Analog Devices Inc. LTC4441IMSE#PBF

Overview

LTC4441IMSE#PBF from Analog Devices (formerly Linear Technology) is a high-speed, 6A peak-current N-channel MOSFET gate driver in a thermally enhanced 10-lead MSOP package with exposed pad. It features an adjustable linear regulator (5V–8V DRVCC output), logic-threshold input tolerant to ±15V, 30ns propagation delay, and integrated leading-edge blanking via open-drain BLANK pin. It drives power MOSFETs in synchronous buck converters and motor control stages where fast switching and source-current sensing are critical.

For engineers reviewing the LTC4441IMSE#PBF datasheet, LTC4441IMSE#PBF pinout, LTC4441IMSE#PBF application, or LTC4441IMSE#PBF equivalent, key selection criteria include its programmable gate drive voltage, <12µA shutdown current, undervoltage lockout on FB pin, overtemperature protection, and compatibility with high-side or low-side N-MOSFET configurations in industrial DC/DC and motor drive systems.

Technical Context

The LTC4441IMSE#PBF implements a dual-stage driver output using an NPN/P-MOS pull-up and N-MOS pull-down (RONL = 0.35Ω typ), enabling 6A peak sourcing/sinking while minimizing cross-conduction via 5ns nonoverlapping timing. Its internal P-channel LDO regulator accepts 5V–25V VIN and delivers stable DRVCC (5V–8V) with ±0.1% load regulation and 370mV dropout at 40mA.

The device integrates a temperature-compensated enable/shutdown comparator (EN/SHDN thresholds: 1.036V/1.21V rising, 0.45V falling), supply-independent CMOS/TTL input thresholds (VIH = 2.4V, VIL = 1.4V, 1V hysteresis), and a dedicated blanking circuit (RBLANK-adjustable, 200ns typical) for current-sense signal integrity in high-dV/dt environments.

Key Specifications

Pinout & Package

Package: 10-Lead Plastic MSOP (MSE) with exposed pad (Pin 11 = GND). Exposed pad must be soldered to PCB ground for thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET gate driver applications.

Compared with LM5113SDX/NOPB and UCC27531DBVR, the LTC4441IMSE#PBF uniquely combines programmable gate voltage, integrated blanking, and thermal/UVLO protection in a single 10-lead MSOP-making it optimal for high-reliability, high-performance DC/DC and motor control where gate drive optimization and sensing integrity are design-critical.

Availability

LTC4441IMSE#PBF is available at Aetrix Electronics and suitable for industrial power supplies, motor control modules, and charge pump circuits requiring stable component supply, extended temperature operation (–40°C to 125°C), and robust gate drive performance.

Supply support for LTC4441IMSE#PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Linear Technology in 2017 and maintains its high-performance analog and power management product lines with rigorous qualification and long-term support.

The LTC4441IMSE#PBF belongs to Linear's high-speed gate driver family, designed specifically for demanding DC/DC converter and motor control applications where precision timing, thermal resilience, and gate voltage flexibility are essential.

FAQ

What is the maximum allowable VIN voltage for the LTC4441IMSE#PBF?

The absolute maximum VIN rating for the LTC4441IMSE#PBF is 28V. Operation above this voltage risks permanent damage. For reliable long-term performance, the recommended maximum continuous VIN is 25V, matching the specified supply range in the Electrical Characteristics table. Exceeding 25V may degrade regulator efficiency and increase junction temperature beyond safe limits, especially with high switching frequencies or poor thermal management.

Does the LTC4441IMSE#PBF support both high-side and low-side N-MOSFET configurations?

Yes, the LTC4441IMSE#PBF supports both high-side and low-side N-MOSFET driving. Its logic-input tolerance (–15V to +15V), independent of VIN or DRVCC, allows direct interface with controllers referenced to either source or ground. The 6A peak output current and low 0.35Ω pull-down resistance ensure robust turn-off even in high-side configurations where Miller capacitance effects are pronounced. Layout best practices (short PGND/SGND traces, exposed pad grounding) remain critical for stability in either topology.

How is the DRVCC voltage programmed on the LTC4441IMSE#PBF?

The DRVCC voltage on the LTC4441IMSE#PBF is programmed using an external resistive divider connected between DRVCC and SGND, with the FB pin tied to the center tap. The top resistor R1 must be 330kΩ for loop stability; R2 is calculated as R2 = 406kΩ / (DRVCC − 1.21V). For example, to set DRVCC = 6.0V, R2 ≈ 84.2kΩ. This configuration allows precise 5V–8V adjustment to match the VGS requirements of specific power MOSFETs without external regulators.

What is the purpose of the BLANK and RBLANK pins on the LTC4441IMSE#PBF?

The BLANK pin is an open-drain output that asserts a programmable blanking window during MOSFET turn-on to suppress current-sense signal ringing. The RBLANK pin sets blanking duration (75ns–700ns) via a resistor to SGND. This feature is exclusive to the 10-lead LTC4441 (including LTC4441IMSE#PBF) and absent in the SO-8 LTC4441-1 variant. It directly interfaces with switching controller SENSE+ inputs to improve current-loop stability in high-dV/dt applications like synchronous rectification.

Is the exposed pad on the LTC4441IMSE#PBF package electrically connected, and how should it be handled?

Yes, the exposed pad (Pin 11) on the LTC4441IMSE#PBF is internally connected to GND and must be soldered to the PCB ground plane. Failure to do so increases thermal resistance from θJA = 38°C/W to >100°C/W, risking thermal shutdown or premature failure under load. The pad also serves as the primary ground return for high-current paths; proper soldering ensures low-inductance grounding and meets the device's thermal and EMI specifications per Linear's layout guidelines.