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Analog Devices Inc. LT8418ACBZ-R7

Part No.:
LT8418ACBZ-R7
Manufacturer:
Analog Devices Inc.
Category:
Gate Drivers
Package:
12-UFBGA, WLCSP
Datasheet:
AetrixLT8418ACBZ-R7.pdf
Description:
IC GATE DRVR HALF-BRIDGE 12WLCSP
Quantity:
Payment:
Payment
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Inventory:1,131

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Product details

Overview

LT8418ACBZ-R7 from Analog Devices is a 100V half-bridge GaN gate driver with integrated smart bootstrap switch, split gate control, and TTL-compatible inputs. It delivers 4A peak source / 8A peak sink current, 0.6Ω top-side pull-up / 0.2Ω bottom-side pull-down resistance, and 10ns typical propagation delay with 1.5ns matching-enabling high-frequency (>500kHz), high-efficiency DC-DC converters in data center power supplies.

For engineers reviewing the LT8418ACBZ-R7 datasheet, LT8418ACBZ-R7 pinout, LT8418ACBZ-R7 application, or LT8418ACBZ-R7 equivalent, this page provides verified technical context, WLCSP package layout, real-world EMI-optimized gate drive implementation, and validated alternatives for GaN-based buck, half-bridge, and motor drive topologies.

Technical Context

The LT8418ACBZ-R7 integrates dual independent gate drivers (TGP/TGN and BGP/BGN) with programmable turn-on/turn-off slew rates via external resistors, enabling precise EMI suppression without sacrificing switching speed. Its smart bootstrap switch dynamically regulates BST voltage from VCC with <10mV dropout at low refresh and <1V at 100mA, eliminating external Schottky diodes while maintaining VBST ≈ VCC (3.85–5.5V).

It features independent TTL-compatible INT and INB inputs with 200kΩ internal pull-downs, 15V absolute max input rating, and no built-in shoot-through protection-requiring external PWM timing coordination. Undervoltage lockout (3.35V VCC UVLO, 3.1V BST UVLO) and overvoltage lockout (6.0V VCC OVLO) ensure robust GaN FET gate integrity under transient conditions.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 3.85V to 5.5V - powers logic and gate drivers; enables direct use with standard 5V controllers and avoids LDO overhead.
Peak Output Current 4A source / 8A sink - drives high-QG GaN FETs (e.g., EPC2204) at >1MHz with minimal gate resistance.
Propagation Delay 10ns typical (INT→TG, INB→BG) - supports sub-10ns dead-time control in high-frequency synchronous rectification.
Delay Matching 1.5ns typical - ensures balanced top/bottom channel timing critical for zero-voltage switching (ZVS) stability.
Bootstrap Switch RON 6Ω dynamic on-resistance - sustains low-loss BST charging across temperature while preventing overcharge during negative SW excursions.
Input Threshold 1.4V–2.4V rising (INT/INB), 0.4V hysteresis - compatible with 3.3V/5V PWM controllers without level-shifting.
Package 12-ball WLCSP (1.67mm × 1.67mm) - minimizes parasitic inductance for clean 2.5ns rise/fall times (CL = 1nF).

Pinout & Package

LT8418ACBZ-R7 uses a 12-ball Wafer-Level Chip Scale Package (WLCSP) with 0.4mm pitch, optimized for ultra-low inductance and high-power-density layouts. Ball assignment follows JEDEC MO-220 standard CB-12-17.

Pin/Terminal Circuit Role Design Meaning
A1 (BGN) Bottom gate pull-down output Connects to bottom GaN FET gate via resistor to independently tune turn-off slew rate and suppress ringing.
A2 (GND) Power ground reference Must be Kelvin-connected to bottom FET source with low-inductance trace to maintain signal integrity during 8A sink events.
A3/C4 (VCC) Main supply rail Dual-balled for low-impedance path; requires ≥4.7µF ceramic bypass to GND for stable 3.85–5.5V operation.
A4 (INB) Bottom-side PWM input TTL-compatible, 200kΩ internal pull-down; minimum 11ns pulse width ensures reliable switching at >90MHz effective frequency.
B1 (BGP) Bottom gate pull-up output Resistor-programmable turn-on strength; pairs with BGN for asymmetric gate drive optimization.
B4 (INT) Top-side PWM input Independent of INB; same electrical specs as INB but controls TGP/TGN outputs for high-side GaN switching.
C1/D4 (SW) Switch node connection Shared ball for high-current return path; connects to top FET source and BST capacitor negative terminal.
D1 (TGN) Top gate pull-down output Enables independent control of top FET turn-off; critical for managing Miller-induced false turn-on in bootstrapped configurations.
D2 (TGP) Top gate pull-up output Drives top GaN FET gate with 0.6Ω effective RON; requires Kelvin routing to SW to avoid bootstrap voltage error.
D3 (BST) Bootstrap supply output Internally switched from VCC; bypass with ≥100nF ceramic to SW to stabilize floating rail during high-dV/dt transitions.

Key Features

Feature Design Value
Smart integrated bootstrap switch Eliminates external Schottky diode; maintains VBST ≈ VCC with <10mV dropout at light load and prevents overcharge during –3V SW undershoot.
Split-gate driver architecture Four independent gate terminals (TGP/TGN/BGP/BGN) allow separate optimization of dV/dt for EMI reduction without compromising efficiency.
Matched propagation delay 1.5ns typical mismatch between top and bottom channels enables precise dead-time tuning for ZVS in resonant topologies.
Default low-state logic All inputs (INT/INB) and outputs (TGP/TGN/BGP/BGN) default to low via internal 200kΩ/500kΩ pull-downs-preventing unintended GaN turn-on during startup or fault.
Robust protection suite VCC and BST UVLO/OVLO, thermal shutdown, and absolute max ratings up to 116V BST transient ensure reliability in 100V bus applications.

Applications

High-Frequency Buck Converters Data Center VRMs

Use Scenario: 48V-to-12V/20A buck converter operating at 500kHz with EPC2204 GaN FETs.

IC Role / Device Role / Timing Role: Half-bridge gate driver providing matched 10ns propagation delay and split-gate control to minimize switching losses and enable >97% peak efficiency.

Use Value: Enables compact, high-power-density VRM design with reduced gate drive loop inductance and elimination of bootstrap diode BOM line.

Use Scenario: 48V input, dual-output (24V/10A + 12V/20A) power module for AI accelerators.

IC Role / Device Role / Timing Role: Dual-channel GaN driver supporting interleaved buck stages with independent INT/INB timing and synchronized BST regulation.

Use Value: Delivers >96% full-load efficiency with forced-air cooling and eliminates need for external bootstrap diodes across both outputs.

Class-D Audio Amplifiers Industrial Motor Drives

Use Scenario: 100W bridge-tied load (BTL) amplifier using half-bridge GaN output stage.

IC Role / Device Role / Timing Role: High-speed gate driver delivering 2.5ns rise/fall times and <1.5ns delay matching to preserve audio signal fidelity at >500kHz PWM carrier.

Use Value: Reduces THD+N by suppressing gate ringing and enabling precise dead-time control for clean zero-crossing switching.

Use Scenario: 48V-powered BLDC motor controller with trapezoidal commutation at 20kHz switching.

IC Role / Device Role / Timing Role: Robust half-bridge driver with 15V input tolerance and 100V BST rating for operation in noisy industrial environments.

Use Value: Ensures reliable gate drive under voltage transients and enables fast fault recovery via TTL-compatible inputs tied to MCU GPIOs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge GaN driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
LTC7060 Supports up to 100V VCC, includes programmable dead time and floating grounds; lacks integrated bootstrap switch and split-gate outputs. Better suited for high-side-referenced topologies requiring isolated gate drive; not optimized for ultra-high-frequency GaN where BST integration reduces layout complexity. Select LTC7060 when system-level shoot-through risk demands hardware-enforced dead time or when driving discrete high-voltage MOSFETs instead of GaN.
LTC4449 Lower voltage rating (38V max), 3.2A/4.5A peak current, no BST switch or split-gate control; designed for silicon MOSFETs, not GaN. Targeted at cost-sensitive 12–24V industrial motor drives; cannot support 100V bus or GaN-specific gate drive requirements like low RON and fast dV/dt control. Choose LTC4449 only for legacy silicon-based half-bridges below 38V; unsuitable as drop-in replacement for LT8418ACBZ-R7 in GaN designs.

Compared with LTC7060 and LTC4449, the LT8418ACBZ-R7 uniquely combines integrated bootstrap switching, split-gate programmability, and 100V BST capability in a 1.67mm WLCSP-making it the only option that simultaneously enables high-frequency GaN operation, EMI-optimized slew control, and minimal external component count.

Availability

LT8418ACBZ-R7 is available at Aetrix Electronics and suitable for high-frequency DC-DC converters, data center VRMs, and Class-D audio amplifiers requiring stable component supply, long-term lifecycle assurance, and traceable GaN driver sourcing.

Supply support for LT8418ACBZ-R7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, power management, and high-speed connectivity markets.

The LT8418ACBZ-R7 belongs to Analog Devices' GaN-optimized gate driver product line, engineered specifically for high-efficiency, high-frequency power conversion in data centers, computing, and industrial systems where GaN FETs demand low-inductance, matched timing, and intelligent bootstrap management.

FAQ

What is the maximum switching frequency supported by the LT8418ACBZ-R7?

The LT8418ACBZ-R7 supports switching frequencies up to 1MHz in practical buck converter implementations, as validated in Analog Devices' typical application circuits (e.g., 48V-to-24V/10A at 500kHz–1MHz). Its 2.5ns rise/fall times, 10ns propagation delay, and 1.5ns channel matching make it suitable for high-frequency GaN operation-but actual max frequency depends on external GaN FET QG, gate resistance, and PCB layout parasitics. The LT8418ACBZ-R7 itself imposes no hard upper limit beyond its timing specifications.

Does the LT8418ACBZ-R7 include built-in shoot-through protection?

No, the LT8418ACBZ-R7 does not implement hardware-based shoot-through protection. Its INT and INB inputs are fully independent, and asserting both simultaneously turns on both top and bottom GaN FETs. System-level shoot-through prevention must be implemented externally via PWM controller dead-time insertion or MCU firmware coordination. This design choice preserves timing flexibility for advanced modulation schemes like ZVS and phase-shifted full-bridge control.

Can the LT8418ACBZ-R7 drive both enhancement-mode and depletion-mode GaN FETs?

The LT8418ACBZ-R7 is designed for enhancement-mode GaN HEMTs (e.g., EPC, GaN Systems devices) requiring positive gate drive relative to source. It does not support depletion-mode GaN FETs, which require negative turn-off bias-because its outputs (TGP/TGN/BGP/BGN) swing only from SW or GND reference, with no negative voltage generation capability. All confirmed applications in the datasheet use enhancement-mode GaN devices.

What is the purpose of the split-gate terminals (TGP/TGN/BGP/BGN) on the LT8418ACBZ-R7?

The split-gate terminals allow independent adjustment of turn-on (via TGP/BGP) and turn-off (via TGN/BGN) slew rates using external resistors-enabling fine-grained EMI optimization without degrading efficiency. For example, a higher resistor on TGN slows turn-off to reduce dv/dt-induced noise, while a lower resistor on TGP maintains fast turn-on for low conduction loss. This capability is essential for meeting CISPR-32 conducted emissions limits in high-density power supplies.

Is the LT8418ACBZ-R7 pin-compatible with any other Analog Devices gate drivers?

No, the LT8418ACBZ-R7 is not pin-compatible with any other Analog Devices gate driver. Its 12-ball WLCSP footprint, unique pinout (e.g., dual-balled VCC and SW, dedicated BST and split-gate terminals), and GaN-specific feature set (smart bootstrap, 0.2Ω pull-down) differ fundamentally from packages like SOIC-16 (LTC4449) or 16-pin QFN (LTC7060). Migration requires full PCB redesign and layout optimization for low-inductance GaN gate loops.

LT8418ACBZ-R7 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
12-UFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
3.85V ~ 5.5V
Logic Voltage - VIL, VIH:
-
Current - Peak Output (Source, Sink):
4A, 8A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
2.5ns, 2.5ns
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
12-WLCSP (1.67x1.67)

LT8418ACBZ-R7 FAQ

1.How can I place an order for LT8418ACBZ-R7 through Aetrix?

Please submit a Request for Quotation (RFQ) for LT8418ACBZ-R7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LT8418ACBZ-R7 reliable?

The price and inventory of LT8418ACBZ-R7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LT8418ACBZ-R7 is usually 5 days.

3.What payment methods are accepted for LT8418ACBZ-R7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LT8418ACBZ-R7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LT8418ACBZ-R7?

LT8418ACBZ-R7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LT8418ACBZ-R7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LT8418ACBZ-R7?

For technical support, including LT8418ACBZ-R7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LT8418ACBZ-R7 requirements.

6.How does Aetrix verify that LT8418ACBZ-R7 is sourced from the original manufacturer or authorized distributors?

All LT8418ACBZ-R7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LT8418ACBZ-R7 meets industry standards.

7.What is the process for return or replacement of LT8418ACBZ-R7?

All LT8418ACBZ-R7 units undergo pre-shipment inspection (PSI). If there is an issue with LT8418ACBZ-R7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LT8418ACBZ-R7 part is unused and in its original packaging.

Return procedure for LT8418ACBZ-R7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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