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Analog Devices Inc./Maxim Integrated MAX8702ETP

Part No.:
MAX8702ETP
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Gate Drivers
Package:
20-WFQFN Exposed Pad
Datasheet:
AetrixMAX8702ETP.pdf
Description:
MAX8702 DUAL-PHASE MOSFET DRIVER
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:402

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Product details

Overview

The MAX8702ETP from Maxim Integrated is a dual-phase noninverting MOSFET driver IC designed for CPU core multiphase buck regulators in notebook systems. It integrates a resistor-programmable temperature sensor, delivers 5A typical low-side sink current, features 0.35Ω typical DL on-resistance, and operates across 4.5V–28V input range - enabling direct battery-to-core voltage conversion in 2–4-cell Li+ systems.

For engineers reviewing the MAX8702ETP datasheet, MAX8702ETP pinout, MAX8702ETP application, or MAX8702ETP equivalent, this page provides verified technical context, real-world timing behavior (19ns DH/DL propagation delay), adaptive dead-time control logic, thermal trip configuration via TSET, and validated alternative options for multiphase gate-driver selection.

Technical Context

The MAX8702ETP implements two independent high-side (DH1/DH2) and low-side (DL1/DL2) gate drivers with adaptive dead-time control per phase to prevent shoot-through. Each channel includes zero-crossing comparators tied to LX/PGND for pulse-skipping mode activation when SKIP = AGND.

It integrates a die-temperature sensor with open-drain DRHOT output, programmable via external resistor at TSET pin (trip range up to +160°C, 10°C hysteresis). UVLO triggers at 3.85V (typ) on VCC, and shutdown (SHDN = SKIP = AGND) reduces quiescent current to 2µA while forcing DH low and DL high.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.5V to 28V - supports direct battery input (7V–20V typical) without pre-regulation
Propagation Delay19ns (PWM→DL), 23ns (PWM→DH) - enables high-frequency operation up to 1.2MHz
DL On-Resistance0.35Ω (typ) - ensures fast turn-off of large synchronous-rectifier MOSFETs under high dV/dt
Drive Current5A (DL sink), 1.5A (DH source/sink) - drives 3nF gate loads with 8ns rise/fall times
Temperature SensingResistor-programmable trip point (up to +160°C), 10°C hysteresis - enables system-level thermal management
Shutdown Current2µA (typ) - maintains ultra-low power state during system sleep or suspend
Package20-pin thin QFN, 4mm × 4mm - thermally enhanced layout with exposed pad tied to AGND

Pinout & Package

MAX8702ETP uses a 20-pin thermally enhanced thin QFN package (4mm × 4mm) with exposed paddle connected to AGND for optimal thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
PWM1 / PWM2Phase 1/2 PWM logic inputsTTL/CMOS-compatible; control DH high/low and DL complement states per phase
DH1 / DH2High-side gate outputsBootstrap-referenced (BSTx–LXx); swing between LXx and BSTx to drive high-side N-MOSFET gates
DL1 / DL2Low-side gate outputsGround-referenced (PGNDx–VDD); 0.35Ω pulldown ensures robust turn-off under capacitive coupling
LX1 / LX2Switch-node connectionsReturn path for DH drivers; input to zero-crossing comparators for pulse-skipping mode
TSETTemperature set-point inputConnects external 1% resistor to AGND; sets thermal trip point via RTSET = 85,210/T − 745,200/T² − 195 (T in K)
DRHOTOpen-drain hot-indicator outputPulled low when die temperature exceeds programmed threshold; requires external pull-up
SHDN / SKIPControl logic inputsSHDN + SKIP low → shutdown (2µA IQ); SKIP low alone → pulse-skipping PFM mode

Key Features

FeatureDesign Value
Dual-phase adaptive dead-time controlPrevents shoot-through by dynamically adjusting DH/DL overlap based on actual gate transitions
Resistor-programmable thermal sensingEnables precise system-level thermal response without external ICs or firmware intervention
Pulse-skipping mode with zero-crossing detectionImproves light-load efficiency by truncating DL on-time at inductor current zero-crossing
Robust low-side driver (0.35Ω RDL_LOW)Suppresses false turn-on caused by LX node dV/dt coupling into DL trace parasitics
UVLO with hysteresis (85mV)Ensures clean power-on sequencing and prevents erratic operation during brownout conditions

Applications

Mobile CPU Core RegulationNotebook Battery-to-Core Conversion

Use Scenario: Regulating 0.85V–1.5V CPU core voltage from 7V–20V AC adapter or 2–4-cell Li+ battery input in ultraportable notebooks.

IC Role / Device Role / Timing Role: Dual-phase gate driver synchronizing high-side and low-side MOSFETs; provides adaptive dead-time and pulse-skipping for dynamic load steps.

Use Value: Enables single-stage conversion with >90% efficiency at full load and >85% at 10% load via PFM mode - reducing heat and extending battery runtime.

Use Scenario: Direct step-down from battery voltage to processor core supply in fanless or thermally constrained designs.

IC Role / Device Role / Timing Role: Gate driver with integrated temperature monitoring; DRHOT signals thermal events before throttling occurs.

Use Value: Eliminates need for discrete thermal sensor and comparator; allows early thermal mitigation using same die temperature reading as internal thermal shutdown.

Server VRM Auxiliary StageMultiphase Point-of-Load Supply

Use Scenario: Secondary regulation stage in dual-stage server VRMs where primary converter outputs ~5V or 12V.

IC Role / Device Role / Timing Role: High-frequency dual-phase driver operating at 600kHz–1.2MHz; leverages fast 19ns propagation for tight transient response.

Use Value: Reduces output capacitor count vs. single-phase solutions; supports 40A+ total output with interleaved ripple cancellation.

Use Scenario: High-current POL supply for FPGAs, ASICs, or GPU memory in embedded industrial systems.

IC Role / Device Role / Timing Role: Gate driver with shutdown control (SHDN/SKIP) and robust 5A DL sink for driving paralleled low-side MOSFETs.

Use Value: Supports rapid enable/disable sequencing and graceful power-down without shoot-through risk during state transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-phase MOSFET driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX8703ETPNo integrated temperature sensor or TSET/DRHOT pins; otherwise identical pinout, timing, and drive specsUsed where thermal monitoring is handled externally or not requiredSelect MAX8703ETP when DRHOT signaling and resistor-programmed trip point are unnecessary - reduces BOM count and layout complexity
ISL6208CRZSingle-phase driver; no integrated temperature sensor; 3.3V–28V VDD range; 25ns propagation delayRequires two ISL6208CRZ for dual-phase operation; lacks pulse-skipping zero-crossing comparatorChoose ISL6208CRZ only for cost-sensitive, lower-current applications where dual-phase interleaving is not needed

Compared with MAX8703ETP, the MAX8702ETP adds thermal awareness without sacrificing drive strength or timing precision; versus ISL6208CRZ, it delivers true dual-phase integration, adaptive dead-time, and system-level thermal signaling in one 20-pin QFN - reducing component count and PCB area in space-constrained CPU power designs.

Availability

MAX8702ETP is available at Aetrix Electronics and suitable for notebook CPU core supplies, multiphase high-current power supplies, and server/workstation VRM applications requiring stable component supply and long-term lifecycle support.

Supply support for MAX8702ETP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for computing, communications, and industrial applications.

The MAX8702ETP belongs to Maxim's high-efficiency multiphase gate-driver product line, engineered specifically for notebook and mobile CPU core power delivery with integrated thermal intelligence and adaptive timing control.

FAQ

What is the function of the TSET pin on the MAX8702ETP?

The TSET pin on the MAX8702ETP accepts an external resistor connected to AGND to program the thermal trip point of the integrated temperature sensor. Using the formula RTSET = (85,210 / T) − (745,200 / T²) − 195 (with T in Kelvin), designers can set the DRHOT assertion threshold from approximately +85°C to +160°C. This resistor must be 1% tolerance for accurate calibration, and the MAX8702ETP applies 10°C hysteresis to prevent output oscillation near the trip point.

How does the MAX8702ETP prevent shoot-through in high-frequency operation?

The MAX8702ETP prevents shoot-through using per-channel adaptive dead-time control that monitors actual DH and DL output transitions - not just input PWM edges. When DH turns off, the circuit delays DL turn-on until DH voltage fully settles; similarly, DL turn-off delays DH turn-on. This real-time sensing works only with low-inductance, short gate traces (10–20 squares) between the MAX8702ETP and MOSFET gates. The 0.35Ω typical DL on-resistance further suppresses false turn-on from LX node dV/dt coupling.

Can the MAX8702ETP operate with a 3.3V logic supply?

No, the MAX8702ETP requires VCC and VDD supplies between 4.5V and 5.5V - it does not support 3.3V logic interfaces. Its PWM, SHDN, and SKIP inputs have TTL/CMOS thresholds (VIH = 2.4V min, VIL = 0.8V max), but internal circuitry and gate drivers are designed for 5V operation. Using 3.3V logic levels risks unreliable UVLO behavior, degraded drive strength, and undefined thermal sensor accuracy. A level-shifter or 5V bias rail is mandatory for interface compatibility.

What happens to the MAX8702ETP outputs during shutdown mode?

When both SHDN and SKIP pins are driven low, the MAX8702ETP enters shutdown mode: DH1/DH2 are forced low, DL1/DL2 are forced high, quiescent current drops to 2µA (typ), and the temperature sensor (including DRHOT and TSET circuitry) is disabled. This state isolates the power stage, prevents unintended switching, and eliminates gate-drive leakage paths - ensuring safe, low-power standby in battery-powered systems. Normal operation resumes when SHDN returns high.

Is the MAX8702ETP pin-compatible with the MAX8703ETP?

Yes, the MAX8702ETP and MAX8703ETP share identical pinout, package (20-pin thin QFN), electrical specifications, and functional behavior - except the MAX8702ETP includes additional TSET and DRHOT pins (pins 4 and 5), which are No Connect (N.C.) on the MAX8703ETP. PCB layouts designed for MAX8702ETP can accommodate MAX8703ETP without modification, though DRHOT pull-up and TSET resistor must be omitted or left unpopulated. Thermal sensing capability is the sole functional difference.

MAX8702ETP Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
20-WFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Synchronous
Number of Drivers:
4
Gate Type:
N-Channel MOSFET
Voltage - Supply:
4.5V ~ 28V
Logic Voltage - VIL, VIH:
0.8V, 2.4V
Current - Peak Output (Source, Sink):
1.5A, 1.5A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
16ns, 14ns
Operating Temperature:
-40°C ~ 100°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-TQFN-EP (4x4)

MAX8702ETP FAQ

1.How can I place an order for MAX8702ETP through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX8702ETP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX8702ETP reliable?

The price and inventory of MAX8702ETP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8702ETP is usually 5 days.

3.What payment methods are accepted for MAX8702ETP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8702ETP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX8702ETP?

MAX8702ETP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX8702ETP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX8702ETP?

For technical support, including MAX8702ETP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8702ETP requirements.

6.How does Aetrix verify that MAX8702ETP is sourced from the original manufacturer or authorized distributors?

All MAX8702ETP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8702ETP meets industry standards.

7.What is the process for return or replacement of MAX8702ETP?

All MAX8702ETP units undergo pre-shipment inspection (PSI). If there is an issue with MAX8702ETP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX8702ETP part is unused and in its original packaging.

Return procedure for MAX8702ETP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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