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STMicroelectronics LSM330DLCTR
- Part No.:
- LSM330DLCTR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 28-TFLGA Module
- Datasheet:
-
LSM330DLCTR.pdf
- Description:
- IMU ACCEL/GYRO I2C/SPI 28LGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,736
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Product details
Overview
LSM330DLCTR from STMicroelectronics is a fully integrated inertial measurement unit (IMU) combining a 3-axis digital accelerometer and a 3-axis digital gyroscope in a single LGA-28 package. It delivers ±2/±4/±8/±16 g acceleration full-scale ranges and ±250/±500/±2000 dps angular rate full-scale ranges, with dual SPI/I²C serial interfaces and programmable motion interrupts-enabling real-time orientation tracking in handheld navigation devices.
For engineers reviewing the LSM330DLCTR datasheet, LSM330DLCTR pinout, LSM330DLCTR application, or LSM330DLCTR equivalent, key selection considerations include dynamic full-scale range switching, independent low-power mode control per sensor, FIFO buffering for burst data capture, and factory-trimmed bias/temperature compensation for embedded motion-sensing systems.
Technical Context
The LSM330DLCTR implements two independent MEMS sensing cores: a capacitive 3D accelerometer with analog front-end and 16-bit ADC, and a vibrating-ring 3D gyroscope with phase-locked loop (PLL)-based readout and 16-bit digital output. Both sensors share a common digital interface but operate with separate power domains and configurable ODRs.
Its digital architecture supports synchronized sampling via shared interrupt logic, 32-level FIFO for accelerometer and gyroscope data (configurable per sensor), and hardware-accelerated 6D orientation detection using vector dot-product comparison-eliminating host CPU overhead for tilt and flip recognition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Analog supply voltage | 2.4 V to 3.6 V - powers MEMS sensing elements and analog signal chains; enables direct connection to Li-ion battery rails without LDO. |
| Digital I/O voltage | 1.8 V - matches low-voltage application processors and microcontrollers; eliminates level-shifting in portable designs. |
| Acceleration full scale | ±2/±4/±8/±16 g - software-selectable per measurement; allows optimization of resolution (e.g., 0.061 mg/LSB at ±2 g) vs. range. |
| Gyroscope full scale | ±250/±500/±2000 dps - selectable via CTRL_REG4_G; provides 8.75 mdps/LSB sensitivity at ±250 dps for high-resolution rotation tracking. |
| Output data rate (ODR) | 1.6 Hz to 952 Hz (accel), 95 Hz to 760 Hz (gyro) - independently configurable; supports low-power wake-on-motion and high-bandwidth stabilization. |
| Interface protocol | SPI (3- or 4-wire) and I²C (standard/fast-mode) - dual compatibility simplifies integration across MCU families; 16-bit aligned data reduces parsing overhead. |
| FIFO depth | 32 samples per sensor - stores time-aligned accel/gyro bursts; enables host to read batches instead of polling, reducing bus traffic and CPU load. |
Pinout & Package
LSM330DLCTR uses a 4 mm × 5 mm × 1.1 mm plastic land grid array (LGA-28L) package with 28 solder pads arranged in a 4×7 array. The package supports reflow soldering per JEDEC J-STD-020 and features exposed thermal pad for improved heat dissipation during sustained operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Connects to 2.4–3.6 V rail powering MEMS transducers and analog front-end; requires local 100 nF decoupling. |
| VDD_IO | Digital I/O supply | Supplies 1.8 V to digital logic and interface circuitry; must be stable before I²C/SPI initialization. |
| SCL/SPC | I²C clock / SPI clock | Shared pin: I²C SCL when I²C_EN=1; SPI SPC when I²C_EN=0; pulled high externally for I²C mode. |
| SDA/SDI | I²C data / SPI data in | Shared bidirectional pin: I²C SDA or SPI MOSI; open-drain for I²C, push-pull for SPI write. |
| SDO/SA0 | SPI data out / I²C address LSB | Configurable: SPI MISO output or I²C slave address bit (0x6A or 0x6B); determines I²C device address. |
| INT1 | Programmable interrupt output | Open-drain output signaling free-fall, motion detection, FIFO threshold, or 6D orientation change; configurable polarity and latch behavior. |
| INT2 | Secondary interrupt output | Independent interrupt source for gyro-specific events (e.g., high-pass filtered motion, data-ready); supports level/edge triggering. |
| CS | SPI chip select | Active-low enable for SPI communication; must be asserted before SPC edge; ignored in I²C mode. |
Key Features
| Feature | Design Value |
|---|---|
| Independent low-power mode per sensor | Accelerometer and gyroscope can be powered down separately-reducing system current to 10 µA (accel only active) or 6 µA (gyro only active). |
| Hardware 6D orientation engine | Detects portrait/landscape and up/down orientation using vector magnitude comparison-no host-side math required; latency < 5 ms. |
| Programmable motion interrupt generator | Configurable thresholds and duration for free-fall, click/double-click, and activity/inactivity-enables wake-from-sleep on user gesture. |
| Factory-calibrated offset and sensitivity | Initial zero-g bias ±50 mg (accel), ±5 dps (gyro); sensitivity variation ±1% (accel), ±2% (gyro)-reduces need for end-of-line calibration. |
| Temperature-compensated output | Integrated temperature sensor (±3 °C accuracy) feeds internal compensation algorithms-maintains stability over −40 °C to +85 °C operating range. |
Applications
| GPS Navigation Systems | Impact Recognition and Logging |
|---|---|
|
Use Scenario: Pedestrian dead reckoning in urban canyons where GPS signal is obstructed or intermittent. IC Role / Device Role / Timing Role: IMU fusion node providing angular rate and linear acceleration for Kalman-filtered position estimation between GPS fixes. Use Value: Enables sub-10-meter positional accuracy over 30-second GPS outages using 6D orientation and gyro-integrated heading. |
Use Scenario: Detecting and timestamping mechanical shock events in industrial equipment or transport containers. IC Role / Device Role / Timing Role: Event-triggered sensor capturing peak g-force and angular jerk during impact; wakes host only on threshold exceedance. Use Value: Reduces power consumption by >95% vs. continuous sampling; logs precise timestamped event data to nonvolatile memory. |
| Gaming and VR Input Devices | Vibration Monitoring and Compensation |
|
Use Scenario: Real-time head and controller tracking in mobile VR headsets and motion-controlled gamepads. IC Role / Device Role / Timing Role: Low-latency motion capture sensor feeding 200 Hz fused orientation data to GPU rendering pipeline. Use Value: Achieves <15 ms motion-to-photon latency using hardware FIFO burst reads and interrupt-driven frame sync. |
Use Scenario: Active vibration cancellation in precision optical platforms and drone gimbal stabilization. IC Role / Device Role / Timing Role: High-bandwidth (760 Hz ODR) gyro feedback source for real-time PID control loop updating at 1 kHz. Use Value: Delivers <0.1° RMS angular error under 500 Hz vibration using ±2000 dps full scale and factory-trimmed scale factor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar inertial measurement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DS3TR-C | Higher ODR (6.6 kHz accel, 1.6 kHz gyro), integrated machine learning core (finite state machine), no external crystal required. | Better suited for AI-edge motion classification (e.g., gesture recognition), but lacks built-in temperature sensor for compensation. | Select for next-gen wearable AI applications requiring on-sensor pattern detection; avoid if legacy temperature compensation is mandatory. |
| ICM-20602 | Lower power (3 mA typical vs. 4.2 mA), integrated digital low-pass filters, wider temperature range (−40 °C to +105 °C), but no 6D orientation hardware block. | Preferred for automotive cabin modules and industrial controllers needing extended thermal margin and deterministic filtering. | Choose when operating above +85 °C or when fixed-coefficient DLPF configuration is preferred over programmable HPF/FIFO modes. |
Compared with LSM330DLCTR, LSM6DS3TR-C adds ML acceleration at higher power and cost, while ICM-20602 trades orientation hardware for broader temperature tolerance and lower quiescent current-making LSM330DLCTR optimal for cost-sensitive consumer navigation where 6D detection and factory calibration are critical.
Availability
LSM330DLCTR is available at Aetrix Electronics and suitable for GPS navigation systems, impact logging devices, gaming peripherals, and vibration monitoring systems requiring stable component supply across multi-year production cycles.
Supply support for LSM330DLCTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in MEMS, microcontrollers, power management, and automotive ICs-with over 20 years of MEMS manufacturing heritage and ISO/TS 16949-certified fabrication.
The LSM330DLC belongs to ST's iNEMO inertial module family, designed specifically for space-constrained portable electronics requiring tightly coupled, factory-calibrated acceleration and angular rate sensing without external compensation circuitry.
FAQ
What is the minimum supply voltage required for reliable operation of the LSM330DLCTR?
The LSM330DLCTR requires a minimum analog supply voltage (VDD) of 2.4 V for guaranteed functionality across its full operating temperature range (−40 °C to +85 °C). Below this, accelerometer noise increases significantly and gyroscope startup may fail. Digital I/O (VDD_IO) must be ≥1.71 V for I²C and ≥1.65 V for SPI compliance.
Does the LSM330DLCTR support simultaneous sampling of accelerometer and gyroscope data?
Yes-the LSM330DLCTR synchronizes accelerometer and gyroscope sampling via internal timing logic, enabling true time-aligned 6-axis data capture. When both sensors are configured to the same ODR and FIFO is enabled, each FIFO entry contains one 16-bit accel sample and one 16-bit gyro sample with matched timestamps.
How is the 6D orientation detection implemented, and what is its latency?
The 6D engine performs real-time vector dot-product comparisons between the measured acceleration vector and six predefined reference axes (±X, ±Y, ±Z) using dedicated hardware logic. Detection latency is fixed at 4.2 ms from event occurrence to INT1 assertion, independent of host processor speed or firmware overhead.
Can the LSM330DLCTR operate without an external crystal or oscillator?
Yes-the LSM330DLCTR uses an internal RC oscillator for all timing functions, including data sampling, FIFO management, and interrupt generation. No external clock source is required, simplifying PCB layout and reducing BOM count. The internal oscillator drift is compensated via factory calibration and temperature monitoring.
LSM330DLCTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- iNEMO
- Package/Case:
- 28-TFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Gyroscope, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 28-LGA (4x5)
- Mounting Type:
- Surface Mount
LSM330DLCTR FAQ
1.How can I place an order for LSM330DLCTR through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM330DLCTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM330DLCTR reliable?
The price and inventory of LSM330DLCTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM330DLCTR is usually 5 days.
3.What payment methods are accepted for LSM330DLCTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM330DLCTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM330DLCTR?
LSM330DLCTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM330DLCTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM330DLCTR?
For technical support, including LSM330DLCTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM330DLCTR requirements.
6.How does Aetrix verify that LSM330DLCTR is sourced from the original manufacturer or authorized distributors?
All LSM330DLCTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM330DLCTR meets industry standards.
7.What is the process for return or replacement of LSM330DLCTR?
All LSM330DLCTR units undergo pre-shipment inspection (PSI). If there is an issue with LSM330DLCTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM330DLCTR part is unused and in its original packaging.
Return procedure for LSM330DLCTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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