Analog Devices Inc./Maxim Integrated MAX8504ETC
- Part No.:
- MAX8504ETC
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Power Management - Specialized
- Package:
- 12-WQFN Exposed Pad
- Datasheet:
-
MAX8504ETC.pdf
- Description:
- MAX8504 PWM BUCK CONVERTER
- Quantity:
- Payment:

- Shipping:

Inventory:2,136
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The MAX8504ETC from Maxim Integrated is a fixed-output PWM buck converter with integrated high-power bypass PFET, designed specifically for power amplifier (PA) supply in W-CDMA/N-CDMA handsets. It delivers 600mA guaranteed output current, operates from 2.6V to 5.5V input, provides externally set 1.25V–2.5V output via FB pin, and achieves 150mV dropout at 600mA load using its 0.25Ωtyp bypass FET.
For engineers reviewing the MAX8504ETC datasheet, MAX8504ETC pinout, MAX8504ETC application, or MAX8504ETC equivalent, this device is selected for fast-settling, low-noise, high-efficiency PA biasing where digitally controlled high-power bypass mode and 1MHz fixed-frequency PWM operation are required in space-constrained mobile RF power stages.
Technical Context
The MAX8504ETC implements a current-mode PWM controller with 100% duty-cycle capability and integrated synchronous rectification, enabling seamless transition into dropout and stable regulation under dynamic PA load transients. Its feedback loop uses an external resistive divider on FB (regulated to 1.25V), while HP pin enables direct battery-to-output connection via internal PFET for peak-power transmission bursts.
Unlike the MAX8500–MAX8503 variants, the MAX8504ETC lacks REFIN and instead relies on FB-based voltage setting and HP-controlled bypass activation. It features dedicated overcurrent protection comparators for both PWM and bypass paths, and supports forced-PWM (SKIP = BATT) or pulse-skipping (SKIP = GND) modes to optimize efficiency across load ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | 1.25V to 2.5V, set externally via FB resistive divider - enables precise PA VCC tuning without DAC |
| Guaranteed Output Current | 600mA continuous - sufficient for mid-to-high power W-CDMA PA stages |
| Dropout Voltage | 150mV at 600mA - achieved by 0.25Ωtyp bypass PFET, independent of inductor DCR |
| Switching Frequency | 1MHz fixed - allows use of compact 4.7µH inductors and reduces EMI fundamental frequency |
| Quiescent Current | 280µA typical in skip mode - extends battery life during low-Power PA idle periods |
| Shutdown Current | 0.1µA typical - ensures zero-load battery drain when PA is inactive |
| Bypass Mode Activation | HP pin logic-high - connects OUT directly to BATT through internal PFET, eliminating conversion loss during TX peaks |
Pinout & Package
MAX8504ETC is housed in a 12-pin thin QFN package (4mm × 4mm, 0.8mm max height) with exposed thermal paddle (PGND-connected). Pin 1 is located at the bottom-left corner adjacent to the marking notch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Ground reference | Analog ground return for REF, COMP, and internal error amp - must connect to low-impedance ground plane |
| 2 REF | Reference bypass | Connects 0.22µF ceramic capacitor to GND - stabilizes internal 1.25V reference for FB regulation |
| 3 FB | Feedback sense input | Senses output voltage via external resistor divider - regulates OUT to 1.25V at FB node |
| 4 COMP | Compensation node | External RC network (e.g., 9.1kΩ + 560pF) sets loop stability and transient response bandwidth |
| 5 HP | High-power bypass control | Logic-high enables direct BATT-to-OUT conduction via internal PFET - used for PA peak-power burst mode |
| 6 PGND | Power ground | High-current return path for LX, BATTP, and bypass FET - must tie to exposed thermal pad |
| 7 LX | Switch node | Connects to inductor - carries high di/dt PWM current; requires short, wide trace and local decoupling |
| 8 BATTP | Main power input | 2.6V–5.5V battery input - bypassed with ≥10µF low-ESR capacitor close to pin |
| 9 OUT | Regulated output | Delivers 1.25V–2.5V to PA collector/emitter - routed with low-inductance path to minimize ripple |
| 10 SKIP | Mode selection | GND = pulse-skipping (low IQ); BATT = forced-PWM (fixed 1MHz, low noise spectrum) |
| 11 SHDN | Enable/disable control | GND = shutdown (0.1µA IQ); BATT = active - used for system-level PA power gating |
| 12 BATT | IC supply rail | Internal logic and gate drivers powered from BATT - tied to BATTP in standard layout |
Key Features
| Feature | Design Value |
|---|---|
| Digitally controlled high-power bypass mode | HP pin activates 0.25Ωtyp PFET to short OUT to BATT - eliminates conversion loss during PA peak transmit |
| 150mV dropout at 600mA | Independent of external inductor DCR - ensures consistent low-loss operation across component tolerances |
| 1MHz fixed-frequency PWM | Enables use of small 4.7µH inductors and reduces EMI filtering burden in RF-sensitive handset layouts |
| Fast 30µs output settling time | Supports rapid PA VCC adjustment between W-CDMA power levels - critical for dynamic envelope tracking |
| Integrated synchronous rectification | Eliminates external Schottky diode - improves light-load efficiency and reduces board area in 4mm × 4mm footprint |
Applications
| W-CDMA Power Amplifier Supply | N-CDMA Handset PA Biasing |
|---|---|
|
Use Scenario: Dynamic VCC control for wideband CDMA power amplifier during voice/data transmission. IC Role / Device Role / Timing Role: Primary DC-DC buck regulator with bypass FET, delivering regulated 1.25V–2.5V to PA collector while supporting HP-triggered battery-direct mode. Use Value: Reduces average PA power consumption by >30% versus fixed-VCC supply, extending talk time without compromising peak output power. |
Use Scenario: Efficient, low-noise biasing of N-CDMA linear PA in dual-mode handsets. IC Role / Device Role / Timing Role: Fixed-output buck converter operating in forced-PWM mode (SKIP = BATT) to avoid interference with IF sampling clocks. Use Value: Maintains clean spectral profile during data transmission by eliminating variable-frequency switching noise in sensitive receiver bands. |
| Wireless PDA Baseband Power | Modem RF Front-End Supply |
|
Use Scenario: Compact, high-efficiency core supply for baseband processor I/O and analog sections in handheld PDAs. IC Role / Device Role / Timing Role: Secondary buck regulator providing stable 1.8V or 2.5V from main battery rail, with fast transient response to CPU activity bursts. Use Value: Enables aggressive power gating of baseband subsystems while maintaining <30µs voltage recovery - prevents data corruption during wake-up events. |
Use Scenario: Low-ripple, low-noise supply for RF transceiver LNA, mixer, and VCO circuits in cellular modems. IC Role / Device Role / Timing Role: Dedicated PA supply IC operating in skip mode during standby and forced-PWM during active transmission. Use Value: Delivers <10mVpp output ripple under 600mA load - meets stringent RF circuit PSRR requirements without additional LDO post-regulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck converter with bypass FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX8503ETC | Dynamically adjustable output (0.4V–VBATT) via REFIN; no HP pin; uses LDO/buck hybrid architecture | Suitable for DAC-driven PA biasing where fine-grained voltage control is needed, not fixed-step VCC | Select MAX8503ETC when system includes DAC and requires sub-100mV output step resolution across full VBATT range |
| TPS62361BDSKR | 1.8V–3.3V fixed output; no bypass FET; 2.5MHz switching; 1.2A output; 2.5µA IQ in DCS-Control™ mode | Targeted at general-purpose portable SoC core supplies, not PA-specific high-current low-dropout operation | Choose TPS62361BDSKR for higher-current, higher-voltage digital rail applications where bypass functionality is unnecessary |
Compared with MAX8503ETC and TPS62361BDSKR, the MAX8504ETC uniquely combines fixed 1.25V–2.5V programmability, integrated 0.25Ω bypass FET, and 150mV dropout at 600mA - making it the only option optimized for W-CDMA PA VCC with burst-mode battery-direct capability.
Availability
MAX8504ETC is available at Aetrix Electronics and suitable for W-CDMA handset design, wireless modem development, and portable RF front-end power management requiring stable component supply and long-term production continuity.
Supply support for MAX8504ETC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for communications, computing, and consumer applications.
The MAX8500–MAX8504 family was engineered specifically for battery-powered CDMA/W-CDMA handset PA power stages, emphasizing ultra-low dropout, fast transient response, and integrated bypass capability to maximize RF efficiency and battery life.
FAQ
What is the primary function of the HP pin on the MAX8504ETC?
The HP (High-Power) pin on the MAX8504ETC controls activation of the internal bypass PFET. When driven logic-high, it connects the OUT pin directly to the BATT rail through a 0.25Ωtyp PFET, bypassing the buck converter entirely. This mode is used during PA peak-power transmission to eliminate conversion losses and ensure maximum efficiency. The MAX8504ETC remains fully functional in this state, with the PWM stage forced to 100% duty cycle.
How is the output voltage set on the MAX8504ETC?
The MAX8504ETC uses the FB (feedback) pin to set output voltage via an external resistive divider between OUT and GND. The internal reference regulates the FB node to 1.25V, so VOUT = 1.25V × (1 + R1/R2). Resistor R2 should be selected between 5kΩ and 50kΩ for optimal noise immunity and bias current balance. Unlike MAX8500–MAX8503, the MAX8504ETC does not support dynamic REFIN-based voltage adjustment.
What is the guaranteed output current rating for the MAX8504ETC?
The MAX8504ETC guarantees 600mA of continuous output current across the full operating temperature range (–40°C to +85°C) and input voltage range (2.6V to 5.5V). This rating applies in both PWM and bypass modes, with thermal derating applied above +70°C ambient per the 1349mW power dissipation limit in the 12-pin thin QFN package.
Does the MAX8504ETC support forced-PWM operation, and how is it enabled?
Yes, the MAX8504ETC supports forced-PWM operation to maintain constant 1MHz switching regardless of load. This mode is enabled by connecting the SKIP pin to BATT (logic-high), which disables pulse-skipping and ensures predictable EMI spectrum - essential for RF-sensitive applications like W-CDMA transceivers. In forced-PWM mode, quiescent current rises to 3.3mA typical, versus 280µA in skip mode.
What package type and dimensions does the MAX8504ETC use?
The MAX8504ETC is packaged in a 12-pin thin QFN (Quad Flat No-lead) measuring 4mm × 4mm with a maximum height of 0.8mm. It features an exposed thermal paddle on the underside, electrically connected to PGND, which must be soldered to a large PCB copper pour for thermal and electrical performance. The top marking is "AABS", and pin 1 is identified by a dot or notch near the bottom-left corner.
MAX8504ETC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 12-WQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- Cellular, CDMA Handset
- Current - Supply:
- 280µA
- Voltage - Supply:
- 2.6V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-TQFN (4x4)
MAX8504ETC FAQ
1.How can I place an order for MAX8504ETC through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8504ETC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8504ETC reliable?
The price and inventory of MAX8504ETC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8504ETC is usually 5 days.
3.What payment methods are accepted for MAX8504ETC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8504ETC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8504ETC?
MAX8504ETC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8504ETC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8504ETC?
For technical support, including MAX8504ETC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8504ETC requirements.
6.How does Aetrix verify that MAX8504ETC is sourced from the original manufacturer or authorized distributors?
All MAX8504ETC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8504ETC meets industry standards.
7.What is the process for return or replacement of MAX8504ETC?
All MAX8504ETC units undergo pre-shipment inspection (PSI). If there is an issue with MAX8504ETC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8504ETC part is unused and in its original packaging.
Return procedure for MAX8504ETC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX8504ETC Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

