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Analog Devices Inc. LTC7063RMSE#PBF
- Part No.:
- LTC7063RMSE#PBF
- Manufacturer:
- Analog Devices Inc.
- Category:
- Gate Drivers
- Package:
- 12-TSSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
LTC7063RMSE#PBF.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 12MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:199
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Product details
Overview
LTC7063RMSE#PBF from Analog Devices is a 150V half-bridge gate driver IC for dual N-channel MOSFETs in high-noise industrial and automotive power converters. It features independent floating grounds (SW and BGRTN), 0.8Ω pull-down / 1.5Ω pull-up drivers, programmable dead-time via external resistor, adaptive shoot-through protection, and AEC-Q100 qualification. It operates with VCC = 6–14V and supports up to 140V input voltage independent of VCC.
For engineers reviewing the LTC7063RMSE#PBF datasheet, LTC7063RMSE#PBF pinout, LTC7063RMSE#PBF application, or LTC7063RMSE#PBF equivalent, key selection considerations include its symmetric floating architecture enabling ±10V ground differential tolerance, three-state PWM input with internal resistive divider for high-Z mode, open-drain FLT fault flag, and thermally enhanced 12-lead MSOP package with exposed SGND pad.
Technical Context
The LTC7063RMSE#PBF implements dual independent level-shifted drivers: one referenced to SW (high-side) and one to BGRTN (low-side), each with dedicated UVLO monitoring on BST–SW and BGVCC–BGRTN. Its adaptive shoot-through protection actively monitors gate-source voltage transitions to prevent simultaneous conduction, unlike fixed-delay schemes.
Dead-time is precisely set by an external resistor on the DT pin (32ns to 250ns range), while the three-state PWM input enables seamless DCM operation without requiring external logic. The EN pin provides synchronous disable with 1.2V threshold and internal 2MΩ pull-down, and the FLT pin reports VCC UVLO/OVLO, floating supply UVLO, and thermal shutdown with 100µs release delay.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Input Voltage | 150V absolute max rating; supports 140V continuous operation independent of VCC supply |
| Driver Strength | 0.8Ω pull-down / 1.5Ω pull-up typical at 10V supply → enables fast switching of high-Ciss MOSFETs |
| VCC Range | 6V to 14V operating range with 5.3V falling UVLO and 14.6V rising OVLO thresholds |
| Floating Supply Range | 4V to 14V for both BST–SW and BGVCC–BGRTN; UVLO at 3.4V with 0.3V hysteresis |
| Propagation Delay | 17ns tPHL(TG/BG); 30–36ns tPH/PL(EN); dead-time adjustable from 32ns to 250ns via RDT |
| Package | 12-lead plastic MSOP with exposed thermal pad (Pin 13 = SGND), θJA = 40°C/W |
| Temperature Range | –40°C to +150°C junction temperature; AEC-Q100 qualified for automotive applications |
Pinout & Package
Package: 12-lead plastic MSOP (MSE) with exposed thermal pad (Pin 13 = SGND), rated for –40°C to +150°C junction temperature and θJA = 40°C/W. Exposed pad must be soldered to PCB ground for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWM | Three-state logic input | Drives TG/BG complementary; floating state triggers high-Z mode (both outputs off) via internal resistor divider |
| EN | Enable control input | Logic-high (>1.2V) enables output switching; internal 2MΩ pull-down ensures default disable |
| FLT | Open-drain fault indicator | Pulls low during VCC UVLO/OVLO, floating supply UVLO, or thermal shutdown; 60Ω typical pull-down, 100µs release delay |
| DT | Dead-time programming node | Resistor to SGND sets BG/TG low-to-high propagation delay (32–250ns); no capacitor required |
| VCC | IC bias supply | Powers internal circuitry (including 4.5V regulator); independent of VIN; requires 0.1µF bypass to SGND |
| BGVCC | Low-side driver supply | Bias voltage for BG output relative to BGRTN; supports bootstrapped or isolated supply |
| BST | High-side driver supply | Bias voltage for TG output relative to SW; supports bootstrapped or isolated supply |
| TG | High-side gate driver output | Drives N-MOSFET gate between BST and SW; Kelvin connection to MOSFET gate minimizes noise coupling |
| SW | High-side driver return | Reference for TG and BST; Kelvin-connected to top MOSFET source; tolerates –10V to +150V vs SGND |
| BG | Low-side gate driver output | Drives N-MOSFET gate between BGVCC and BGRTN; Kelvin connection to MOSFET gate improves noise immunity |
| BGRTN | Low-side driver return | Reference for BG and BGVCC; Kelvin-connected to bottom MOSFET source; tolerates –10V to +150V vs SGND |
| SGND | Chip ground / thermal pad | Reference for VCC, EN, PWM, DT, FLT; exposed pad (Pin 13) must be soldered to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Symmetric floating architecture | Independent SW and BGRTN references enable ±10V ground differential tolerance-critical in high-dv/dt motor drives and telecom PSUs |
| Adaptive shoot-through protection | Monitors actual MOSFET VGS transitions-not fixed timing-to eliminate cross-conduction under varying load/temperature conditions |
| Three-state PWM with auto high-Z | Internal resistor divider pulls PWM to ~2.1V when floating, forcing both TG and BG low-enables lossless DCM without controller-level logic |
| Programmable dead-time | RDT-based adjustment (32–250ns) allows precise optimization for specific MOSFET Qg, layout parasitics, and efficiency targets |
| AEC-Q100 qualification | Validated for automotive power systems including 48V DC-DC, traction inverters, and battery management interfaces |
Applications
| Automotive 48V DC-DC Converters | Industrial Motor Drives |
|---|---|
Use Scenario: High-efficiency bidirectional buck-boost conversion in 48V mild-hybrid architectures with stringent EMI and reliability requirements. IC Role / Device Role / Timing Role: Half-bridge gate driver controlling dual N-MOSFETs in synchronous rectification stage; manages dead-time and shoot-through under rapid load transients. Use Value: ±10V ground differential tolerance prevents false triggering during high-current switching; AEC-Q100 qualification ensures long-term operation at 150°C junction temperature. | Use Scenario: Isolated gate driving in three-phase inverter stages for HVAC compressors and servo amplifiers operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: Floating high- and low-side driver providing independent level-shifting for each leg; enables compact, low-parasitic gate loop design. Use Value: 0.8Ω pull-down strength ensures rapid MOSFET turn-off under high Ciss loads; adaptive shoot-through protection eliminates need for conservative fixed dead-time margins. |
| Telecom Rectifier Modules | Server VRMs & Multiphase Converters |
Use Scenario: High-density 48V-to-12V intermediate bus conversion in telecom rectifier shelves where thermal management and transient response are critical. IC Role / Device Role / Timing Role: Gate driver in interleaved half-bridge topology; coordinates phase-shifted switching across multiple LTC7063RMSE#PBF units. Use Value: Programmable dead-time (via matched RDT) ensures consistent timing across parallel channels; FLT pin enables centralized fault reporting in modular power systems. | Use Scenario: 6-phase or higher multiphase buck converter supplying CPU/GPU core voltage in AI servers, requiring tight phase current matching and fast transient response. IC Role / Device Role / Timing Role: Per-phase gate driver delivering precise, low-jitter switching with minimal propagation delay mismatch (<5ns typical). Use Value: 17ns tPHL and <1ns inter-channel skew enable sub-100ns dead-time control; exposed thermal pad sustains >3A peak gate drive current per phase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM5109BMM/NOPB | Fixed 500ns dead-time; no adaptive shoot-through protection; 100V max VBS; no three-state PWM | Lower-voltage industrial SMPS only; unsuitable for 140V+ or automotive applications requiring dynamic dead-time tuning | Select LTC7063RMSE#PBF when ±10V ground differential, programmable dead-time, or AEC-Q100 compliance is required |
| UCC27211DRCR | 120V max VDD; no floating supply UVLO; fixed 12ns propagation delay; no DT pin or FLT flag | Cost-sensitive consumer power supplies; lacks fault reporting and robust floating-supply monitoring needed for mission-critical systems | Select LTC7063RMSE#PBF for designs requiring integrated fault signaling, dual floating UVLO, or operation above 120V input |
Compared with LM5109BMM/NOPB and UCC27211DRCR, the LTC7063RMSE#PBF delivers superior noise immunity via independent floating grounds, enables precision dead-time optimization across temperature and load, and provides comprehensive fault visibility through the FLT pin-making it the preferred choice for high-reliability 140V-class power stages.
Availability
LTC7063RMSE#PBF is available at Aetrix Electronics and suitable for automotive 48V DC-DC converters, industrial motor drives, and telecom rectifier modules requiring stable component supply, AEC-Q100 qualification, and guaranteed long-term availability.
Supply support for LTC7063RMSE#PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets.
The LTC7063RMSE#PBF belongs to Analog Devices' Power by Linear™ high-voltage gate driver family, engineered specifically for robust, high-efficiency half-bridge control in demanding automotive and industrial power systems.
FAQ
What is the maximum allowable voltage difference between SGND and BGRTN or SW for the LTC7063RMSE#PBF?
The LTC7063RMSE#PBF supports a voltage difference of –10V to +150V between SGND and either BGRTN or SW. This ±10V ground differential tolerance is enabled by its symmetric floating architecture and is explicitly validated for high-noise environments such as motor drives and telecom rectifiers. The device maintains full functionality-including UVLO monitoring and shoot-through protection-across this full range, provided BGVCC–BGRTN and BST–SW remain within their 4V–14V operating limits.
How does the three-state PWM input of the LTC7063RMSE#PBF function during controller sleep or fault conditions?
When the PWM pin of the LTC7063RMSE#PBF is left floating (e.g., during microcontroller sleep or communication loss), its internal resistor divider pulls the pin to ~2.1V-within the high-Z window between VIH(BG) and VIL(TG). This forces both TG and BG outputs low, safely turning off both external MOSFETs without requiring active controller intervention. This behavior enables lossless discontinuous conduction mode (DCM) and simplifies fault-handling logic in synchronous buck and resonant topologies.
Can the LTC7063RMSE#PBF drive logic-level MOSFETs, or is it optimized for higher-threshold devices?
The LTC7063RMSE#PBF supports gate driver supply voltages from 4V to 14V on both BST–SW and BGVCC–BGRTN, making it compatible with logic-level MOSFETs. However, its driver strength (0.8Ω pull-down / 1.5Ω pull-up) and internal thresholds are optimized for higher-threshold MOSFETs-particularly those requiring ≥10V VGS for full enhancement. At 4V supply, pull-up resistance increases significantly, reducing peak current and slowing rise time; thus, 10V operation is recommended for best performance with standard MOSFETs.
What is the role of the exposed pad (Pin 13) on the LTC7063RMSE#PBF MSOP package?
The exposed pad (Pin 13) on the LTC7063RMSE#PBF is electrically and thermally connected to SGND. It must be soldered to a PCB ground plane to achieve the specified θJA = 40°C/W thermal resistance and ensure reliable operation at full load. Failure to solder this pad results in excessive junction temperature rise, premature thermal shutdown, and potential long-term reliability degradation-especially in automotive or industrial applications where ambient temperatures exceed 85°C.
Does the LTC7063RMSE#PBF provide overtemperature protection, and how does it behave during thermal fault?
Yes, the LTC7063RMSE#PBF includes overtemperature protection that activates at approximately 180°C junction temperature. Upon detection, it forces BG low (to BGRTN) and TG low (to SW), turning off both external MOSFETs. Normal operation resumes automatically once the junction temperature cools below ~165°C. This thermal shutdown is not production-tested but is guaranteed to protect the IC under sustained overload or inadequate heatsinking-critical for unattended industrial and automotive deployments.
LTC7063RMSE#PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-TSSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- -
- Driven Configuration:
- Half-Bridge
- Channel Type:
- -
- Number of Drivers:
- -
- Gate Type:
- -
- Voltage - Supply:
- 6V ~ 14V
- Logic Voltage - VIL, VIH:
- -
- Current - Peak Output (Source, Sink):
- -
- Input Type:
- -
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- -
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-MSOP-EP
LTC7063RMSE#PBF FAQ
1.How can I place an order for LTC7063RMSE#PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for LTC7063RMSE#PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LTC7063RMSE#PBF reliable?
The price and inventory of LTC7063RMSE#PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LTC7063RMSE#PBF is usually 5 days.
3.What payment methods are accepted for LTC7063RMSE#PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LTC7063RMSE#PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LTC7063RMSE#PBF?
LTC7063RMSE#PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LTC7063RMSE#PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LTC7063RMSE#PBF?
For technical support, including LTC7063RMSE#PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LTC7063RMSE#PBF requirements.
6.How does Aetrix verify that LTC7063RMSE#PBF is sourced from the original manufacturer or authorized distributors?
All LTC7063RMSE#PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LTC7063RMSE#PBF meets industry standards.
7.What is the process for return or replacement of LTC7063RMSE#PBF?
All LTC7063RMSE#PBF units undergo pre-shipment inspection (PSI). If there is an issue with LTC7063RMSE#PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LTC7063RMSE#PBF part is unused and in its original packaging.
Return procedure for LTC7063RMSE#PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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