Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc./Maxim Integrated MAX5064BATC+T

Part No.:
MAX5064BATC+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Gate Drivers
Package:
12-WQFN Exposed Pad
Datasheet:
AetrixMAX5064BATC+T.pdf
Description:
IC GATE DRVR HALF-BRIDGE 12TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,587

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MAX5064BATC+T from Maxim Integrated is a 125V, 2A high-speed half-bridge MOSFET driver IC with independently controlled high-side and low-side outputs, 35ns typical propagation delay (matched within 8ns), programmable break-before-make timing (16–95ns), and integrated bootstrap diode - designed for telecom power converters operating up to 1MHz with 100nC gate charge loads.

For engineers reviewing the MAX5064BATC+T datasheet, MAX5064BATC+T pinout, MAX5064BATC+T application, or MAX5064BATC+T equivalent, this page delivers verified electrical specs, thermal package details, real-world dead-time programming guidance, and validated alternatives for high-voltage half-bridge gate driving in telecom and industrial power supplies.

Technical Context

The MAX5064BATC+T implements dual independent BiCMOS gate drivers with TTL logic inputs, separate AGND/PGND grounds, and a dedicated BBM adjustment pin (BBM) that sets dead time via external resistor (10kΩ–100kΩ). Its internal bootstrap diode (VF = 0.91V typ) eliminates discrete diode requirements while supporting 125V HS operation.

It features matched propagation delays between DH and DL outputs (≤8ns max mismatch), 2A peak source/sink current per channel, and UVLO thresholds at 6.5–8.0V (VDD) and 6.0–7.8V (BST-to-HS), all guaranteed over –40°C to +125°C.

Key Specifications

ParameterValue and Actual Design Meaning
VHS Max125V - supports telecom transient margin above 100V input requirement
Peak Output Current2A source/sink - drives high-gate-charge MOSFETs (e.g., 100nC) at up to 1MHz
Propagation Delay35ns typical - enables high-frequency switching with tight timing control
Delay Matching≤8ns max - prevents shoot-through by minimizing DH/DL timing skew
BBM Time Range16–95ns - externally programmed via RBBM (10kΩ–100kΩ) for safe half-bridge commutation
VDD Range8.0–12.6V - powers logic and output stages with UVLO hysteresis of 0.5V
Input Logic TypeTTL - accepts 1.65–2.0V VIH and 0.8–1.4V VIL, independent of VDD

Pinout & Package

MAX5064BATC+T uses a thermally enhanced 12-pin (4mm × 4mm) thin QFN package with exposed pad (EP) internally connected to AGND. The package supports 1.95W power dissipation at +70°C and enables compact, high-power-density layouts.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower InputBypassed to PGND with 0.1µF + 1µF ceramics; supplies both logic and driver stages
BSTBootstrap Capacitor NodeConnects to HS via 0.1µF ceramic; internal diode charges BST from VDD during low-side conduction
DHHigh-Side Gate Driver OutputDrives N-channel MOSFET gate referenced to HS; sinks 2A into gate capacitance
HSHigh-Side Source ReturnCommon node for high-side MOSFET source and DH return path; withstands up to 125V
IN_HHigh-Side Noninverting Logic InputTTL-compatible; controls DH directly; VIH ≥ 2.0V, VIL ≤ 0.8V
IN_LLow-Side Noninverting Logic InputTTL-compatible; controls DL directly; same voltage thresholds as IN_H
GNDAnalog Ground ReferenceReturn for IN_H/IN_L inputs; isolated from PGND to reduce noise coupling
DLLow-Side Gate Driver OutputDrives N-channel MOSFET gate referenced to PGND; sources/sinks 2A
PGNDPower GroundReturn path for DL output and high-switching currents; must be low-inductance plane
BBMBreak-Before-Make Timing InputAccepts resistor to AGND (10kΩ–100kΩ) to set tBBM = 16–95ns; bypass with ≥1nF capacitor
EPExposed Thermal PadInternally tied to AGND; requires soldered connection to large copper area for thermal management

Key Features

FeatureDesign Value
Integrated Bootstrap DiodeVF = 0.91V typ - eliminates external Schottky diode, reducing BOM count and layout area
Programmable Dead TimetBBM = 16–95ns - prevents shoot-through in half-bridge/synchronous buck topologies without external circuitry
Matched Propagation Delays≤8ns max mismatch between DH and DL - ensures precise timing alignment under temperature and supply variation
Thermally Enhanced QFN12-pin 4mm × 4mm TQFN with EP - dissipates 1.95W at +70°C, enabling high-power density designs
TTL Logic InputsVIH ≥ 2.0V, VIL ≤ 0.8V - interoperable with standard PWM controllers regardless of VDD level

Applications

Telecom Half-Bridge Power SuppliesTwo-Switch Forward Converters

Use Scenario: 48V input telecom rectifier supplying 12V/50A output using half-bridge topology with synchronous rectification.

IC Role / Device Role / Timing Role: Drives high-side and low-side 100nC MOSFETs at 500kHz with programmable dead time to prevent shoot-through during 100V transients.

Use Value: 125V HS rating provides 25V margin over GR-1089-CORE 100V surge spec; integrated bootstrap diode reduces component count by one.

Use Scenario: Isolated 380V DC bus converter for server PSUs, using two active switches in forward configuration with 300kHz switching.

IC Role / Device Role / Timing Role: Controls complementary gate drive for primary-side switches; BBM disabled (BBM open) since both switches operate simultaneously.

Use Value: Dual independent drivers enable precise timing control; 2A drive strength ensures fast 100nC MOSFET turn-on/turn-off at full load.

Full-Bridge ConvertersActive-Clamp Forward Converters

Use Scenario: 380V input full-bridge DC/DC for industrial motor drives, delivering 48V/100A with ZVS optimization.

IC Role / Device Role / Timing Role: One MAX5064BATC+T drives leg A (DH/AL); second drives leg B (DH/BL); each uses BBM to avoid cross-conduction.

Use Value: Matched 35ns delays ensure symmetrical leg timing; 8ns max mismatch maintains ZVS window integrity across temperature.

Use Scenario: High-efficiency 400V input active-clamp forward converter for telecom base station RF power amplifiers.

IC Role / Device Role / Timing Role: Drives main switch (low-side) and clamp switch (high-side) with independent timing control and adjustable dead time.

Use Value: Programmable BBM allows fine-tuning of clamp switch timing relative to main switch, optimizing efficiency and reducing voltage spikes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX5064AATC+TCMOS (VDD/2) logic inputs instead of TTL; identical pinout, package, and BBM functionalitySuitable when controller outputs are CMOS-level (e.g., microcontroller GPIO), not TTLSelect MAX5064AATC+T for VDD/2 threshold compatibility; MAX5064BATC+T for standard 5V/3.3V TTL PWM signals
UCC27211DRCR120V HS rating, 4A peak drive, no integrated bootstrap diode, no BBM programming pinRequires external bootstrap diode and dead-time generation circuitry; higher drive strength for ultra-low-Qg MOSFETsChoose UCC27211DRCR only if 4A drive or 120V rating suffices and external BBM control is acceptable

Compared with MAX5064AATC+T, MAX5064BATC+T offers native TTL compatibility without level-shifting, while versus UCC27211DRCR it trades higher peak current for integrated bootstrap and programmable dead time - critical for compact telecom PSU designs where layout space and reliability are constrained.

Availability

MAX5064BATC+T is available at Aetrix Electronics and suitable for telecom power supplies, two-switch forward converters, and active-clamp forward converters requiring stable component supply, high-voltage robustness, and precise timing control.

Supply support for MAX5064BATC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and communications applications.

The MAX5062/MAX5063/MAX5064 family targets high-frequency, high-voltage DC/DC conversion - specifically engineered to replace optocoupler-based isolation in telecom half-bridge and forward topologies while maintaining timing accuracy and thermal resilience.

FAQ

What is the maximum switching frequency supported by the MAX5064BATC+T?

The MAX5064BATC+T supports up to 1MHz combined switching frequency when driving a total gate charge of 100nC, as confirmed in the Electrical Characteristics table and Typical Operating Characteristics (toc08). This capability is enabled by its 2A peak source/sink current, 35ns propagation delay, and thermally enhanced 12-pin QFN package rated for 1.95W dissipation at +70°C. Real-world operation depends on MOSFET gate charge, PCB layout, and thermal management - but 1MHz is the validated limit under specified conditions for MAX5064BATC+T.

Does the MAX5064BATC+T include an internal bootstrap diode?

Yes, the MAX5064BATC+T integrates a reliable on-chip bootstrap diode between VDD and BST, with a typical forward voltage drop of 0.91V at 100mA and 10ns turn-on/turn-off time. This eliminates the need for an external discrete diode in most designs, reducing component count and board area. The diode is explicitly documented in the "Internal Bootstrap Diode" section and Electrical Characteristics table (Vf parameter), and its function is confirmed in the Typical Operating Circuit and Applications Information. Use an external Schottky diode only if lower VF (<0.5V) is required for efficiency-critical applications.

How is break-before-make timing programmed on the MAX5064BATC+T?

Break-before-make timing on the MAX5064BATC+T is programmed by connecting a resistor (RBBM) from the BBM pin to AGND. Values from 10kΩ to 100kΩ yield tBBM from 16ns to 95ns, per the equation tBBM = 8ns × (1 + RBBM/10kΩ). A 1nF or smaller ceramic capacitor must bypass BBM to AGND to suppress ground bounce. This feature is exclusive to MAX5064 variants (not MAX5062/MAX5063) and is fully characterized in the Electrical Characteristics table and toc15/toc16 graphs. Leaving BBM unconnected disables BBM, resulting in ~1ns dead time.

What is the logic input type for the MAX5064BATC+T?

The MAX5064BATC+T features TTL-compatible logic inputs: IN_H and IN_L accept VIH ≥ 2.0V (min) and VIL ≤ 0.8V (max), with 0.25V hysteresis. These thresholds are independent of VDD voltage, allowing interface with 3.3V or 5V PWM controllers even when VDD = 12V. This is explicitly stated in the Selector Guide and Electrical Characteristics table under "LOGIC INPUT" for MAX5064B. It differs from the CMOS-input MAX5064AATC+T (VDD/2 thresholds), making MAX5064BATC+T ideal for standard TTL/CMOS logic families without level shifters.

What package and thermal specifications apply to the MAX5064BATC+T?

The MAX5064BATC+T uses a 12-pin thin QFN package (4mm × 4mm) with exposed thermal pad (EP), designated as "TQFN" in Maxim's ordering nomenclature and confirmed in the Ordering Information table. Its thermal performance is rated at 1.951W continuous power dissipation at +70°C (derating 24.4mW/°C above +70°C), per JEDEC 51 multilayer board standards. The EP is internally connected to AGND and must be soldered to a large copper ground plane for effective heat transfer - a requirement emphasized in the Pin Description and Applications Information sections.

MAX5064BATC+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
12-WQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
8V ~ 12.6V
Logic Voltage - VIL, VIH:
0.8V, 2V
Current - Peak Output (Source, Sink):
2A, 2A
Input Type:
Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap):
125 V
Rise / Fall Time (Typ):
65ns, 65ns
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
12-TQFN (4x4)

MAX5064BATC+T FAQ

1.How can I place an order for MAX5064BATC+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX5064BATC+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX5064BATC+T reliable?

The price and inventory of MAX5064BATC+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX5064BATC+T is usually 5 days.

3.What payment methods are accepted for MAX5064BATC+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX5064BATC+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX5064BATC+T?

MAX5064BATC+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX5064BATC+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX5064BATC+T?

For technical support, including MAX5064BATC+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX5064BATC+T requirements.

6.How does Aetrix verify that MAX5064BATC+T is sourced from the original manufacturer or authorized distributors?

All MAX5064BATC+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX5064BATC+T meets industry standards.

7.What is the process for return or replacement of MAX5064BATC+T?

All MAX5064BATC+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX5064BATC+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX5064BATC+T part is unused and in its original packaging.

Return procedure for MAX5064BATC+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX5064BATC+T Tags

  • MAX5064BATC+T
  • MAX5064BATC+T PDF
  • MAX5064BATC+T Datasheet
  • MAX5064BATC+T Specifications
  • MAX5064BATC+T Images
  • Analog Devices Inc./Maxim Integrated
  • Analog Devices Inc./Maxim Integrated MAX5064BATC+T
  • Buy MAX5064BATC+T
  • MAX5064BATC+T Price
  • MAX5064BATC+T Distributor
  • MAX5064BATC+T Supplier
  • MAX5064BATC+T Wholesale
Related Products
ZXGD3009E6TA
ZXGD3009E6TA

Diodes Incorporated

1EDN7512BXTSA1
1EDN7512BXTSA1

Infineon Technologies

UCC27517DBVR
UCC27517DBVR

Texas Instruments

MCP1416T-E/OT
MCP1416T-E/OT

Microchip Technology

MCP1402T-E/OT
MCP1402T-E/OT

Microchip Technology

MCP1415T-E/OT
MCP1415T-E/OT

Microchip Technology

MCP1401T-E/OT
MCP1401T-E/OT

Microchip Technology

IX4428NTR
IX4428NTR

Littelfuse Inc.

IRS2005STRPBF
IRS2005STRPBF

Infineon Technologies

IRS2008STRPBF
IRS2008STRPBF

Infineon Technologies

IX4310TTR
IX4310TTR

Littelfuse Inc.

2EDN7524RXTMA1
2EDN7524RXTMA1

Infineon Technologies

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER