My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX8552ETB
- Part No.:
- MAX8552ETB
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Gate Drivers
- Package:
- 10-WFDFN Exposed Pad
- Datasheet:
-
MAX8552ETB.pdf
- Description:
- MAX8552 HIGH-SPEED, WIDE-INPUT,
- Quantity:
- Payment:
- Shipping:
Inventory:524
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX8552ETB from Maxim Integrated is a high-speed, wide-input single-phase MOSFET driver IC designed for synchronous buck converters in CPU core-voltage regulation. It delivers 1.3Ω/0.7Ω DH sourcing/sinking and 1.0Ω/0.5Ω DL sourcing/sinking drive strength, supports up to 2MHz switching (TDFN package), and features user-programmable dead-time delay for shoot-through prevention in desktop/server VRMs.
For engineers reviewing the MAX8552ETB datasheet, MAX8552ETB pinout, MAX8552ETB application, or MAX8552ETB equivalent, key selection criteria include adaptive + programmable dead time control, 12ns propagation delay, 3000pF load drive capability, and TDFN-10 (3mm × 3mm) thermal performance for high-current multiphase power stages.
Technical Context
The MAX8552ETB integrates dual N-MOSFET gate drivers with adaptive shoot-through protection: DL activates only when LX falls below 2.4V, and DH activation is delayed by either adaptive timing or an externally programmed resistor (RDLY) on the DLY pin. Its BiCMOS process enables fast 11ns rise/fall times under 3000pF load at 5V supply.
It operates with VCC = 4.5V–6.5V and supports high-side bootstrap operation via BST–LX flying capacitor; DH swings between LX and BST (up to +35V), while DL swings between VCC and PGND. EN input enables full shutdown (<0.1µA ICC), and PWM input accepts TTL/CMOS logic levels up to 2MHz in the TDFN package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5V to 6.5V - powers internal logic and low-side driver; requires dual bypassing (2.2µF to PGND, 0.47µF to GND) |
| DH Driver Resistance | 1.3Ω sourcing / 0.7Ω sinking - enables ≥4A peak sourcing and ≥7A peak sinking at 5V, reducing high-side switching losses |
| DL Driver Resistance | 1.0Ω sourcing / 0.5Ω sinking - enables ≥5A peak sourcing and ≥10A peak sinking at 5V, optimizing low-side turn-on speed |
| Propagation Delay | 12ns typical - ensures precise timing alignment between PWM edge and MOSFET gate transitions for stable high-frequency operation |
| Rise/Fall Time | 11ns typical (DH/DL) with 3000pF load - sustains clean edges at 1–2MHz switching frequencies without excessive ringing |
| Max Switching Frequency | 2MHz (TDFN package) - enabled by low RON, fast timing, and enhanced thermal dissipation (1951mW @ +70°C) |
| Shutdown Current | 0.1µA typical at +85°C - meets ultra-low-power requirements for portable or standby-mode systems |
Pinout & Package
The MAX8552ETB is housed in a 10-pin Thin DFN (TDFN) package measuring 3.0mm × 3.0mm × 0.80mm with exposed paddle (connected to GND), optimized for thermal performance in high-current applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pin 1) | Logic supply input | 4.5–6.5V rail powering internal circuitry and DL driver; requires local 2.2µF (PGND) + 0.47µF (GND) decoupling |
| DL (Pin 2) | Low-side gate driver output | Swings 0V to VCC; includes anticrowbar logic that holds DL low until LX < 2V; pulled to PGND in shutdown |
| PGND (Pin 3) | Power ground return | High-current return path for DL and MOSFET source; must connect directly to low-side MOSFET source pad |
| GND (Pin 4) | Analog ground reference | Reference for UVLO, PWM threshold, and internal comparators; separate from PGND to avoid noise coupling |
| DLY (Pin 5) | Dead-time programming input | Connects external resistor to GND to set fixed delay between DL-off and DH-on; tie to VCC to disable and use adaptive timing only |
| PWM (Pin 6) | Control signal input | TTL/CMOS-compatible; high = DH on / DL off, low = DH off / DL on; supports up to 2MHz in TDFN package |
| EN (Pin 7) | Enable control input | Active-high; drives IC into <0.1µA shutdown state when low; required for power sequencing in portable designs |
| LX (Pin 8) | Switch-node connection | Connects to source of high-side MOSFET and drain of low-side MOSFET; supplies bootstrap charge path for DH driver |
| DH (Pin 9) | High-side gate driver output | Swings between LX and BST; includes anticrowbar delay and optional RDLY-programmed delay; pulled to LX in shutdown |
| BST (Pin 10) | Bootstrap capacitor terminal | Connects 0.47µF+ ceramic capacitor to LX; generates floating supply for DH driver; rated up to +35V relative to PGND |
Key Features
| Feature | Design Value |
|---|---|
| User-programmable dead-time delay | Adjustable 67.5–112.5ns delay (via RDLY) between DL turn-off and DH turn-on, supplementing adaptive timing to prevent shoot-through across diverse MOSFETs |
| Adaptive shoot-through protection | DL only turns on after LX falls below 2.4V, and DH only turns on after DL turns off-ensures safe commutation without external timing components |
| High-frequency capability (2MHz) | Enabled by 12ns propagation delay, 11ns rise/fall times, and 1951mW thermal dissipation in TDFN-10-supports compact VRM designs with minimal output capacitance |
| Ultra-low shutdown current | 0.1µA typical at +85°C-enables long battery life in portable systems where CPU voltage rails must be fully disabled during sleep states |
| Robust level-shifted high-side drive | DH operates with BST–LX differential up to +35V and LX–PGND swing up to +28V-supports wide VIN buck stages (6–24V input) in server/desktop platforms |
Applications
| Processor-Core Voltage Regulation | Desktop/Server VRMs |
|---|---|
Use Scenario: Delivering tightly regulated 1.45V @ 25A to modern x86 CPU cores with dynamic load steps exceeding 100A/µs. IC Role / Device Role / Timing Role: Single-phase gate driver controlling high/low-side N-MOSFET pair in a multiphase buck stage synchronized to MAX8524/MAX8525 controllers. Use Value: 12ns propagation delay and 11ns edge rates ensure minimal timing skew across phases, maintaining current balance and reducing output ripple under transient loads. |
Use Scenario: High-density voltage regulator modules supplying GPU or ASIC cores in 1U servers with strict thermal envelope limits. IC Role / Device Role / Timing Role: High-efficiency MOSFET driver enabling 2MHz operation in space-constrained TDFN-10 footprint, paired with IRF7832/IRF7821 MOSFETs. Use Value: Exposed paddle and 24.4mW/°C derating allow >1.5W continuous dissipation-supporting 30A/phase output without forced air cooling. |
| Notebook CPU Power Delivery | Multiphase Buck Converter Building Block |
Use Scenario: Slim-profile notebook platforms requiring rapid power-state transitions (C-states) and zero-quiescent-current shutdown. IC Role / Device Role / Timing Role: Gate driver activated/deactivated via EN pin to eliminate leakage paths during S3/S4 sleep, with <0.1µA shutdown current. Use Value: Dual ground separation (GND/PGND) and integrated UVLO prevent false turn-on during brown-out conditions-critical for reliable resume-from-sleep behavior. |
Use Scenario: Modular power design where identical MAX8552ETB-based phases are stacked for scalable 2-/3-/4-/6-/8-phase CPU VRMs. IC Role / Device Role / Timing Role: Standardized single-phase driver unit compatible with MAX8524/MAX8525 controllers and shared layout across phase count variants. Use Value: Pin-compatible TDFN-10 footprint and identical timing specs enable reuse of PCB layout, BOM, and firmware across multiple platform generations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar single-phase MOSFET driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86553DQKT-LF-Z | Higher 3A/6A peak drive, integrated bootstrap diode, but fixed 100ns dead time (non-programmable); 12V max VCC | Targeted at cost-sensitive consumer DC/DC; lacks adaptive shoot-through detection and LX voltage sensing | Choose when fixed dead time suffices and bootstrap diode integration reduces BOM count-unsuitable for high-reliability CPU VRMs requiring dynamic dead-time adjustment |
| LM5113SD/NOPB | Separate high/low-side inputs, 1.5A/3A drive, no integrated dead-time logic; supports up to 100V bootstrap | Designed for industrial isolated half-bridge or LLC topologies-not optimized for synchronous buck timing integrity | Choose for non-synchronous or isolated gate drive where independent control and higher voltage tolerance outweigh need for shoot-through protection |
Compared with MP86553DQKT-LF-Z and LM5113SD/NOPB, the MAX8552ETB uniquely combines adaptive + programmable dead time, dual ground isolation, and 2MHz-ready timing in a thermally enhanced TDFN package-making it the only option qualified for high-performance, multi-phase CPU core-voltage regulation with guaranteed shoot-through immunity.
Availability
MAX8552ETB is available at Aetrix Electronics and suitable for desktop VRMs, server CPU power delivery, and notebook core-voltage regulation requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial OEM programs.
Supply support for MAX8552ETB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for computing, communications, and industrial applications.
The MAX8552ETB belongs to Maxim's high-speed power driver product line, engineered specifically for multiphase synchronous buck converters in CPU/GPU core-voltage regulation-emphasizing timing precision, shoot-through immunity, and thermal efficiency in dense power stages.
FAQ
What is the maximum operating frequency supported by the MAX8552ETB?
The MAX8552ETB supports up to 2MHz switching frequency when used in its 10-pin TDFN package, enabled by 12ns propagation delay, 11ns rise/fall times into 3000pF loads, and thermal design allowing 1951mW dissipation at +70°C. This exceeds the 1.2MHz limit of the µMAX variant and is validated for stable operation in high-density VRMs.
How does the MAX8552ETB prevent shoot-through current in synchronous buck converters?
The MAX8552ETB prevents shoot-through using dual mechanisms: adaptive logic that delays DL turn-on until LX falls below 2.4V, and user-programmable delay (via RDLY on DLY pin) between DL turn-off and DH turn-on. These features operate independently of external controller timing, ensuring robust protection even with varying MOSFET gate charges and PCB parasitics.
What is the purpose of the exposed paddle on the MAX8552ETB TDFN package?
The exposed paddle on the MAX8552ETB TDFN package serves as a thermal and electrical connection to GND, significantly improving heat dissipation-enabling 1951mW continuous power handling at +70°C with 24.4mW/°C derating. It must be soldered to a dedicated GND copper pour to achieve specified thermal performance and EMI suppression.
Can the MAX8552ETB drive both high-side and low-side N-MOSFETs in a synchronous buck stage?
Yes, the MAX8552ETB is explicitly designed to drive both high-side and low-side N-MOSFETs: DH outputs a level-shifted gate drive referenced to LX (for high-side), while DL outputs a ground-referenced drive (for low-side). Its 1.3Ω/0.7Ω DH and 1.0Ω/0.5Ω DL drive strengths support ≥30A per phase with fast switching and minimal conduction loss.
What are the key differences between the MAX8552ETB and MAX8552EUB variants?
The MAX8552ETB uses a 10-pin TDFN (3mm × 3mm) package with 2MHz max frequency and 1951mW thermal rating, while the MAX8552EUB uses a 10-pin µMAX (3mm × 4.9mm) package limited to 1.2MHz and 444.4mW. Both share identical electrical specs and pinout, but the TDFN offers superior thermal performance and higher-frequency capability for demanding VRM applications.
MAX8552ETB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 10-WFDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Synchronous
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 4.5V ~ 6.5V
- Logic Voltage - VIL, VIH:
- 0.8V, 2.5V
- Current - Peak Output (Source, Sink):
- -
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 14ns, 9ns
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-TDFN-EP (3x3)
MAX8552ETB FAQ
1.How can I place an order for MAX8552ETB through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8552ETB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8552ETB reliable?
The price and inventory of MAX8552ETB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8552ETB is usually 5 days.
3.What payment methods are accepted for MAX8552ETB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8552ETB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8552ETB?
MAX8552ETB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8552ETB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8552ETB?
For technical support, including MAX8552ETB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8552ETB requirements.
6.How does Aetrix verify that MAX8552ETB is sourced from the original manufacturer or authorized distributors?
All MAX8552ETB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8552ETB meets industry standards.
7.What is the process for return or replacement of MAX8552ETB?
All MAX8552ETB units undergo pre-shipment inspection (PSI). If there is an issue with MAX8552ETB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8552ETB part is unused and in its original packaging.
Return procedure for MAX8552ETB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX8552ETB Tags
-
ZXGD3009E6TA
Diodes Incorporated
-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments
-
MCP1416T-E/OT
Microchip Technology
-
MCP1402T-E/OT
Microchip Technology
-
MCP1415T-E/OT
Microchip Technology
-
MCP1401T-E/OT
Microchip Technology
-
IX4428NTR
Littelfuse Inc.
-
IRS2005STRPBF
Infineon Technologies
-
IRS2008STRPBF
Infineon Technologies
-
IX4310TTR
Littelfuse Inc.
-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
