Analog Devices Inc. LTC4444HMS8E#PBF
- Part No.:
- LTC4444HMS8E#PBF
- Manufacturer:
- Analog Devices Inc.
- Category:
- Gate Drivers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
LTC4444HMS8E#PBF.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8MSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LTC4444HMS8E#PBF from Analog Devices is a high-frequency, high-voltage synchronous N-channel MOSFET gate driver designed for buck and buck-boost DC/DC converters. It drives both high-side (TG) and low-side (BG) N-MOSFETs with 2.5A TG and 3A BG peak pull-up currents, 1.2Ω TG and 0.55Ω BG pull-down resistances, and supports up to 114V bootstrap voltage (BOOST–TS) - enabling operation in 100V-input automotive and telecom power supplies.
For engineers reviewing the LTC4444HMS8E#PBF datasheet, LTC4444HMS8E#PBF pinout, LTC4444HMS8E#PBF application, or LTC4444HMS8E#PBF equivalent, key selection criteria include adaptive shoot-through protection, –40°C to 150°C junction temperature rating, 5ns TG fall time (1nF load), undervoltage lockout thresholds (6.15V falling / 6.6V rising), and thermally enhanced MSOP-8 with exposed GND pad.
Technical Context
The LTC4444HMS8E#PBF implements supply-independent dual-input logic with internal level-shifting for high-side control: TINP (ground-referenced) controls TG output referenced to TS, while BINP controls BG referenced to GND. Its adaptive shoot-through protection monitors TS voltage and input timing to prevent simultaneous conduction - disabling TG if BG remains high, and delaying BG turn-on until TS falls or 150ns after TINP turns off.
Internally, the driver uses bipolar NPN pull-up transistors (Q1/Q2) and N-MOSFET pull-down devices (M1/M2), delivering rail-to-rail swing: TG swings between BOOST and TS (up to 114V differential), BG swings between VCC (7.2–13.5V) and GND. Undervoltage lockout disables outputs when VCC drops below 6.15V, and thermal shutdown activates above 160°C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Operating Range | 7.2V to 13.5V - powers logic, input buffers, and low-side driver directly; sets gate overdrive for low-side MOSFET. |
| BOOST–TS Max Voltage | 114V - enables high-side drive in 100V-input systems with margin for transient spikes. |
| TG Pull-Down Resistance | 1.2Ω (typ) - ensures fast, robust turn-off of high-side MOSFET under high dV/dt conditions. |
| BG Pull-Up Current | 3A peak - delivers high di/dt to charge low-side MOSFET gate capacitance rapidly. |
| UVLO Threshold Hysteresis | 450mV - prevents oscillation during VCC brownout by separating turn-on (6.6V) and turn-off (6.15V) points. |
| Propagation Delay (tPHL BG) | 14–35ns - guarantees tight timing control for high-frequency (>1MHz) synchronous rectification. |
| Junction Temp Range | –40°C to 150°C - qualified for under-hood automotive and industrial high-temp environments. |
Pinout & Package
Package: 8-Lead Plastic MSOP (MS8E) with exposed GND pad (Pin 9), thermally enhanced for θJA = 40°C/W when soldered to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TINP (Pin 1) | High-side input signal | Ground-referenced CMOS-compatible input controlling TG; VIH = 2.75V, VIL = 2.3V. |
| BINP (Pin 2) | Low-side input signal | Ground-referenced CMOS-compatible input controlling BG; same threshold specs as TINP. |
| VCC (Pin 3) | Low-side supply rail | Powers input buffers, logic, and BG driver; also feeds bootstrap diode anode for BOOST. |
| BG (Pin 4) | Low-side gate driver output | Swings between VCC and GND; drives gate of bottom N-MOSFET. |
| NC (Pin 5) | No connect | Not internally bonded; must remain unconnected. |
| BOOST (Pin 6) | High-side bootstrapped supply | Connects to external bootstrap capacitor (to TS); supplies TG driver stage. |
| TG (Pin 7) | High-side gate driver output | Swings between BOOST and TS; drives gate of top N-MOSFET in high-side switch node. |
| TS (Pin 8) | High-side MOSFET source | Reference node for TG output and bootstrap capacitor return; connects to switching node. |
| GND (Pin 9, Exposed Pad) | Power and signal ground | Must be soldered to PCB ground plane for thermal management and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Adaptive shoot-through protection | Monitors TS voltage and input timing to enforce non-overlapping gate drive, eliminating cross-conduction loss without fixed dead-time programming. |
| 114V bootstrap capability | Supports high-side operation in 100V-input systems with 14V headroom for transients and diode drop. |
| 5ns TG fall time (1nF load) | Minimizes high-side MOSFET transition time in linear region, directly reducing switching losses at high frequency. |
| Thermally enhanced MSOP-8 | Exposed GND pad reduces θJA to 40°C/W, enabling reliable 150°C junction operation in compact layouts. |
| Input threshold hysteresis | 450mV separation between VIH and VIL prevents false triggering from noise on TINP/BINP in noisy power environments. |
Applications
| Automotive High-Voltage DC/DC Converters | Telecom Intermediate Bus Converters |
|---|---|
Use Scenario: 48V–60V battery-fed buck converter supplying 12V/20A to ADAS ECUs in electric vehicles. IC Role / Device Role / Timing Role: Drives high-side and low-side N-MOSFETs synchronously; provides adaptive dead-time control via TS monitoring to prevent shoot-through during rapid load transients. Use Value: Enables >96% efficiency at 500kHz switching with 100V-rated MOSFETs, meeting AEC-Q100 H-grade thermal requirements (–40°C to 150°C). | Use Scenario: 48V intermediate bus converter delivering 3.3V/50A to server CPU VRMs in 5G base station power shelves. IC Role / Device Role / Timing Role: Gate driver for high-current, high-frequency synchronous rectification; leverages 3A BG pull-up and 0.55Ω BG pull-down to minimize conduction loss in low-RDS(on) MOSFETs. Use Value: Achieves sub-10ns propagation delays and <6ns BG rise/fall times, supporting stable 1MHz+ operation with minimal gate drive loss. |
| Industrial High-Density Power Modules | Distributed Power Architectures |
Use Scenario: Compact 100W isolated DC/DC module for factory automation controllers requiring 24V/4A output from 100V DC bus. IC Role / Device Role / Timing Role: High-side driver with 114V BOOST–TS rating enables direct use with 100V input without auxiliary bias winding or charge pump. Use Value: Eliminates need for external high-voltage level shifters or isolated gate drivers, reducing BOM count and layout area by >30%. | Use Scenario: Point-of-load regulator in data center rack power distribution, stepping 12V intermediate bus down to 0.8V/100A for FPGA core supply. IC Role / Device Role / Timing Role: Synchronous N-MOSFET driver with ultra-low RDS(on) pull-down (0.55Ω BG) ensuring fast, clean turn-off even with large gate capacitance loads. Use Value: Reduces gate drive energy loss by >40% vs. standard drivers, improving full-load efficiency and easing thermal design in confined spaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage synchronous gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LTC4446IMS8E#PBF | No adaptive shoot-through protection; identical VCC range (7.2–13.5V), 100V abs max TS, same 3A BG/2.5A TG drive strength. | Suitable where controller IC handles dead-time externally or shoot-through risk is mitigated by layout/timing. | Select LTC4446 when system-level timing control is available and cost reduction is prioritized over integrated protection. |
| LTC4440IMS8E#PBF | Max 80V supply; higher VCC range (8–15V); lower peak pull-up (2.4A); no bootstrap capability - high-side only driver requiring external level shifter. | Requires separate low-side driver and level-shifting circuitry; not a drop-in replacement for dual-driver topology. | Choose LTC4440 only for dedicated high-side-only applications with ≤80V input and existing low-side drive solution. |
Compared with LTC4446 and LTC4440, the LTC4444HMS8E#PBF uniquely integrates adaptive shoot-through protection and 114V bootstrap support in a single dual-output package, enabling simpler, more robust high-voltage synchronous buck designs without external timing or level-shifting components.
Availability
LTC4444HMS8E#PBF is available at Aetrix Electronics and suitable for automotive power supplies, telecom intermediate bus converters, and high-density industrial power modules requiring stable component supply across extended temperature ranges.
Supply support for LTC4444HMS8E#PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, industrial automation, communications, and automotive markets.
The LTC4444 belongs to Analog Devices' high-voltage power management IC family, engineered specifically for efficient, robust gate driving in synchronous DC/DC converters operating up to 100V input - emphasizing thermal resilience, noise immunity, and integrated protection.
FAQ
What is the maximum allowable voltage on the TS pin of the LTC4444HMS8E#PBF?
The TS pin of the LTC4444HMS8E#PBF has an absolute maximum rating of –5V to 100V. This allows direct connection to high-side switching nodes in 100V-input buck converters. Operation beyond 100V risks permanent damage; derating is recommended for reliability in transient-heavy environments. The LTC4444HMS8E#PBF's adaptive shoot-through protection relies on accurate TS voltage sensing, so proper PCB layout and grounding are critical for correct function.
Does the LTC4444HMS8E#PBF require external bootstrap diodes and capacitors?
Yes, the LTC4444HMS8E#PBF requires an external bootstrap diode (anode to VCC, cathode to BOOST) and a ceramic capacitor (typically 0.1µF, 100V) between BOOST and TS pins. The diode replenishes charge on the bootstrap capacitor during low-side conduction; its forward voltage drop affects achievable BOOST–TS voltage. The LTC4444HMS8E#PBF does not integrate these components, enabling design flexibility but requiring careful selection for 114V max BOOST–TS operation.
How does the adaptive shoot-through protection in the LTC4444HMS8E#PBF differ from fixed dead-time schemes?
The LTC4444HMS8E#PBF's adaptive shoot-through protection dynamically monitors the TS pin voltage and input timing to enforce non-overlapping gate drive - turning off TG if BG remains high, and delaying BG turn-on until TS falls or 150ns after TINP turns off. Unlike fixed dead-time, this eliminates unnecessary delay during light loads or slow transitions, maximizing efficiency without risking cross-conduction. The LTC4444HMS8E#PBF implements this entirely internally with no external components or configuration required.
What is the thermal performance advantage of the exposed pad on the LTC4444HMS8E#PBF MSOP-8 package?
The exposed GND pad (Pin 9) on the LTC4444HMS8E#PBF MSOP-8 package reduces thermal resistance from junction to ambient (θJA) to 40°C/W when properly soldered to a 2500mm² double-sided 1oz copper ground plane. Without soldering the pad, θJA degrades significantly - potentially exceeding 100°C/W - risking thermal shutdown above 125°C ambient. This feature enables continuous operation at 150°C junction temperature, critical for automotive and industrial applications. The LTC4444HMS8E#PBF datasheet mandates pad soldering for guaranteed specifications.
Can the LTC4444HMS8E#PBF drive both N-channel MOSFETs in a half-bridge configuration without additional level-shifting circuitry?
Yes, the LTC4444HMS8E#PBF is specifically designed to drive both high-side and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration without external level shifters. Its internal level-shifting circuitry translates the ground-referenced TINP signal to the floating TS domain for TG control, while BINP directly controls BG relative to GND. The BOOST–TS rail (up to 114V) provides sufficient gate drive voltage for high-side N-MOSFETs even with 100V input. This integrated capability is a core feature of the LTC4444HMS8E#PBF.
LTC4444HMS8E#PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 7.2V ~ 13.5V
- Logic Voltage - VIL, VIH:
- 1.85V, 3.25V
- Current - Peak Output (Source, Sink):
- 2.5A, 3A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 114 V
- Rise / Fall Time (Typ):
- 8ns, 5ns
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP-EP
LTC4444HMS8E#PBF FAQ
1.How can I place an order for LTC4444HMS8E#PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for LTC4444HMS8E#PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of LTC4444HMS8E#PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LTC4444HMS8E#PBF is usually 5 days.
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5.How can I obtain technical support or documentation for LTC4444HMS8E#PBF?
For technical support, including LTC4444HMS8E#PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LTC4444HMS8E#PBF requirements.
6.How does Aetrix verify that LTC4444HMS8E#PBF is sourced from the original manufacturer or authorized distributors?
All LTC4444HMS8E#PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LTC4444HMS8E#PBF meets industry standards.
7.What is the process for return or replacement of LTC4444HMS8E#PBF?
All LTC4444HMS8E#PBF units undergo pre-shipment inspection (PSI). If there is an issue with LTC4444HMS8E#PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LTC4444HMS8E#PBF part is unused and in its original packaging.
Return procedure for LTC4444HMS8E#PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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