Analog Devices Inc./Maxim Integrated MAX5064AATC+

Overview

MAX5064AATC+ from Maxim Integrated is a 125V, 2A high-speed half-bridge MOSFET driver with independently controlled high-side (DH) and low-side (DL) outputs, 35ns typical propagation delay, ±3ns matching between drivers, and programmable break-before-make timing via BBM pin. It drives telecom-grade power converters requiring robust shoot-through prevention and thermal resilience in 4mm × 4mm thin QFN packages.

For engineers reviewing the MAX5064AATC+ datasheet, MAX5064AATC+ pinout, MAX5064AATC+ application, or MAX5064AATC+ equivalent, this page delivers verified electrical specs, validated package mapping, confirmed dual-input logic flexibility (IN_H+/IN_H−, IN_L+/IN_L−), and real-world dead-time programming behavior for synchronous buck and two-switch forward topologies.

Technical Context

The MAX5064AATC+ implements independent CMOS (VDD/2) logic inputs per channel - IN_H+/IN_H− for high-side and IN_L+/IN_L− for low-side - enabling configurable inverting/noninverting operation without external logic. Its internal bootstrap diode (0.91V forward drop) eliminates external diode requirements while supporting up to 1MHz combined switching frequency driving 100nC gate charge.

Break-before-make timing is set by an external resistor (R_BBM = 10kΩ–100kΩ) connected from BBM to AGND, yielding programmable dead time from 16ns to 95ns with ±1ns internal nonoverlap. Propagation delay matching between DH and DL is guaranteed ≤8ns over −40°C to +125°C, critical for minimizing shoot-through in high-voltage telecom supplies.

Key Specifications

Pinout & Package

MAX5064AATC+ uses a thermally enhanced 12-pin thin QFN (4mm × 4mm) package with exposed pad (EP) internally connected to AGND. The package supports 1.95W power dissipation at +70°C ambient and enables compact, high-density PCB layouts for telecom power modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Compared with UCC27211DRCR and IRS2004STRPBF, MAX5064AATC+ uniquely combines 125V rating, programmable BBM timing, dual-input logic per channel, and matched 35ns propagation delay - making it the only option qualified for telecom-compliant, high-frequency, shoot-through-critical half-bridge designs requiring layout flexibility and thermal efficiency.

Availability

MAX5064AATC+ is available at Aetrix Electronics and suitable for telecom power supplies, two-switch forward converters, and active-clamp forward converters requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and communications infrastructure.

Supply support for MAX5064AATC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and communications applications.

The MAX5064 family targets high-reliability, high-frequency power conversion systems - specifically engineered to replace optocoupler-based isolation in telecom half-bridge and forward converters while delivering robust shoot-through protection and thermal performance.

FAQ

What is the maximum allowable V_HS voltage for MAX5064AATC+?

The MAX5064AATC+ specifies a maximum high-side voltage (V_HS) of 125V. This rating provides 25V margin above the 100V transient requirement defined in telecom standards such as GR-1089-CORE. Operation beyond 125V risks permanent damage, and the device includes dV/dt immunity up to 50V/ns at HS to suppress false triggering during fast transients.

How does the BBM pin on MAX5064AATC+ adjust dead time?

The BBM pin on MAX5064AATC+ accepts an external resistor (R_BBM) from BBM to AGND to program break-before-make dead time. With R_BBM = 10kΩ, t_BBM = 16ns; at 100kΩ, t_BBM = 95ns. The internal circuit regulates BBM voltage to 1.3V and draws current proportional to R_BBM; values >200kΩ disable BBM, defaulting t_BBM to 1ns.

Does MAX5064AATC+ require an external bootstrap diode?

No, MAX5064AATC+ integrates a reliable bootstrap diode between VDD and BST with 0.91V typical forward voltage and 40ns turn-on/turn-off time. This eliminates the need for an external discrete diode in most applications. An external Schottky diode may be added only if lower V_F (<0.4V) is required to improve efficiency at very high frequencies (>1MHz).

What is the purpose of separate AGND and PGND pins on MAX5064AATC+?

MAX5064AATC+ separates AGND (analog ground) and PGND (power ground) to isolate low-noise logic references from high-di/dt power return paths. AGND serves IN_H±, IN_L±, BBM, and internal comparators; PGND returns DL output current and high-side bootstrap discharge current. This separation prevents ground bounce from corrupting input thresholds or UVLO detection.

Can MAX5064AATC+ drive 100nC gate charge MOSFETs at 1MHz?

Yes, MAX5064AATC+ is explicitly rated for up to 1MHz combined switching frequency while driving 100nC total gate charge, as confirmed in the datasheet's Electrical Characteristics table and Typical Operating Characteristics (toc08). This capability relies on its 2A peak source/sink current, low 2.5Ω driver R_DS(ON), and thermally enhanced 12-pin QFN package dissipating up to 1.95W at +70°C.