Analog Devices Inc./Maxim Integrated MAX2206EBS
- Part No.:
- MAX2206EBS
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- RF Detectors
- Package:
- 4-WFBGA, CSPBGA
- Datasheet:
-
MAX2206EBS.pdf
- Description:
- RF POWER DETECTOR IN UCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,855
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The MAX2206EBS from Maxim Integrated is a wideband RF power detector optimized for GSM/EDGE handset power amplifiers, delivering 40dB dynamic range, ±1dB full-power temperature-compensated accuracy, and monotonic voltage output proportional to input RF power across 800MHz–2GHz. It integrates internal 50Ω termination for direct coupling to directional couplers and supports external averaging time control.
For engineers reviewing the MAX2206EBS datasheet, MAX2206EBS pinout, MAX2206EBS application, or MAX2206EBS equivalent, this device is selected for precise RF power monitoring in dual-band GSM/EDGE transceivers, PA module feedback loops, and closed-loop transmit power control systems requiring stable analog detection without external op-amps or filters.
Technical Context
The MAX2206EBS implements a temperature-compensated peak-detection architecture with internal biasing and process-shift correction, enabling consistent response across -40°C to +85°C. Its output voltage scales linearly with logarithmic input power, supporting analog-to-digital conversion for real-time PA gain adjustment.
It operates from 2.7V to 5.0V supply, draws 3.5mA typical idle current, and features a dedicated RFIN/SHDN pin that serves dual function: RF input interface and logic-controlled shutdown. The 2×2 UCSP package enables integration into space-constrained front-end modules with minimal PCB footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 800MHz to 2GHz - supports full-band GSM/EDGE operation including 900MHz and 1800/1900MHz bands. |
| Dynamic Range | 40dB - enables accurate detection from low-level leakage signals up to +20dBm (800MHz) or +17dBm (2GHz) PA output. |
| Temperature Accuracy | ±1dB at full power, ±2.5dB at lowest power - ensures stable calibration over industrial temperature range without recalibration. |
| Supply Current | 3.5mA typical idle current - minimizes battery drain in portable handset applications. |
| Input Termination | Internal 50Ω - eliminates need for external matching network when interfacing with standard 50Ω directional couplers. |
| Shutdown Current | 10µA max - allows low-power sleep mode during receive intervals to extend system battery life. |
| Response Time | 300ns (MAX2206/MAX2207) - supports fast AGC loop closure in burst-mode GSM transmission. |
Pinout & Package
MAX2206EBS uses a 2×2 mm, 0.5mm-pitch, 4-bump UCSP (Ultra-Compact Silicon Package) with bottom-side solder bumps. The package is lead-free compatible and requires JEDEC-compliant reflow profile per specification J-STD-020 Rev C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | RFIN/SHDN | Combined RF input and digital shutdown control; AC-coupled RF path with resistor-based logic threshold (2.0V high, 0.6V low). |
| A2 | VCC | Single-supply input (2.7V–5.0V); requires local bypass capacitor to GND for RF stability and noise rejection. |
| B1 | GND | Ground reference; multiple vias recommended to minimize inductance and maintain RF return path integrity. |
| B2 | OUT | Analog output voltage proportional to log of RF input power; directly interfaces ADC or op-amp without signal conditioning. |
Key Features
| Feature | Design Value |
|---|---|
| 40dB dynamic range | Enables single-detector use across entire GSM/EDGE transmit power range (e.g., +5dBm to +45dBm PA output via coupler scaling). |
| Internal 50Ω termination | Eliminates discrete 50Ω resistor and associated layout parasitics, reducing component count and improving high-frequency matching. |
| Temperature-compensated output | Maintains ±1dB error at full scale across -40°C to +85°C, removing need for system-level temperature compensation algorithms. |
| No external op-amp required | Direct connection to 12-bit+ ADCs (e.g., MAX111x series) simplifies BOM and reduces board area in compact handset designs. |
| 2×2 mm UCSP footprint | Occupies only 1mm² PCB area - ideal for multi-PA front-end modules where space is constrained by antenna switch and filter placement. |
Applications
| GSM/EDGE Handset PA Feedback | Dual-Band Transceiver Power Control |
|---|---|
|
Use Scenario: Real-time monitoring of power amplifier output in dual-band GSM/EDGE mobile handsets during TDMA burst transmission. IC Role / Device Role / Timing Role: Analog RF power detector providing voltage output proportional to PA output level for closed-loop transmit power regulation. Use Value: Enables compliance with GSM power class limits and ETSI spectral mask requirements using only one external capacitor and no op-amp. |
Use Scenario: Simultaneous power measurement across 900MHz and 1800MHz bands in software-defined radio transceivers. IC Role / Device Role / Timing Role: Wideband detector feeding dual-channel ADC for adaptive PA biasing and envelope tracking. Use Value: Maintains ±1dB accuracy across both bands without recalibration, reducing factory test time and calibration complexity. |
| PA Module Integration | WCDMA FDD Transmit Chain Monitoring |
|
Use Scenario: Embedded power sensing inside compact front-end modules containing PA, switch, and filter. IC Role / Device Role / Timing Role: On-module detector replacing external coupler + diode detector solutions to reduce insertion loss and improve linearity. Use Value: 1mm² UCSP footprint and internal 50Ω termination allow direct integration into 3×3mm PA module packages without redesigning RF layout. |
Use Scenario: Monitoring peak and average power in WCDMA FDD uplink paths with high PAPR signals. IC Role / Device Role / Timing Role: Temperature-stable analog detector supporting fast AGC response (<300ns) for HSDPA uplink power ramping. Use Value: 40dB dynamic range and 300ns turn-on time meet 3GPP TS 25.101 requirements for UMTS Band I/VI transmit power accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power detector applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX2207EBS | 25dB dynamic range, lower 2mA idle current, same 2×2 UCSP package and pinout. | Optimized for TDMA systems with lower peak-to-average ratio; less suitable for GSM/EDGE full-range detection. | Select MAX2207EBS only when power range is limited to ≤25dB and ultra-low current is prioritized over dynamic range. |
| ADL5511ACPZ-R7 | 35dB dynamic range, 3.3V-only supply, 6-pin LFCSP package, requires external 50Ω termination. | Designed for broadband instrumentation-grade measurement; lacks integrated termination and UCSP footprint. | Choose ADL5511ACPZ-R7 when higher precision (±0.5dB) and wider bandwidth (up to 4GHz) outweigh size and integration trade-offs. |
Compared with MAX2207EBS and ADL5511ACPZ-R7, the MAX2206EBS uniquely balances 40dB dynamic range, internal 50Ω termination, and 1mm² UCSP packaging-making it the only option qualified for space-constrained, battery-powered GSM/EDGE handset PA feedback where full-range detection and zero external passive components are mandatory.
Availability
MAX2206EBS is available at Aetrix Electronics and suitable for GSM/EDGE handset design, PA module integration, and WCDMA FDD transmit chain monitoring requiring stable component supply, RoHS-compliant sourcing, and long-term lifecycle support.
Supply support for MAX2206EBS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for communications, computing, and consumer applications.
The MAX2205–MAX2208 family was designed specifically for cellular handset front-end power detection, addressing the need for miniature, temperature-stable, wideband RF detectors that eliminate external components in GSM/EDGE, CDMA, and TDMA architectures.
FAQ
What is the operating frequency range of the MAX2206EBS?
The MAX2206EBS operates from 800MHz to 2GHz, covering all major GSM/EDGE bands (900MHz, 1800MHz, 1900MHz) and supporting dual-band handset designs. Its performance is specified across this full range with guaranteed ±1dB accuracy at full power and monotonic output response.
Does the MAX2206EBS require external components for basic operation?
No, the MAX2206EBS requires only three external components for full functionality: a VCC bypass capacitor, an optional CFILTER capacitor on OUT for ripple reduction, and a pull-up/pull-down resistor on RFIN/SHDN for shutdown control. Its internal 50Ω termination and temperature compensation eliminate need for external op-amps, filters, or matching networks.
What is the dynamic range of the MAX2206EBS and why does it matter for GSM/EDGE?
The MAX2206EBS provides 40dB dynamic range, enabling accurate detection from low-level PA leakage signals (~−30dBm) up to maximum GSM Class 4 output (+33dBm after coupler attenuation). This range ensures reliable closed-loop power control across all GSM/EDGE transmit power levels without range-switching or multiple detectors.
How does the MAX2206EBS handle temperature variation in handheld devices?
The MAX2206EBS incorporates on-die temperature compensation circuitry that reduces worst-case output variation to ±1dB at full power and ±2.5dB at minimum power across −40°C to +85°C. This eliminates need for host MCU-based temperature lookup tables or factory calibration sweeps in production.
Is the MAX2206EBS pin-compatible with other devices in the MAX2205–MAX2208 family?
Yes, all MAX2205–MAX2208 variants-including MAX2206EBS-share identical 2×2 UCSP pinout (RFIN/SHDN, VCC, GND, OUT), same footprint, and compatible biasing. This allows drop-in substitution within the same family for design flexibility, though dynamic range, current consumption, and internal termination differ per variant.
MAX2206EBS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Frequency:
- 800MHz ~ 2GHz
- RF Type:
- EDGE, GSM
- Input Range:
- 40dBm
- Accuracy:
- ±0.3dB
- Voltage - Supply:
- 2.7V ~ 5V
- Mounting Type:
- 3.5 mA
- Supplier Device Package:
- Surface Mount
- Current - Supply:
- 4-UCSP (0.97x0.97)
MAX2206EBS FAQ
1.How can I place an order for MAX2206EBS through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX2206EBS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX2206EBS reliable?
The price and inventory of MAX2206EBS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX2206EBS is usually 5 days.
3.What payment methods are accepted for MAX2206EBS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX2206EBS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX2206EBS?
MAX2206EBS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX2206EBS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX2206EBS?
For technical support, including MAX2206EBS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX2206EBS requirements.
6.How does Aetrix verify that MAX2206EBS is sourced from the original manufacturer or authorized distributors?
All MAX2206EBS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX2206EBS meets industry standards.
7.What is the process for return or replacement of MAX2206EBS?
All MAX2206EBS units undergo pre-shipment inspection (PSI). If there is an issue with MAX2206EBS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX2206EBS part is unused and in its original packaging.
Return procedure for MAX2206EBS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX2206EBS Tags

-
LMH2110TMX/NOPB
Texas Instruments

-
MAX2204EXK+T
Analog Devices Inc./Maxim Integrated

-
LMV221SD/NOPB
Texas Instruments

-
LTC5505-2ES5#TRMPBF
Analog Devices Inc.

-
LTC5505-1ES5#TRMPBF
Analog Devices Inc.

-
AD8314ACPZ-RL7
Analog Devices Inc.

-
ADL5506ACBZ-R7
Analog Devices Inc.

-
AD8312ACBZ-P7
Analog Devices Inc.

-
MAX4003EUA+T
Analog Devices Inc./Maxim Integrated

-
LTC5530ES6#TRMPBF
Analog Devices Inc.

-
LTC5507ES6#TRMPBF
Analog Devices Inc.

-
LTC5507ES6#TRPBF
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

