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STMicroelectronics LSM6DSMUSTR
- Part No.:
- LSM6DSMUSTR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 14-VFLGA Module
- Datasheet:
-
LSM6DSMUSTR.pdf
- Description:
- INEMO INERTIAL MODULE: 3D ACCELE
- Quantity:
- Payment:
- Shipping:
Inventory:1,466
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Product details
Overview
LSM6DSMUSTR from STMicroelectronics is a fully integrated iNEMO inertial module combining a 3D digital accelerometer and 3D digital gyroscope in a single LGA-14 package. It delivers ±2/±4/±8/±16 g acceleration sensing and ±125/±250/±500/±1000/±2000 dps angular rate measurement with 0.65 mA high-performance mode current draw, enabling always-on motion tracking for smartphone camera OIS, wearable step counting, and IoT sensor hub applications.
For engineers reviewing the LSM6DSMUSTR datasheet, LSM6DSMUSTR pinout, LSM6DSMUSTR application, or LSM6DSMUSTR equivalent, this page provides verified technical context on its dual-mode SPI/I²C interface, embedded pedometer and tilt detection functions, FIFO-based batch processing up to 4 kbyte, auxiliary SPI for OIS data streaming, and Android M compliance - all critical for low-power motion-aware system design.
Technical Context
The LSM6DSMUSTR implements independent configurable signal paths: one main I²C/SPI interface for host processor communication and a dedicated auxiliary SPI supporting simultaneous gyroscope and accelerometer output for optical image stabilization (OIS). Its embedded processing includes real-time pedometer, tilt detection, and significant motion recognition using hardware-accelerated finite-state machines.
It features dual operating domains - accelerometer and gyroscope each support multiple power modes (normal, high-performance, low-power) with programmable full-scale ranges and dedicated low-pass filters optimized separately for UI responsiveness and OIS latency requirements. The integrated temperature sensor enables on-chip thermal compensation of bias drift.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.71 V to 3.6 V analog supply - compatible with single-cell Li-ion and standard I/O voltage rails. |
| Power Consumption | 0.65 mA in combo high-performance mode - enables continuous 6-axis sensing without compromising battery life in portable devices. |
| Accelerometer FS Range | ±2/±4/±8/±16 g - selectable per application: ±2 g for precision tilt, ±16 g for shock/vibration monitoring. |
| Gyroscope FS Range | ±125/±250/±500/±1000/±2000 dps - supports both fine-motion UI gestures and high-dynamic-range camera stabilization. |
| FIFO Depth | Up to 4 kbyte - allows extended batched data collection without host CPU wake-up, reducing system power. |
| Embedded Functions | Pedometer, step detector, tilt, significant motion - offloads motion analytics from application processor, lowering overall SoC load. |
| OIS Support | Dedicated auxiliary SPI + configurable gyroscope/accelerometer LPF - enables direct connection to camera actuator drivers with sub-millisecond latency. |
Pinout & Package
LSM6DSMUSTR is housed in a 2.5 mm × 3.0 mm × 0.83 mm plastic land grid array (LGA-14L) package with exposed pad for thermal dissipation and mechanical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog & digital core supply | 1.71–3.6 V input powering MEMS sensors and signal chain; requires local 100 nF decoupling. |
| VDDIO | I/O interface supply | Independent 1.71–3.6 V rail for logic-level compatibility with host MCU; tolerant of VDD mismatch. |
| SCL/SPC | I²C clock / SPI clock | Multiplexed pin supporting either I²C SCL or SPI SPC; configured at power-up via internal strapping options. |
| SDA/SDI | I²C data / SPI data in | Multiplexed bidirectional I²C SDA or unidirectional SPI SDI; enables flexible interface selection without external muxing. |
| SDO/SA0 | I²C address select / SPI data out | Configurable as I²C slave address bit (SA0) or SPI serial data output (SDO); determines device addressing or data streaming path. |
| CS | SPI chip select | Active-low enable for primary SPI interface; required for multi-device SPI bus arbitration. |
| AUX_CS | Auxiliary SPI chip select | Separate chip select for dedicated OIS SPI channel - isolates camera control traffic from main sensor data flow. |
| INT1 / INT2 | Programmable interrupt outputs | Two open-drain outputs supporting free-fall, 6D orientation, click/double-click, and embedded function alerts - reduces polling overhead. |
| DRDY | Data-ready indicator | Push-pull or open-drain configurable signal asserting when new accelerometer/gyro sample is available - synchronizes host read timing. |
| GNDO | Ground (digital) | Digital reference for I/O pins; separated from analog ground (GND) to minimize noise coupling into sensitive MEMS front-end. |
| GND | Ground (analog) | Analog reference for sensor core and ADCs; must be connected to low-impedance ground plane near exposed pad. |
| NC | No connect | Unbonded pad - left floating per datasheet; no external connection permitted. |
| EPAD | Exposed thermal pad | Internally connected to GND; soldering improves thermal performance and mechanical reliability in handheld environments. |
Key Features
| Feature | Design Value |
|---|---|
| Smart FIFO (4 kbyte) | Enables dynamic batching of accelerometer, gyroscope, and timestamped data - eliminates host polling and extends sleep duration in sensor hubs. |
| Android M Compliance | Meets Android Sensor HAL requirements for fused motion sensors, including real/virtual/batch sensor reporting - accelerates OS integration. |
| Dedicated OIS Signal Path | Hardware-isolated auxiliary SPI with configurable LPF and output format - delivers deterministic <1 ms latency for camera actuator control loops. |
| Hard/Soft Iron Calibration | On-chip correction coefficients storage for external magnetometers - simplifies compass calibration in multi-sensor fusion stacks. |
| Embedded Temperature Sensor | Monitors die temperature with ±2 °C accuracy - enables real-time bias and sensitivity compensation for stable performance across -40°C to +85°C. |
Applications
| Smartphone Camera OIS | Wearable Fitness Tracking |
|---|---|
Use Scenario: Real-time correction of hand shake during video capture using gyroscope and accelerometer data. IC Role / Device Role / Timing Role: Dual-axis motion sensor providing synchronized 6DoF data streams via auxiliary SPI to camera ISP with sub-millisecond latency. Use Value: Enables 1080p/4K video stabilization without external motion co-processor, reducing BOM cost and PCB area. |
Use Scenario: Continuous step counting and activity classification during daily wear with minimal power draw. IC Role / Device Role / Timing Role: Always-on inertial engine executing pedometer and tilt detection in hardware while host MCU remains in deep sleep. Use Value: Achieves >7-day battery life on coin-cell power by offloading motion analytics from application processor. |
| IoT Asset Tracking | Industrial Vibration Monitoring |
Use Scenario: Detecting shipment tampering, drop events, and orientation changes in logistics containers. IC Role / Device Role / Timing Role: Event-triggered sensor with free-fall, 6D orientation, and click interrupts driving wake-up of ultra-low-power MCU. Use Value: Reduces average system current to <5 µA in standby while maintaining full event detection capability. |
Use Scenario: Capturing machine vibration spectra for predictive maintenance in factory equipment. IC Role / Device Role / Timing Role: High-bandwidth (up to 6.6 kHz ODR) accelerometer capturing transient shocks and harmonic content. Use Value: Supports FFT-based spectral analysis with 16-bit resolution and ±16 g range - sufficient for ISO 10816-3 Class A/B thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis inertial module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DSOXTR | Higher ODR (6.6 kHz vs 3.3 kHz), improved gyro noise density (0.008 dps/√Hz vs 0.015 dps/√Hz), and enhanced AI-core for ML inference. | Better suited for advanced motion AI (e.g., gesture classification) and higher-fidelity vibration analysis. | Select when requiring >3.3 kHz sampling or on-device neural network execution; otherwise LSM6DSMUSTR offers optimal cost/performance balance. |
| ICM-42688-P | Lower power (0.55 mA HP mode), integrated digital temperature sensor with ±0.5 °C accuracy, and proprietary low-latency OIS mode. | Preferred for premium smartphones prioritizing battery life and OIS latency over feature richness. | Choose for designs where sub-0.6 mA active current and <500 µs OIS loop time are mandatory; LSM6DSMUSTR provides broader embedded function set. |
Compared with LSM6DSOXTR and ICM-42688-P, the LSM6DSMUSTR delivers the most balanced combination of Android M compliance, 4 kbyte smart FIFO, hard/soft iron calibration support, and proven field reliability - making it ideal for mid-tier consumer electronics requiring robust, production-ready motion sensing without over-specification.
Availability
LSM6DSMUSTR is available at Aetrix Electronics and suitable for smartphone OIS systems, wearable fitness trackers, IoT asset monitors, and industrial vibration sensors requiring stable component supply across multi-year production cycles.
Supply support for LSM6DSMUSTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in MEMS, microcontrollers, and power management ICs, with manufacturing facilities certified to ISO 9001 and IATF 16949 standards.
The LSM6DSM series belongs to ST's iNEMO inertial module product line, designed specifically for always-on, low-power motion sensing in mobile, wearable, and IoT edge devices - emphasizing integration, firmware-ready functionality, and Android ecosystem alignment.
FAQ
What interfaces does the LSM6DSMUSTR support, and how are they configured?
The LSM6DSMUSTR supports both I²C and SPI through shared pins (SCL/SPC, SDA/SDI, SDO/SA0), with interface selection determined by power-up strapping and register configuration. It also includes a dedicated auxiliary SPI (AUX_CS) exclusively for OIS data streaming - electrically isolated from the main interface to prevent timing interference.
Does the LSM6DSMUSTR require external components for basic operation?
Yes: two 100 nF ceramic decoupling capacitors (one on VDD, one on VDDIO), a 4.7 kΩ pull-up on SCL/SPC for I²C mode, and proper grounding of the EPAD thermal pad are mandatory per ST's layout guidelines. No external oscillator or calibration circuitry is needed - all timing and compensation are handled internally.
How is the 4 kbyte FIFO managed, and what data types can it store?
The FIFO stores time-stamped accelerometer, gyroscope, and temperature samples in programmable batches. It supports bypass, FIFO, continuous, and hybrid modes. Data format and sensor selection are controlled via FIFO_CTRLx registers; embedded functions like step count generate dedicated FIFO entries with timestamps for host-side aggregation.
Can the LSM6DSMUSTR operate independently of a host processor for motion detection?
No - it lacks autonomous decision-making capability. However, it executes embedded functions (pedometer, tilt, significant motion) in hardware and asserts interrupts (INT1/INT2) upon event detection, allowing the host to remain asleep until required. Full algorithm execution still depends on host firmware or sensor hub processor.
LSM6DSMUSTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 14-VFLGA Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Output Type:
- I2C, SPI
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 14-LGA (2.5x3)
- Mounting Type:
- Surface Mount
LSM6DSMUSTR FAQ
1.How can I place an order for LSM6DSMUSTR through Aetrix?
Please submit a Request for Quotation (RFQ) for LSM6DSMUSTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LSM6DSMUSTR reliable?
The price and inventory of LSM6DSMUSTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LSM6DSMUSTR is usually 5 days.
3.What payment methods are accepted for LSM6DSMUSTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LSM6DSMUSTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LSM6DSMUSTR?
LSM6DSMUSTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LSM6DSMUSTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LSM6DSMUSTR?
For technical support, including LSM6DSMUSTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LSM6DSMUSTR requirements.
6.How does Aetrix verify that LSM6DSMUSTR is sourced from the original manufacturer or authorized distributors?
All LSM6DSMUSTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LSM6DSMUSTR meets industry standards.
7.What is the process for return or replacement of LSM6DSMUSTR?
All LSM6DSMUSTR units undergo pre-shipment inspection (PSI). If there is an issue with LSM6DSMUSTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LSM6DSMUSTR part is unused and in its original packaging.
Return procedure for LSM6DSMUSTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LSM6DSMUSTR Tags
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