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Analog Devices Inc./Maxim Integrated MAX8500ETC
- Part No.:
- MAX8500ETC
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Power Management - Specialized
- Package:
- 12-WQFN Exposed Pad
- Datasheet:
-
MAX8500ETC.pdf
- Description:
- MAX8500 PWM BUCK CONVERTER
- Quantity:
- Payment:
- Shipping:
Inventory:1,072
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Product details
Overview
MAX8500ETC from Maxim Integrated is a PWM buck DC-DC converter with integrated bypass PFET, designed to power linear power amplifiers in N-CDMA/W-CDMA handsets. It delivers 600mA output current, supports 2.6V–5.5V input, provides dynamically adjustable 0.4V–VBATT output, achieves ≤30µs settling time, and maintains 150mV dropout at 600mA load regardless of inductor resistance.
For engineers reviewing the MAX8500ETC datasheet, MAX8500ETC pinout, MAX8500ETC application, or MAX8500ETC equivalent, this device is selected for high-efficiency, low-dropout PA supply in battery-powered RF front-ends where fast voltage transitions, minimal quiescent current (280µA typ), and seamless dropout recovery are critical design requirements.
Technical Context
The MAX8500ETC implements a fixed-frequency (1MHz), current-mode PWM controller with 100% duty-cycle capability and synchronous rectification. It uses REFIN as an analog control input to dynamically set output voltage via internal gain (1.76× for MAX8500), enabling real-time PA bias adjustment during transmission.
Its dual-path architecture combines PWM buck regulation with a low-RDS(ON) (0.25Ω typ) bypass PFET that activates near dropout to reduce voltage loss. Internal current-sense comparators provide cycle-by-cycle limiting, skip-mode transition at ~75mA load, and overcurrent protection on both main and bypass paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.6V to 5.5V - compatible with single-cell Li-ion battery operation across full discharge curve. |
| Output Current | 600mA guaranteed - sufficient to drive high-efficiency linear PAs in CDMA/W-CDMA handsets. |
| Switching Frequency | 1MHz fixed - enables use of compact 4.7µH inductors and low-ESR ceramic capacitors. |
| Dropout Voltage | 150mV at 600mA - independent of external inductor resistance, ensuring stable PA bias under varying PCB trace losses. |
| Quiescent Current | 280µA typical in normal mode - extends battery life during low-power standby and idle states. |
| Output Settling Time | <30µs for full-scale change - meets stringent transient response requirements of dynamic PA envelope tracking. |
| Shutdown Current | 0.1µA typical - eliminates leakage during system sleep or power-down sequences. |
Pinout & Package
MAX8500ETC is housed in a 12-pin thin QFN package measuring 4mm × 4mm × 0.8mm max height, with exposed thermal paddle connected to PGND for enhanced thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Signal Ground Reference | Low-impedance return path for reference and compensation circuitry; must be star-connected to PGND at exposed paddle. |
| 2 REF | Reference Bypass | Stabilizes internal bandgap reference; requires 0.22µF ceramic capacitor to GND for noise immunity. |
| 3 REFIN | Analog Voltage Control Input | Accepts DAC output (0.4V–1.932V) to dynamically set VOUT = 1.76 × VREFIN; enables real-time PA supply scaling. |
| 4 COMP | Loop Compensation Node | External RC network (8.2kΩ + 1000pF) sets phase margin and transient response; integrates error amplifier output. |
| 5 BATT | Logic Supply Input | Powers internal logic and gate drivers; tied to BATTP in standard configuration. |
| 6 PGND | Power Ground Return | High-current return path for LX switching node and bypass FET; must be low-inductance connection to exposed paddle. |
| 7 LX | Switch Node | Connects to inductor; carries high di/dt PWM current; requires short, wide trace routing away from sensitive analog nodes. |
| 8 BATTP | Main Power Input | 2.6V–5.5V battery input; bypassed with ≥10µF low-ESR capacitor to suppress high-frequency ripple. |
| 9 OUT | Regulated Output | Delivers up to 600mA to PA; directly connects to load with minimal trace inductance to preserve transient response. |
| 10 SKIP | Mode Control Input | Logic-low enables pulse-skipping for light-load efficiency; logic-high forces constant-frequency PWM for EMI control. |
| 11 SHDN | Enable/Shutdown Control | Logic-low disables all circuitry and reduces supply current to 0.1µA; debounced externally for reliable sequencing. |
| 12 - | No Connect (NC) | Not internally bonded; left floating or grounded per layout best practice to minimize parasitic coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bypass PFET | 0.25Ω typical RDS(ON) enables low-dropout LDO-like operation without external components when VBATT approaches VOUT. |
| Dynamically Adjustable Output | VOUT = 1.76 × VREFIN (0.4V–VBATT range) allows precise, real-time PA bias control via baseband DAC, reducing average PA power consumption. |
| 100% Duty-Cycle Operation | Eliminates minimum input-output voltage differential requirement, supporting ultra-low dropout down to 150mV at full load. |
| Synchronous Rectification | Internal N-channel MOSFET replaces Schottky diode, improving efficiency by >5% at medium loads and removing external component cost. |
| Fast Transient Response | <30µs settling time for full-scale VOUT or ILOAD steps ensures stable PA operation during rapid modulation envelope changes. |
Applications
| N-CDMA Handset PA Supply | W-CDMA Handset PA Supply |
|---|---|
|
Use Scenario: Powering linear power amplifier during voice transmission in N-CDMA cellular handsets, where supply voltage must scale dynamically with transmit power level. IC Role / Device Role / Timing Role: Primary DC-DC regulator providing dynamically adjusted VCC to PA; operates in PWM or skip mode depending on load; settles within 30µs during envelope transitions. Use Value: Reduces average PA current by lowering supply voltage during partial-power transmission, extending talk time by up to 35% versus fixed-voltage solutions. |
Use Scenario: Delivering regulated bias to W-CDMA power amplifier in smartphones, supporting complex modulation schemes requiring tight voltage accuracy and fast load transients. IC Role / Device Role / Timing Role: High-speed buck converter with bypass FET; regulates output from 0.4V to VBATT using DAC-controlled REFIN; maintains <0.03% load regulation. Use Value: Enables envelope tracking functionality with sub-30µs response, minimizing PA dissipation and improving ACPR performance in wideband signals. |
| Wireless PDA RF Front-End | Mobile Modem PA Bias |
|
Use Scenario: Supplying clean, efficient power to RF transceiver modules in handheld PDAs operating in CDMA bands with intermittent high-peak data bursts. IC Role / Device Role / Timing Role: Compact, thermally optimized buck regulator with integrated bypass; switches at 1MHz to minimize filter size; enters shutdown between data sessions. Use Value: Achieves >90% peak efficiency at 3.3V output while maintaining 280µA quiescent current, enabling longer active session times in space-constrained designs. |
Use Scenario: Providing stable, low-noise VCC to power amplifier stages in embedded LTE/WiMAX modems used in portable broadband devices. IC Role / Device Role / Timing Role: Dual-mode regulator (PWM/skip) with HP bypass capability; supports forced-PWM mode to avoid interference with sensitive IF sampling clocks. Use Value: Eliminates need for separate LDO + buck combo; reduces BOM count by two components while maintaining spectral purity in mixed-signal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck converter with bypass FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX8503ETC | Same pinout and package; uses 2× REFIN-to-VOUT gain (vs. 1.76×); different reference input voltage (1.70V vs. 1.932V). | Optimized for lower VREFIN DAC outputs; identical dynamic PA supply functionality but requires recalibration of control loop. | Select MAX8503ETC only if existing DAC output range matches its 0.200V–1.70V REFIN specification. |
| TPS62231RGTR | Fixed 1.8V/2.5V/3.3V outputs only; no REFIN or bypass FET; 3MHz switching; 0.55Ω typical dropout at 600mA. | Lacks dynamic voltage scaling and low-dropout bypass mode; suitable only for static PA bias or non-PA applications. | Choose TPS62231RGTR only for cost-sensitive, non-envelope-tracking designs where fixed output and smaller footprint outweigh dynamic control needs. |
Compared with MAX8503ETC, the MAX8500ETC offers tighter REFIN voltage range matching and higher gain linearity for precision DAC-driven PA bias; compared with TPS62231RGTR, it delivers unique bypass-FET-enabled dropout performance and real-time analog control-critical for CDMA/W-CDMA envelope tracking systems.
Availability
MAX8500ETC is available at Aetrix Electronics and suitable for N-CDMA handset design, W-CDMA PA biasing, and wireless modem power management requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for MAX8500ETC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for communications, computing, and consumer electronics.
The MAX8500–MAX8504 product line was engineered specifically for battery-powered RF front-end power delivery, emphasizing ultra-fast transient response, integrated bypass FETs, and dynamic voltage scaling to maximize PA efficiency in CDMA/W-CDMA handsets.
FAQ
What is the maximum output current supported by the MAX8500ETC?
The MAX8500ETC guarantees 600mA continuous output current under all operating conditions, including worst-case temperature and input voltage. This rating is validated across the full -40°C to +85°C junction temperature range and accounts for internal power dissipation limits in the 4mm × 4mm thin QFN package. The MAX8500ETC maintains this current capability even during 100% duty-cycle operation near dropout.
How does the MAX8500ETC achieve 150mV dropout at 600mA regardless of inductor resistance?
The MAX8500ETC achieves consistent 150mV dropout at 600mA by activating its integrated 0.25Ω typical RDS(ON) bypass PFET when the buck converter approaches dropout. This bypass path operates in parallel with the inductor and internal switch, eliminating dependence on external inductor series resistance. The MAX8500ETC's control architecture seamlessly transitions between PWM buck and LDO-like bypass modes without output disturbance.
What is the function of the REFIN pin on the MAX8500ETC?
The REFIN pin on the MAX8500ETC serves as an analog voltage control input that dynamically sets the output voltage according to VOUT = 1.76 × VREFIN. It accepts a DC voltage from 0.4V to 1.932V to produce corresponding output voltages from 0.4V to VBATT. This enables real-time PA bias scaling in CDMA/W-CDMA handsets, with full-scale transitions settling in under 30µs-critical for envelope tracking applications.
Can the MAX8500ETC operate in forced-PWM mode, and how is it enabled?
Yes, the MAX8500ETC supports forced-PWM mode to maintain constant 1MHz switching frequency regardless of load. This mode is enabled by driving the SKIP pin high (to BATT or logic 1). Forced-PWM mode improves spectral predictability in RF-sensitive applications but increases quiescent current to 3.3mA typical versus 280µA in skip mode. The MAX8500ETC retains full regulation and current limiting in this mode.
What package type and thermal characteristics does the MAX8500ETC use?
The MAX8500ETC uses a 12-pin thin QFN package measuring 4mm × 4mm × 0.8mm maximum height, with an exposed thermal paddle electrically connected to PGND. Its thermal resistance θJA is 74°C/W, and continuous power dissipation is rated at 1349mW at +70°C ambient (derating 16.9mW/°C above). The MAX8500ETC includes thermal shutdown at +160°C with 15°C hysteresis for robust reliability.
MAX8500ETC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 12-WQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- Cellular, CDMA Handset
- Current - Supply:
- 280µA
- Voltage - Supply:
- 2.6V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-TQFN (4x4)
MAX8500ETC FAQ
1.How can I place an order for MAX8500ETC through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8500ETC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8500ETC reliable?
The price and inventory of MAX8500ETC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8500ETC is usually 5 days.
3.What payment methods are accepted for MAX8500ETC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8500ETC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8500ETC?
MAX8500ETC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8500ETC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8500ETC?
For technical support, including MAX8500ETC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8500ETC requirements.
6.How does Aetrix verify that MAX8500ETC is sourced from the original manufacturer or authorized distributors?
All MAX8500ETC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8500ETC meets industry standards.
7.What is the process for return or replacement of MAX8500ETC?
All MAX8500ETC units undergo pre-shipment inspection (PSI). If there is an issue with MAX8500ETC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8500ETC part is unused and in its original packaging.
Return procedure for MAX8500ETC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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