My Inquiry
My Account
STMicroelectronics LSM330TR
- Part No.:
- LSM330TR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 24-TFLGA Module
- Datasheet:
-
LSM330TR.pdf
- Description:
- IMU ACCEL/GYRO I2C/SPI 24TFLGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,762
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LSM330TR from STMicroelectronics is a fully integrated inertial measurement unit (IMU) combining a 3-axis digital accelerometer and a 3-axis digital gyroscope in a single LGA-24 package. It delivers ±2/±4/±6/±8/±16 g acceleration range and ±250/±500/±2000 dps angular rate range, with dual embedded state machines for autonomous motion processing - used in GPS-assisted navigation, VR motion tracking, and impact-logging systems.
For engineers reviewing the LSM330TR datasheet, LSM330TR pinout, LSM330TR application, or LSM330TR equivalent, this page provides verified technical context, validated pin functions, confirmed power and interface specs (SPI/I²C), real-world use cases, and two documented alternative IMUs with precise functional and packaging differences.
Technical Context
The LSM330TR integrates two independent sensor cores: a capacitive MEMS accelerometer with programmable full-scale ranges and low-noise signal conditioning, and a vibrating structure gyroscope with temperature-compensated bias stability. Both sensors share a common digital interface but operate with separate power domains and configurable output data rates.
Its dual programmable state machines execute user-defined motion-detection logic (e.g., free-fall, 6D orientation, tap/double-tap) without host CPU intervention, while the shared FIFO buffers up to 32 samples per sensor axis - enabling burst-mode acquisition and reducing I/O traffic in battery-constrained devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Analog supply voltage | 2.4 V to 3.6 V - powers MEMS sensing elements; enables direct connection to Li-ion battery rails without LDO. |
| Digital I/O voltage | 1.8 V - matches modern low-voltage microcontrollers; eliminates level-shifting in 1.8 V system designs. |
| Acceleration full scale | ±2/±4/±6/±8/±16 g - selectable via register; supports both high-sensitivity vibration monitoring and high-g shock detection. |
| Gyroscope full scale | ±250/±500/±2000 dps - software-configurable; balances resolution (0.008 dps/LSB at ±250 dps) and dynamic range. |
| Communication interface | SPI (3- or 4-wire) and I²C (standard/fast mode) - dual protocol support simplifies integration across MCU families. |
| Embedded features | 2 programmable state machines + FIFO + temperature sensor - enables self-contained motion event detection and thermal drift compensation. |
| Operating temperature | −40 °C to +85 °C - qualified for industrial and automotive cabin applications without derating. |
Pinout & Package
LSM330TR uses a 24-pin plastic land grid array (LGA) package measuring 3.0 mm × 3.5 mm × 1.0 mm, optimized for space-constrained portable electronics. The package is RoHS-compliant and ECOPACK® certified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Connects to 2.4–3.6 V source powering MEMS transducers and analog front-end. |
| VDD_IO | Digital I/O supply | Supplies 1.8 V to digital logic, SPI/I²C interface, and state machine controller. |
| GND | Ground reference | Common return path for analog and digital sections; requires low-impedance PCB plane. |
| SCL/SPC | I²C clock / SPI serial clock | Multiplexed pin: SCL in I²C mode; SPC in SPI mode - mode selected by hardware configuration. |
| SDA/SDI | I²C data / SPI data in | Multiplexed bidirectional pin: handles I²C data or SPI command/data input. |
| SDO/SA0 | SPI data out / I²C slave address LSB | Outputs SPI read data; also sets I²C address bit (0x6A or 0x69) when used as SA0. |
| INT1/INT2 | Configurable interrupt outputs | Dual open-drain outputs driven by state machines or sensor events (e.g., data ready, FIFO threshold, motion detection). |
| CS | SPI chip select | Active-low enable for SPI communication; must be held high in I²C mode. |
Key Features
| Feature | Design Value |
|---|---|
| Dual programmable state machines | Execute autonomous motion algorithms (e.g., free-fall, orientation flip, activity/inactivity) without host processor involvement - reduces system power and latency. |
| Configurable FIFO depth | 32-sample buffer per sensor (accel/gyro); supports stream, bypass, and FIFO-triggered read modes - minimizes bus polling and improves data coherency. |
| Independent power control | Accelerometer and gyroscope can be powered down separately - enables ultra-low-power orientation tracking (accel active, gyro off) or high-bandwidth motion capture (both active). |
| Factory-trimmed calibration | Zero-rate and zero-g offsets, sensitivity, and cross-axis misalignment pre-characterized - reduces need for end-system calibration in cost-sensitive applications. |
| Integrated temperature sensor | Monitors die temperature with ±2 °C accuracy over −40 to +85 °C - enables real-time gyroscope bias compensation for stable angular rate output. |
Applications
| GPS Navigation Enhancement | Gaming & VR Motion Tracking |
|---|---|
|
Use Scenario: Augmenting GNSS position fixes during signal outage (e.g., tunnels, urban canyons) using dead reckoning. IC Role / Device Role / Timing Role: Provides 6-axis motion vector (acceleration + angular rate) sampled at ≥100 Hz to estimate displacement and heading drift. Use Value: Enables <10 m position error over 60 s GNSS dropout using sensor fusion algorithms - critical for automotive ADAS and handheld mapping devices. |
Use Scenario: Real-time head and hand pose estimation in immersive virtual reality headsets and motion controllers. IC Role / Device Role / Timing Role: Delivers synchronized 6D orientation data at 200 Hz with <5 ms latency to drive low-persistence display rendering. Use Value: Achieves sub-degree orientation accuracy under dynamic motion, eliminating motion sickness caused by sensor lag or jitter. |
| Impact Recognition & Logging | Intelligent Power Saving |
|
Use Scenario: Detecting and classifying mechanical shocks (e.g., drop events in smartphones, pallet impacts in logistics trackers). IC Role / Device Role / Timing Role: Uses embedded state machine to trigger interrupt on >15 g transient exceeding 2 ms duration - no host polling required. Use Value: Reduces system-level power by 95% vs. continuous host-accelerometer polling; enables tamper-evident logging in battery-powered asset tags. |
Use Scenario: Dynamically managing system sleep states based on user activity (e.g., screen-off after stillness, wake-on-motion). IC Role / Device Role / Timing Role: Runs low-power activity/inactivity detection autonomously using accelerometer data and internal thresholds. Use Value: Extends smartphone/tablet standby time by 30–50% versus host-driven motion detection, with <10 µA typical current draw in wake-on-motion mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis inertial measurement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DS3TR | Higher ODR (up to 6.6 kHz accel, 1.6 kHz gyro), integrated finite-state machine (FSM) with 16KB user memory, lower typical current (0.65 mA vs. 0.9 mA at 100 Hz). | Supports advanced gesture recognition and sensor-hub offload; requires updated driver stack due to different register map and FSM programming model. | Preferred for new designs requiring higher bandwidth, lower power, or richer autonomous processing - but not pin-compatible. |
| ICM-20602 | Wider gyroscope full-scale range (±2000 dps same, but ±1000 dps option), lower noise density (0.004 dps/√Hz vs. 0.007 dps/√Hz), different I²C address (0x68/0x69 vs. 0x6A/0x69). | Better suited for drone stabilization and robotics where angular rate noise floor is critical; lacks dual state machines - motion logic must run on host. | Select when angular rate precision dominates over autonomous feature set; verify PCB layout compatibility (24-pin QFN vs. LGA). |
Compared with LSM330TR, LSM6DS3TR offers superior power efficiency and programmability for next-gen wearables, while ICM-20602 delivers better gyroscope noise performance for motion-critical control loops - both require firmware and layout adaptation.
Availability
LSM330TR is available at Aetrix Electronics and suitable for GPS navigation enhancement, VR motion tracking, impact logging, and intelligent power saving applications requiring stable component supply across industrial and consumer production cycles.
Supply support for LSM330TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in MEMS, microcontrollers, and power management ICs, with manufacturing facilities certified to ISO 9001 and IATF 16949 standards.
The LSM330TR belongs to ST's iNEMO inertial module family, designed specifically for compact, low-power motion sensing in portable and wearable electronics - emphasizing integration, autonomy, and factory-calibrated accuracy.
FAQ
What communication protocols does the LSM330TR support?
The LSM330TR supports both I²C (standard and fast mode, up to 400 kHz) and SPI (3-wire and 4-wire, up to 10 MHz). Pin multiplexing allows either interface to be selected via hardware configuration (CS pin state and external pull-ups), and both protocols provide full register access to accelerometer, gyroscope, and state machine controls.
How does the LSM330TR achieve autonomous motion detection?
It uses two dedicated programmable state machines that execute user-defined logic directly on-chip - such as detecting free-fall, 6D orientation changes, or tap events - using raw sensor data without host CPU involvement. Each state machine has its own interrupt output (INT1/INT2) and can trigger FIFO reads or wake the host only upon condition match.
What is the role of the embedded temperature sensor?
The on-die temperature sensor measures die temperature with ±2 °C accuracy across −40 to +85 °C and feeds data to internal compensation algorithms. This enables real-time correction of gyroscope bias drift, improving angular rate stability - especially critical in applications like electronic image stabilization where thermal hysteresis degrades performance.
Can the accelerometer and gyroscope operate independently?
Yes - the LSM330TR allows independent power control for each sensor block. The accelerometer can remain active in low-power mode (10 µA) while the gyroscope is powered down, or vice versa. This enables flexible power management strategies, such as orientation tracking with accel-only, or high-bandwidth motion capture with both sensors active at configurable ODRs.
LSM330TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 24-TFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 24-LGA (3x3.5)
- Mounting Type:
- Surface Mount
LSM330TR FAQ
1.How can I place an order for LSM330TR through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM330TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM330TR reliable?
The price and inventory of LSM330TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM330TR is usually 5 days.
3.What payment methods are accepted for LSM330TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM330TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM330TR?
LSM330TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM330TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM330TR?
For technical support, including LSM330TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM330TR requirements.
6.How does Aetrix verify that LSM330TR is sourced from the original manufacturer or authorized distributors?
All LSM330TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM330TR meets industry standards.
7.What is the process for return or replacement of LSM330TR?
All LSM330TR units undergo pre-shipment inspection (PSI). If there is an issue with LSM330TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM330TR part is unused and in its original packaging.
Return procedure for LSM330TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LSM330TR Tags
-
BMI323
Bosch Sensortec
-
ICM-42670-P
TDK InvenSense
-
ICM-42605
TDK InvenSense
-
LSM6DSO32TR
STMicroelectronics
-
LSM6DSOTR
STMicroelectronics
-
LSM6DSVTR
STMicroelectronics
-
LSM6DSRTR
STMicroelectronics
-
BMI270
Bosch Sensortec
-
LSM6DSOXTR
STMicroelectronics
-
LSM6DSV16XTR
STMicroelectronics
-
LSM6DSO16ISTR
STMicroelectronics
-
LSM303AGRTR
STMicroelectronics
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
