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Analog Devices Inc./Maxim Integrated MAX17000AETG+T
- Part No.:
- MAX17000AETG+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Power Management - Specialized
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
MAX17000AETG+T.pdf
- Description:
- IC PWM CTLR DDR/DDR2/DDR3 24TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,084
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Product details
Overview
The MAX17000AETG+T from Maxim Integrated is a highly integrated DDR2/DDR3 memory power-management IC combining a Quick-PWM™ step-down controller (VDDQ), ±2A source-sink LDO (VTT), and ±3mA reference buffer (VTTR) in a single 24-pin thin QFN package. It delivers precise 1.5V/1.8V or adjustable 1.0V–2.5V VDDQ with 1% accuracy, supports SSTL-15/SSTL-18 termination, and enables notebook memory subsystems with 100ns load-step response and programmable 200–600kHz switching.
For engineers reviewing the MAX17000AETG+T datasheet, MAX17000AETG+T pinout, MAX17000AETG+T application, or MAX17000AETG+T equivalent, this page provides verified technical context, validated pin functions, confirmed DDR2/DDR3 memory rail generation capability, real-world transient performance data, and two rigorously cross-checked alternative parts for memory power design continuity.
Technical Context
The MAX17000AETG+T implements a constant-on-time Quick-PWM™ architecture for its primary VDDQ buck regulator, enabling stable operation across wide VIN/VOUT ratios (3V–26V input, 1.0V–2.5V output) while maintaining fixed-frequency behavior and delivering 100ns response to load transients. Valley current-limit sensing ensures accurate overcurrent protection at 15–25mV sense voltage.
Its integrated VTT regulator operates in true source-sink mode with ±5mV deadband, dynamically sourcing or sinking up to ±2A to match DDR bus termination current demands without requiring large output capacitance. VTTR buffers the reference at ±3mA with ≤20mV accuracy, tracking either VCSL/2 or an external 0.5V–1.5V REFIN voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDDQ Output Voltage | Preset 1.5V or 1.8V; adjustable 1.0V–2.5V via resistor divider; 1% accuracy over line/load ensures DDR compliance. |
| VDDQ Switching Frequency | Programmable 200kHz–600kHz via RTON; enables optimization of efficiency vs. size using standard inductors/capacitors. |
| VTT Source/Sink Capability | ±2A peak; ±5mV deadband allows fast bidirectional response to DDR burst currents without overshoot. |
| VTT Output Accuracy | ±5mV under source/sink loads up to ±300mA; eliminates need for external trimming in SSTL-15/18 systems. |
| VTTR Reference Buffer | ±3mA drive; ±20mV accuracy tracking VCSL/2 or 0.5V–1.5V REFIN; supplies stable reference to memory controller and DRAM devices. |
| Load-Step Response | 100ns for VDDQ; enables stable DDR3 operation during high-speed read/write transitions without added bulk capacitance. |
| Operating Temperature | -40°C to +85°C; qualified for notebook thermal environments including battery-powered standby and active compute states. |
Pinout & Package
Package: 24-pin, 4mm × 4mm thin QFN with exposed pad (EP), RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 OVP | SMPS Overvoltage Control | Enables/disables SMPS OV protection and internal discharge FETs; high = enable, low = disable. |
| 2 PGOOD1 | VDDQ Power-Good Monitor | Open-drain output indicating VDDQ regulation status; low during fault, soft-start, or shutdown. |
| 4 STDBY | VTT Standby Enable | Controls VTT output state: low disables VTT (high-Z), high enables full ±2A source/sink operation. |
| 5 VTTS | VTT Sense Input | Feedback node for VTT regulation; connected directly to VTT output for accurate closed-loop control. |
| 6 VTTR | Termination Reference Output | Buffered reference output tracking VCSL/2 or REFIN; decoupled with 0.33μF ceramic to AGND. |
| 11 FB | VDDQ Feedback Input | Sets VDDQ output: tied to AGND = 1.5V, VCC = 1.8V, or resistive divider = 1.0V–2.5V adjustable. |
| 14 TON | Switching Frequency Set | Resistor-to-VIN sets frequency per f = 1/(CTON × (RTON + 6.5kΩ)); CTON = 16.26pF internal. |
| 19 VDD | DL Gate Driver Supply | +4.5V to +5.5V supply for synchronous rectifier driver; bypassed with ≥1μF ceramic to PGND1. |
| 23 VCC | Main Controller Supply | +4.5V to +5.5V analog/digital core supply; bypassed with ≥1μF ceramic to AGND. |
| 24 SHDN | Global Shutdown Control | Active-low input initiating controlled ramp-down; rising edge clears OV fault latch. |
Key Features
| Feature | Design Value |
|---|---|
| Quick-PWM™ VDDQ Controller | 100ns load-step response with constant-frequency behavior avoids instability seen in conventional COT schemes. |
| VTT Source-Sink LDO | ±2A bidirectional capability with ±5mV deadband reduces required output capacitance by >50% vs. traditional linear regulators. |
| Three-Mode Operation | SKIP (efficiency), forced-PWM (low noise), and STDBY (VTT off) modes support dynamic power-state management in notebooks. |
| Dual Power-Good Monitoring | Independent open-drain PGOOD1 (VDDQ) and PGOOD2 (VTT) outputs simplify system-level power sequencing and fault reporting. |
| Integrated Discharge FETs | Internal MOSFETs discharge VDDQ and VTT on shutdown when OVP = high, meeting DDR JEDEC fast-ramp-down requirements. |
Applications
| DDR3 Notebook Memory Subsystem | SSTL-15 Termination Supply |
|---|---|
|
Use Scenario: High-performance ultrabook with dual-channel DDR3-1600 memory operating at 1.5V VDDQ and SSTL-15 termination. IC Role / Device Role / Timing Role: Generates and regulates VDDQ, VTT, and VTTR rails simultaneously; manages power sequencing and fault signaling per JEDEC spec. Use Value: Eliminates need for three discrete regulators; achieves <100ns VDDQ transient response critical for DDR3 timing margins. |
Use Scenario: Embedded industrial controller using DDR3 SODIMM with strict SSTL-15 compliance (VTT = 0.75V ± 25mV). IC Role / Device Role / Timing Role: Provides precision VTT regulation referenced to VCSL/2; maintains tight deadband during bidirectional I/O bursts. Use Value: Delivers ±5mV VTT accuracy at ±300mA load-meets SSTL-15 specification without external calibration. |
| DDR2 Memory Power for Thin Clients | Low-Power DDR3 Standby Mode |
|
Use Scenario: Fanless thin client with DDR2-800 memory requiring efficient 1.8V VDDQ and 0.9V VTT during video playback. IC Role / Device Role / Timing Role: Configured for 1.8V VDDQ (FB = VCC) and VTT = VCSL/2; uses SKIP mode for >85% light-load efficiency. Use Value: Reduces no-load quiescent current to 1μA in shutdown, extending battery life during display-off states. |
Use Scenario: Convertible laptop entering S3 suspend with DDR3 memory retained but I/O inactive. IC Role / Device Role / Timing Role: STDBY pin deactivates VTT while maintaining VDDQ and VTTR; PGOOD2 forced low signals memory controller to halt VTT traffic. Use Value: Cuts VTT-related power loss by >95% during standby without compromising VDDQ retention integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR memory power-management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6260CRZ-T | Single-output buck controller (VDDQ only); requires external VTT LDO and VTTR buffer; no integrated VTT source-sink capability. | Supports DDR2/DDR3 VDDQ but lacks monolithic VTT/VTTR integration; needs ≥3 additional components for full memory rail solution. | Select when board space allows discrete VTT implementation or when legacy ISL6260-based designs require minimal change. |
| TPS51220ARUKT | Integrated VDDQ + VTT (±3A) + VTTR; supports DDR3L (1.35V) and DDR4; higher VTT current but no SKIP mode-forced PWM only. | Targets DDR3L/DDR4 notebooks; offers wider VDDQ range (0.5V–2.0V) and higher VTT sink capability but lacks low-noise SKIP mode for audio-sensitive platforms. | Prefer for DDR3L/DDR4 upgrades or where >±2A VTT sink is required; avoid if forced-PWM EMI constraints exist. |
Compared with ISL6260CRZ-T, MAX17000AETG+T reduces BOM count by integrating VTT/VTTR and adds SKIP mode for acoustic noise reduction; versus TPS51220ARUKT, it trades DDR4 readiness for lower EMI and proven DDR2/DDR3 compatibility in cost-sensitive notebooks.
Availability
The MAX17000AETG+T is available at Aetrix Electronics and suitable for notebook computers, DDR2/DDR3 memory modules, and SSTL memory supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX17000AETG+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management solutions for computing, communications, and industrial markets.
The MAX17000AETG+T belongs to Maxim's notebook power-management product line, designed specifically to consolidate DDR2/DDR3 memory rail generation into a single IC-reducing footprint, improving transient response, and simplifying JEDEC-compliant power sequencing.
FAQ
What is the maximum input voltage rating for the MAX17000AETG+T?
The MAX17000AETG+T supports an absolute maximum input voltage of 26V on the VIN pin, with recommended operating range from 3V to 26V. This wide input range accommodates varied notebook adapter voltages (7V–20V typical) and ensures robustness against input transients without external clamping.
How does the MAX17000AETG+T achieve 100ns load-step response on VDDQ?
The MAX17000AETG+T achieves 100ns VDDQ load-step response through its proprietary Quick-PWM™ constant-on-time architecture, which eliminates loop compensation delays inherent in voltage-mode controllers and avoids frequency modulation artifacts of conventional COT schemes-enabling near-instantaneous duty-cycle adjustment.
Can the MAX17000AETG+T generate both DDR2 and DDR3 termination voltages?
Yes-the MAX17000AETG+T supports DDR2 (VTT = VCSL/2 = 0.9V) and DDR3 (VTT = VCSL/2 = 0.75V) termination by internally dividing the VCSL feedback voltage; it also accepts external 0.5V–1.5V REFIN for non-standard or SSTL-12/18 configurations.
What is the purpose of the STDBY pin on the MAX17000AETG+T?
The STDBY pin on the MAX17000AETG+T controls VTT output state independently of VDDQ: when pulled low, it forces VTT into high-impedance mode (disabling source/sink), allowing memory controller to retain VDDQ while halting termination current-critical for S3 suspend in DDR systems.
Does the MAX17000AETG+T include built-in protections?
Yes-the MAX17000AETG+T integrates valley current-limit protection (15–25mV threshold), overvoltage (OVP) and undervoltage (UVLO) detection on VCC and FB, thermal shutdown at 160°C, and dual independent power-good comparators (PGOOD1/PGOOD2) with programmable hysteresis.
MAX17000AETG+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- Quick-PWM™
- Package/Case:
- 24-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Memory, DDR2/DDR3 Regulator
- Current - Supply:
- 2mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TQFN (4x4)
MAX17000AETG+T FAQ
1.How can I place an order for MAX17000AETG+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX17000AETG+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX17000AETG+T reliable?
The price and inventory of MAX17000AETG+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX17000AETG+T is usually 5 days.
3.What payment methods are accepted for MAX17000AETG+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX17000AETG+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX17000AETG+T?
MAX17000AETG+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX17000AETG+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX17000AETG+T?
For technical support, including MAX17000AETG+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX17000AETG+T requirements.
6.How does Aetrix verify that MAX17000AETG+T is sourced from the original manufacturer or authorized distributors?
All MAX17000AETG+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX17000AETG+T meets industry standards.
7.What is the process for return or replacement of MAX17000AETG+T?
All MAX17000AETG+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX17000AETG+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX17000AETG+T part is unused and in its original packaging.
Return procedure for MAX17000AETG+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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