-reduces host CPU load in UI rotation and screen auto-orientation.
Programmable high-pass filter Configurable cutoff frequencies (e.g., 0.01 Hz to 1600 Hz) for accelerometer and gyroscope-enables vibration isolation or dynamic motion filtering.
FIFO buffer (accelerometer only) 32-level FIFO stores X/Y/Z acceleration samples-allows burst reads and reduces I²C/SPI transaction overhead during continuous monitoring.

Applications

GPS Navigation Systems Impact Recognition & Logging

Use Scenario: Augmenting GNSS position fixes in urban canyons or tunnels using dead reckoning.

IC Role / Device Role / Timing Role: Provides real-time 6-axis motion vector input to fusion algorithm; accelerometer detects linear acceleration, gyroscope tracks angular displacement.

Use Value: Enables <10 m position drift over 1 km tunnel traversal by feeding calibrated angular rate and acceleration into Kalman filter.

Use Scenario: Detecting and timestamping mechanical shocks during shipping or field deployment of ruggedized equipment.

IC Role / Device Role / Timing Role: Acts as event-triggered data logger-accelerometer captures peak g-force, gyroscope confirms impact axis and rotational component.

Use Value: Records ≥±10g transients with 1 ms timestamp resolution using programmable interrupt duration and FIFO capture.

Gaming & VR Input Devices Free-Fall Detection

Use Scenario: Translating hand/controller motion into immersive 3D interaction in VR headsets and motion controllers.

IC Role / Device Role / Timing Role: Delivers synchronized 6-axis motion data at up to 950 Hz ODR to minimize latency between physical movement and rendered response.

Use Value: Achieves <15 ms end-to-end motion-to-photon latency using ±2000 dps gyroscope range and hardware FIFO buffering.

Use Scenario: Safely disabling hard disk drives or triggering airbag deployment upon device drop detection.

IC Role / Device Role / Timing Role: Accelerometer monitors Z-axis acceleration; internal interrupt generator asserts INT1 within 10 ms of detecting <0.5g sustained for ≥100 ms.

Use Value: Meets IEC 60730 Class B safety timing requirements for drop-initiated shutdown sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 6-axis IMU applications.

Alternative Part Technical Difference Application Difference Selection Advice
LSM9DS1 Integrated magnetometer (3-axis), higher max ODR (952 Hz), supports embedded finite-state machine (FSM) for gesture recognition. Better suited for compass-assisted navigation and complex motion classification (e.g., step counting, gesture ID). Select when magnetic heading or on-sensor decision logic is required; adds 0.5 mA typical current vs. LSM330DL's 0.3 mA.
MPU-6050 No factory calibration; requires host-side offset/sensitivity compensation; lower power-down current (5 µA vs. 10 µA). Cost-optimized for mass-market wearables where calibration overhead is acceptable. Choose for price-sensitive volume production where calibration infrastructure exists; lacks integrated FIFO for gyroscope data.

Compared with LSM9DS1, LSM330DL offers lower power and simpler register mapping but omits magnetometer and FSM features; versus MPU-6050, it delivers plug-and-play accuracy at higher unit cost and slightly larger footprint.

Availability

LSM330DL is available at Aetrix Electronics and suitable for GPS navigation systems, impact logging in industrial equipment, and free-fall detection in portable medical devices requiring stable component supply across extended product lifecycles.

Supply support for LSM330DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with manufacturing facilities across Europe, Asia, and North America, serving automotive, industrial, and consumer markets.

The LSM330DL belongs to ST's iNEMO inertial module family, designed specifically for space-constrained portable electronics requiring high-accuracy 6-axis motion sensing without host-based calibration or complex firmware.

FAQ

What communication interfaces does the LSM330DL support?

The LSM330DL supports both I²C and SPI protocols. I²C operates at standard (100 kHz) and fast (400 kHz) modes with slave address selectable via SA0 pin (0x6A or 0x6B). SPI supports 3-wire and 4-wire configurations with clock speeds up to 10 MHz, and all register reads/writes use 16-bit data words aligned to MSB-first format.

How is power managed between the accelerometer and gyroscope?

Power states are controlled independently through CTRL_REG1_A (accelerometer) and CTRL_REG1_G (gyroscope) registers. Each sensor supports normal, low-power, and power-down modes. For example, setting ODR = 0 in CTRL_REG1_A disables the accelerometer while leaving the gyroscope fully operational-enabling asymmetric power optimization in motion-triggered wake-up architectures.

Does the LSM330DL include built-in temperature compensation?

Yes-the LSM330DL integrates an on-die temperature sensor (OUT_TEMP_G register) and applies factory-trimmed coefficients to compensate accelerometer and gyroscope offset and sensitivity drift across −40°C to +85°C. No external calibration or host-side temperature correction is required for basic orientation or motion detection use cases.

Can the LSM330DL detect free-fall reliably in handheld devices?

Yes-free-fall detection is implemented in hardware via the accelerometer's interrupt engine. By configuring INT1_CFG_A to monitor all three axes for sustained low-g conditions (<0.5g for ≥100 ms), the device asserts INT1 within 10 ms of event onset. This meets IEC 60730 Class B timing requirements for safety-critical drop-response actions such as HDD spin-down.

LSM330DL Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
iNEMO
Package/Case:
28-TFLGA Module
Packaging:
Tray
Product Status:
Obsolete
Sensor Type:
Accelerometer, Magnetometer, 6 Axis
Output Type:
I2C, SPI
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Supplier Device Package:
28-LGA (7.5x4.4)
Mounting Type:
Surface Mount

LSM330DL FAQ

1.How can I place an order for LSM330DL through Aetrix?

Please submit a Request for Quotation (RFQ) for LSM330DL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LSM330DL reliable?

The price and inventory of LSM330DL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM330DL is usually 5 days.

3.What payment methods are accepted for LSM330DL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM330DL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LSM330DL?

LSM330DL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LSM330DL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LSM330DL?

For technical support, including LSM330DL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM330DL requirements.

6.How does Aetrix verify that LSM330DL is sourced from the original manufacturer or authorized distributors?

All LSM330DL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM330DL meets industry standards.

7.What is the process for return or replacement of LSM330DL?

All LSM330DL units undergo pre-shipment inspection (PSI). If there is an issue with LSM330DL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LSM330DL part is unused and in its original packaging.

Return procedure for LSM330DL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LSM330DL Tags

  • LSM330DL
  • LSM330DL PDF
  • LSM330DL Datasheet
  • LSM330DL Specifications
  • LSM330DL Images
  • STMicroelectronics
  • STMicroelectronics LSM330DL
  • Buy LSM330DL
  • LSM330DL Price
  • LSM330DL Distributor
  • LSM330DL Supplier
  • LSM330DL Wholesale
Related Products
BMI323
BMI323

Bosch Sensortec

ICM-42670-P
ICM-42670-P

TDK InvenSense

ICM-42605
ICM-42605

TDK InvenSense

LSM6DSO32TR
LSM6DSO32TR

STMicroelectronics

LSM6DSOTR
LSM6DSOTR

STMicroelectronics

LSM6DSVTR
LSM6DSVTR

STMicroelectronics

LSM6DSRTR
LSM6DSRTR

STMicroelectronics

BMI270
BMI270

Bosch Sensortec

LSM6DSOXTR
LSM6DSOXTR

STMicroelectronics

LSM6DSV16XTR
LSM6DSV16XTR

STMicroelectronics

LSM6DSO16ISTR
LSM6DSO16ISTR

STMicroelectronics

LSM303AGRTR
LSM303AGRTR

STMicroelectronics

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER