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STMicroelectronics LSM6DS0TR
- Part No.:
- LSM6DS0TR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 16-VFLGA Module
- Datasheet:
-
LSM6DS0TR.pdf
- Description:
- IMU ACCEL/GYRO I2C/SPI 16LGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,557
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Product details
Overview
LSM6DS0TR from STMicroelectronics is a fully integrated iNEMO inertial module combining a 3-axis digital accelerometer and a 3-axis digital gyroscope in a single LGA-16 package. It delivers ±2/±4/±8/±16 g acceleration sensing and ±245/±500/±2000 dps angular rate measurement, operates from 1.71 V to 3.6 V, supports SPI/I²C interfaces, and enables motion-aware functions in space-constrained portable electronics.
For engineers reviewing the LSM6DS0TR datasheet, LSM6DS0TR pinout, LSM6DS0TR application, or LSM6DS0TR equivalent, this page provides verified functional identity, validated pin roles, confirmed operating modes (including independent ODR control), embedded FIFO behavior, temperature sensor output resolution, and real-world use cases in orientation detection, impact logging, and VR input systems.
Technical Context
The LSM6DS0TR implements dual-sensor architecture with independent signal chains: the accelerometer uses capacitive MEMS sensing with configurable low-pass filtering (HR mode cut-off up to 1.6 kHz), while the gyroscope employs vibrating structure MEMS with programmable high-pass filter cutoff (0.01–100 Hz). Both sensors share a common digital interface but support asynchronous data rates - enabling accelerometer-only wake-up at 1.6 kHz while gyroscope remains powered down.
Its embedded FIFO (up to 32-level depth) supports bypass, continuous, FIFO, and hybrid modes, and the integrated temperature sensor provides calibrated 16-bit output with ±3 °C accuracy across –40 °C to +85 °C. Power management includes "always-on" eco mode (1.8 mA typical) and dynamic power scaling per sensor block.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.71 V to 3.6 V analog; independent I/O supply down to 1.71 V - enables direct interfacing with 1.8 V logic without level shifters. |
| Accelerometer FS Range | ±2/±4/±8/±16 g - selectable via CTRL_REG6_XL; ±2 g mode yields 0.061 mg/LSB resolution for high-sensitivity tilt detection. |
| Gyroscope FS Range | ±245/±500/±2000 dps - ±245 dps mode gives 8.75 mdps/LSB resolution for precise slow-motion tracking. |
| Output Data Rate (ODR) | Configurable up to 6.66 kHz (accelerometer) and 3.33 kHz (gyroscope); independent ODR selection allows asymmetric sampling for power optimization. |
| FIFO Depth | 32 samples (16-bit per axis); stores X/Y/Z accel + X/Y/Z gyro data in burst mode - reduces host MCU polling overhead and interrupt latency. |
| Embedded Temp Sensor | Calibrated 16-bit output; ±3 °C accuracy over full temp range - usable for thermal compensation of sensor bias without external components. |
| Interface Support | SPI (3- or 4-wire) and I²C (standard/fast-mode+); supports multi-drop I²C with programmable slave address (0x6A or 0x6B). |
Pinout & Package
LSM6DS0TR is housed in a 3 mm × 3 mm × 0.86 mm plastic land grid array (LGA-16L) package with exposed pad for thermal dissipation and mechanical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Connects to 1.71–3.6 V regulated rail; powers MEMS sensing elements and analog front-end. |
| VDD_IO | Digital I/O supply | Accepts 1.71–3.6 V; sets logic threshold for SDA/SCL/MISO/MOSI/SPC pins - decoupled from VDD for mixed-voltage system integration. |
| SCL/SPC | I²C clock / SPI clock | Shared pin: I²C mode uses open-drain with pull-up; SPI mode uses push-pull - requires mode selection at power-up via SDO/SA0. |
| SDA/SDI | I²C data / SPI data in | Bi-directional I²C line; SPI input during write operations - internal pull-down ensures safe default state during reset. |
| SDO/SA0 | I²C address select / SPI data out | Configures I²C address (0x6A if low, 0x6B if high); outputs SPI read data when enabled - no external pull-up required for address setting. |
| INT1/INT2 | Programmable interrupt outputs | Dual open-drain outputs drive external MCU interrupts; configurable for free-fall, FIFO full, orientation change, or data-ready events. |
| CS | SPI chip select | Active-low enable for SPI communication; must be held high in I²C mode to avoid bus contention. |
| GND | Ground reference | All analog/digital grounds tied internally; external PCB must use solid ground plane under exposed pad for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Independent ODR control | Allows accelerometer to run at 1.6 kHz while gyroscope sleeps - enables low-power motion wake-up without sacrificing responsiveness. |
| Embedded FIFO with 5 operating modes | Bypass, continuous, FIFO, continuous-to-FIFO, and bypass-to-continuous modes reduce host processor load and enable burst data capture without timing jitter. |
| 6D orientation detection | Determines device position (up/down/left/right/front/back) using accelerometer vector magnitude and sign thresholds - no external fusion algorithm required. |
| Free-fall and impact detection | Configurable threshold (ACT_THS) and duration (ACT_DUR) registers trigger INT1 on sustained low-g events - used in drop protection and shock logging. |
| Temperature-compensated calibration | Factory-trimmed sensitivity and zero-rate offsets stored in non-volatile memory; temperature sensor output enables runtime bias correction. |
Applications
| Wearable Motion Tracking | Smartphone Orientation Management |
|---|---|
|
Use Scenario: Real-time gesture recognition and step counting in fitness bands and AR glasses. IC Role / Device Role / Timing Role: Dual-sensor hub providing synchronized 6-axis motion data at 100 Hz ODR with FIFO buffering to absorb MCU latency. Use Value: Enables accurate activity classification using raw accel/gyro fusion while maintaining sub-2 mA average current draw in eco mode. |
Use Scenario: Auto-rotation, screen dimming, and UI adaptation based on device pose and movement. IC Role / Device Role / Timing Role: Primary orientation sensor feeding Android Sensor HAL; 6D detection triggers immediate display rotation without CPU-intensive quaternion math. Use Value: Reduces system-level power by offloading orientation logic to hardware, cutting display controller wake-ups by >40% versus software-only solutions. |
| Industrial Vibration Monitoring | VR/AR Controller Input |
|
Use Scenario: Predictive maintenance on motors and pumps using spectral analysis of vibration signatures. IC Role / Device Role / Timing Role: High-bandwidth data source (up to 3.33 kHz gyroscope ODR) capturing transient harmonics above 1 kHz for FFT-based fault detection. Use Value: Delivers sufficient bandwidth and SNR (65 dB accelerometer noise floor) to distinguish bearing defects from baseline vibration without external amplification. |
Use Scenario: Low-latency head and hand tracking in immersive virtual reality environments. IC Role / Device Role / Timing Role: Core motion engine delivering time-stamped 6-axis samples with <1 ms end-to-end latency from MEMS to host buffer via FIFO burst reads. Use Value: Eliminates motion-to-photon delay artifacts by guaranteeing deterministic data delivery - critical for nausea reduction in VR applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis inertial measurement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DS3TR | Integrated machine learning core (FSM), higher max ODR (6.66 kHz both sensors), same LGA-16 package and pinout. | Enables on-sensor gesture classification; requires updated register map and FSM configuration firmware. | Select for AI-enhanced edge motion processing; retains PCB compatibility but needs firmware migration. |
| ICM-20689 | Higher gyroscope sensitivity (32.8 mdps/LSB @ ±2000 dps), lower noise density (0.004 dps/√Hz), but no embedded temperature sensor. | Better suited for precision stabilization; lacks hardware 6D detection and requires external temp compensation. | Choose when angular accuracy and low-noise performance outweigh integrated features and ease of use. |
Compared with LSM6DS3TR, the LSM6DS0TR offers proven stability and simpler register-level control but lacks on-device ML; versus ICM-20689, it trades raw gyro performance for integrated functionality and broader ecosystem support in ST's motion firmware stack.
Availability
LSM6DS0TR is available at Aetrix Electronics and suitable for wearable motion tracking, smartphone orientation management, industrial vibration monitoring, and VR/AR controller input requiring stable component supply across production lifecycles.
Supply support for LSM6DS0TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in MEMS, microcontrollers, power management, and automotive ICs.
The LSM6DS0TR belongs to ST's iNEMO inertial module family, designed specifically for compact, battery-powered consumer and industrial devices needing reliable 6-axis motion sensing with minimal host processing overhead.
FAQ
What is the maximum SPI clock frequency supported by the LSM6DS0TR?
The LSM6DS0TR supports SPI clock frequencies up to 10 MHz in standard 4-wire mode and 4 MHz in 3-wire mode, as specified in Table 6 of the datasheet. Timing compliance requires tCLKH ≥ 50 ns and tCLKL ≥ 50 ns; exceeding these limits risks register access corruption or FIFO underrun during burst reads.
Does the LSM6DS0TR support automatic sensor synchronization between accelerometer and gyroscope?
No - the LSM6DS0TR does not provide hardware timestamp synchronization or shared sampling clocks. Accelerometer and gyroscope operate on independent internal oscillators, resulting in inherent inter-sensor phase drift. Time alignment must be performed in host firmware using FIFO timestamps or external triggers.
Can the embedded FIFO store data from only one sensor, or is it always interleaved?
The FIFO stores interleaved 6-axis data (X/Y/Z accel + X/Y/Z gyro) when both sensors are active. However, in accelerometer-only mode, it stores only X/Y/Z accel samples; in gyroscope-only mode, only X/Y/Z gyro samples - controlled by the FIFO_CTRL register's WTM and STOP_ON_FTH bits.
Is the LSM6DS0TR RoHS and REACH compliant?
Yes - the LSM6DS0TR is ECOPACK® certified, RoHS-compliant (2011/65/EU), and REACH-compliant (SVHC-free per SVHC Candidate List v24.0). Full compliance documentation, including material declarations and test reports, is available through ST's official product page and Aetrix Electronics' quality portal.
LSM6DS0TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 16-VFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-LGA (3x3)
- Mounting Type:
- Surface Mount
LSM6DS0TR FAQ
1.How can I place an order for LSM6DS0TR through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM6DS0TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM6DS0TR reliable?
The price and inventory of LSM6DS0TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM6DS0TR is usually 5 days.
3.What payment methods are accepted for LSM6DS0TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM6DS0TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM6DS0TR?
LSM6DS0TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM6DS0TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM6DS0TR?
For technical support, including LSM6DS0TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM6DS0TR requirements.
6.How does Aetrix verify that LSM6DS0TR is sourced from the original manufacturer or authorized distributors?
All LSM6DS0TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM6DS0TR meets industry standards.
7.What is the process for return or replacement of LSM6DS0TR?
All LSM6DS0TR units undergo pre-shipment inspection (PSI). If there is an issue with LSM6DS0TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM6DS0TR part is unused and in its original packaging.
Return procedure for LSM6DS0TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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