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Analog Devices Inc. LTC4446IMS8E#PBF

Part No.:
LTC4446IMS8E#PBF
Manufacturer:
Analog Devices Inc.
Category:
Gate Drivers
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixLTC4446IMS8E#PBF.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8MSOP
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Payment
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Product details

Overview

LTC4446IMS8E#PBF from Analog Devices (formerly Linear Technology) is a high-frequency, high-voltage dual N-channel MOSFET gate driver optimized for synchronous buck, two-switch forward, and full-bridge DC/DC converters. It delivers 2.5A peak pull-up and 1.2Ω pull-down on the high-side (TG) output, and 3A peak pull-up and 0.55Ω pull-down on the low-side (BG) output, operating with VCC from 7.2V to 13.5V and bootstrap supply up to 114V above ground. It drives external power MOSFETs in automotive power supplies and high-density telecom modules.

For engineers reviewing the LTC4446IMS8E#PBF datasheet, LTC4446IMS8E#PBF pinout, LTC4446IMS8E#PBF application, or LTC4446IMS8E#PBF equivalent, key selection criteria include its 100V absolute max TS rating, absence of adaptive shoot-through protection, thermally enhanced MSOP-8 package with exposed GND pad, and independent level-shifted inputs enabling robust high-side control in isolated topologies.

Technical Context

The LTC4446IMS8E#PBF implements separate CMOS-compatible input buffers for TINP (high-side) and BINP (low-side), each with 450mV hysteresis and thresholds independent of VCC (VIH = 2.75V, VIL = 2.3V). Its high-side driver uses internal level-shifting to operate with BOOST–TS up to 114V, while the low-side driver connects directly to VCC and GND.

Output stage architecture employs bipolar NPN transistors for pull-up (Q1/Q2) and N-channel MOSFETs for pull-down (M1/M2), delivering fast switching: 5ns TG fall time and 3ns BG fall time into 1nF loads at 12V supply. Undervoltage lockout disables both outputs when VCC drops below 6.15V, ensuring safe MOSFET turn-off during brownout conditions.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Operating Range 7.2V to 13.5V - sets minimum gate overdrive for logic-level N-MOSFETs and defines LDO input range for internal biasing
BOOST–TS Max Voltage 114V - enables high-side operation in 100V-input systems with margin for transient spikes
TG Peak Pull-Up Current 2.5A - reduces high-side MOSFET turn-on time and conduction losses in high-Ciss devices
BG Pull-Down Resistance 0.55Ω - ensures rapid low-side MOSFET turn-off, minimizing cross-conduction risk during dead-time transitions
tPHL(TG) Propagation Delay 22ns to 40ns - supports >1MHz switching frequencies in high-efficiency power stages
UVLO Threshold Hysteresis 450mV - prevents oscillatory output behavior near VCC dropout boundary
Thermal Resistance θJA 40°C/W - achievable only with soldered exposed pad to ≥2500 mm² copper area; critical for 125°C junction limit

Pinout & Package

The LTC4446IMS8E#PBF is housed in an 8-lead MSOP package (MS8E) with exposed thermal pad (Pin 9 = GND), requiring PCB soldering for thermal performance. Package dimensions: 3.00mm × 3.00mm × 0.86mm, 0.65mm pitch.

Pin/Terminal Circuit Role Design Meaning
TINP (Pin 1) High-side input signal Ground-referenced CMOS input controlling TG output; level-shifted internally to BOOST domain
BINP (Pin 2) Low-side input signal Ground-referenced CMOS input controlling BG output; independent timing path from TINP
VCC (Pin 3) Low-side supply and logic rail Powers input buffers, logic, and BG driver; also feeds bootstrap diode anode for TG drive
BG (Pin 4) Low-side gate driver output Swings between VCC and GND; drives source of low-side N-MOSFET
NC (Pin 5) No connect Internally unconnected; must remain floating or grounded per layout best practice
BOOST (Pin 6) High-side bootstrapped supply Connects to external capacitor and bootstrap diode; voltage referenced to TS, not GND
TG (Pin 7) High-side gate driver output Swings between BOOST and TS; drives gate of high-side N-MOSFET referenced to switching node
TS (Pin 8) High-side MOSFET source connection Return path for TG output; ties to drain of low-side MOSFET and inductor node in buck topology
Exposed Pad (Pin 9) Thermal ground Mandatory GND connection; primary heat dissipation path-failure to solder degrades θJA severely

Key Features

Feature Design Value
Independent level-shifted inputs Enables true ground-referenced PWM control of high-side switch without external level translators or optocouplers
Asymmetric driver strength 3A BG pull-up + 0.55Ω pull-down prioritizes fast low-side turn-off to suppress shoot-through in hard-switched topologies
Input threshold hysteresis 450mV eliminates false triggering from noise coupling into TINP/BINP traces in high-dV/dt environments
Integrated UVLO with hysteresis Prevents partial gate drive during undervoltage events-forces both MOSFETs fully off until VCC recovers to 6.6V
Exposed thermal pad packaging Reduces junction-to-ambient thermal resistance to 40°C/W when soldered to ≥2500 mm² copper, enabling 1.5W continuous dissipation

Applications

Distributed Power Architectures Automotive Power Supplies

Use Scenario: Intermediate bus conversion in server rack PDUs using 48V input to generate 12V intermediate rails.

IC Role / Device Role / Timing Role: High-side/low-side gate driver controlling synchronous rectification in two-switch forward converter stage.

Use Value: 114V BOOST–TS rating accommodates 48V bus transients; 2.5A/3A peak currents reduce switching losses in 100A+ output designs.

Use Scenario: 12V/24V battery-powered ADAS ECU supplying 3.3V/5V rails via high-efficiency buck converter.

IC Role / Device Role / Timing Role: Dual N-MOSFET driver in compact synchronous buck regulator powering radar processor and sensor interface.

Use Value: –40°C to 85°C guaranteed operation matches automotive under-hood requirements; low quiescent current (350μA) extends cold-cranking runtime.

High Density Power Modules Telecommunication Systems

Use Scenario: 1U AC/DC front-end with isolated full-bridge DC/DC stage delivering 12V/35A to baseband processing units.

IC Role / Device Role / Timing Role: Gate driver for Si7852DP power MOSFETs in LLC resonant half-bridge secondary side synchronous rectification.

Use Value: 5ns/3ns fall times minimize dead-time losses; MS8E package footprint saves >30% board area vs SOIC-8 alternatives.

Use Scenario: 36V–72V telecom rectifier feeding 48V backplane with hot-swap and OR-ing functionality.

IC Role / Device Role / Timing Role: High-side driver for N-MOSFET OR-ing FETs in redundant power feed architecture.

Use Value: 100V absolute max TS rating withstands load-dump transients; independent TINP/BINP allows precise timing control for zero-voltage switching sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage dual N-channel MOSFET driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
LTC4444IMS8E#PBF Includes adaptive shoot-through protection; identical 2.5A/3A drive strength and 100V TS rating Required where dynamic dead-time adjustment is needed to prevent cross-conduction in variable-frequency or resonant topologies Select LTC4444IMS8E#PBF if shoot-through immunity is mandatory; LTC4446IMS8E#PBF offers lower propagation delay (22ns vs 25ns tPHL) for fixed-frequency hard-switched designs
LTC4442IMS8E#PBF Higher 5A peak output current but limited to 38V max TS; no bootstrap capability for high-side drive Suitable only for low-voltage half-bridge or low-side-only configurations where TS ≤ 38V Choose LTC4442IMS8E#PBF for cost-sensitive 12V/24V systems needing higher peak current; LTC4446IMS8E#PBF remains necessary for >38V high-side operation

Compared with LTC4444IMS8E#PBF, the LTC4446IMS8E#PBF trades adaptive shoot-through protection for faster propagation delay and simpler timing control-ideal for fixed-frequency synchronous buck converters. Versus LTC4442IMS8E#PBF, it sacrifices peak current for 114V bootstrap capability, making it the only option among the three for 48V+ telecom and automotive high-side gate drive.

Availability

LTC4446IMS8E#PBF is available at Aetrix Electronics and suitable for distributed power architectures, automotive power supplies, and high-density power modules requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for LTC4446IMS8E#PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Linear Technology in 2017 and maintains its legacy high-performance analog IC portfolio, including precision power management solutions for demanding industrial and automotive applications.

The LTC4446IMS8E#PBF belongs to Linear's high-voltage gate driver product line, designed specifically for efficient, reliable control of N-channel MOSFETs in isolated and non-isolated DC/DC converters operating up to 100V input.

FAQ

What is the maximum allowable voltage on the TS pin of the LTC4446IMS8E#PBF?

The TS pin of the LTC4446IMS8E#PBF has an absolute maximum rating of 100V relative to GND. This rating enables use in 48V and 72V telecom and industrial power systems where switching-node transients may exceed nominal input voltage. Operation beyond this limit risks permanent damage to the internal level-shifter and high-side driver circuitry.

Does the LTC4446IMS8E#PBF provide adaptive shoot-through protection?

No, the LTC4446IMS8E#PBF does not include adaptive shoot-through protection. Unlike the LTC4444IMS8E#PBF, it relies on externally controlled dead-time insertion between TINP and BINP signals. This design simplifies timing control in fixed-frequency applications but requires careful PCB layout and controller coordination to avoid cross-conduction.

How should the exposed thermal pad (Pin 9) of the LTC4446IMS8E#PBF be connected?

The exposed thermal pad (Pin 9) of the LTC4446IMS8E#PBF must be soldered directly to a solid GND plane on the PCB. Per Linear's datasheet, failure to do so increases θJA beyond 40°C/W, risking thermal shutdown or reduced lifetime. Recommended layout uses ≥2500 mm² copper area with multiple thermal vias to inner-layer GND planes.

What is the purpose of the NC pin (Pin 5) on the LTC4446IMS8E#PBF?

Pin 5 of the LTC4446IMS8E#PBF is a no-connect terminal with no internal connection. It must remain unconnected-neither tied to GND nor routed-to avoid parasitic coupling or mechanical stress on the bond wire. Leaving it floating is the only recommended configuration per Linear's package documentation.

Can the LTC4446IMS8E#PBF drive both high-side and low-side N-MOSFETs in a synchronous buck converter?

Yes, the LTC4446IMS8E#PBF is explicitly designed for synchronous buck topologies: TG drives the high-side N-MOSFET gate referenced to the switching node (TS), while BG drives the low-side N-MOSFET gate referenced to GND. Its bootstrap architecture and independent inputs enable full control of both switches without external level shifters.

LTC4446IMS8E#PBF Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
7.2V ~ 13.5V
Logic Voltage - VIL, VIH:
1.85V, 3.25V
Current - Peak Output (Source, Sink):
2.5A, 3A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
114 V
Rise / Fall Time (Typ):
8ns, 5ns
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP-EP

LTC4446IMS8E#PBF FAQ

1.How can I place an order for LTC4446IMS8E#PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for LTC4446IMS8E#PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LTC4446IMS8E#PBF reliable?

The price and inventory of LTC4446IMS8E#PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LTC4446IMS8E#PBF is usually 5 days.

3.What payment methods are accepted for LTC4446IMS8E#PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LTC4446IMS8E#PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LTC4446IMS8E#PBF?

LTC4446IMS8E#PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LTC4446IMS8E#PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LTC4446IMS8E#PBF?

For technical support, including LTC4446IMS8E#PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LTC4446IMS8E#PBF requirements.

6.How does Aetrix verify that LTC4446IMS8E#PBF is sourced from the original manufacturer or authorized distributors?

All LTC4446IMS8E#PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LTC4446IMS8E#PBF meets industry standards.

7.What is the process for return or replacement of LTC4446IMS8E#PBF?

All LTC4446IMS8E#PBF units undergo pre-shipment inspection (PSI). If there is an issue with LTC4446IMS8E#PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LTC4446IMS8E#PBF part is unused and in its original packaging.

Return procedure for LTC4446IMS8E#PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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