Taiwan Semiconductor Corporation MBR3035PT C0G
- Part No.:
- MBR3035PT C0G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-247-3
- Datasheet:
-
MBR3035PT C0G.pdf
- Description:
- DIODE ARR SCHOTT 35V 30A TO247AD
- Quantity:
- Payment:

- Shipping:

Inventory:3,329
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Product details
Overview
MBR3035PT from Taiwan Semiconductor is a 30A, 35V dual-die Schottky barrier rectifier in TO-247AD package, featuring 1.4°C/W junction-to-case thermal resistance, 200A surge current rating, and AEC-Q101 qualification option. It delivers low forward voltage (0.82V at 30A/25°C) for high-efficiency SMPS and DC-DC converters in industrial power supplies.
For engineers reviewing the MBR3035PT datasheet, MBR3035PT pinout, MBR3035PT application, or MBR3035PT equivalent, key selection criteria include repetitive peak reverse voltage (35V), forward current rating (30A), thermal performance (RθJC = 1.4°C/W), surge capability (200A), and automotive-grade qualification availability.
Technical Context
This dual-die Schottky rectifier uses guard ring technology for overvoltage protection and achieves high surge current handling via optimized metal-semiconductor junction design. Its 10,000 V/μs critical dV/dt rating supports fast-switching topologies without parasitic turn-on.
The device operates across -55°C to +150°C junction temperature range with 1000 µA max reverse leakage at 25°C and 20 mA at 125°C, enabling stable performance in thermally demanding power conversion stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 35 V - Maximum repetitive reverse blocking voltage; defines safe operating limit in flyback/freewheeling paths |
| IF | 30 A - Continuous forward current rating; determines heatsink sizing and conduction loss budget |
| IFSM | 200 A - Non-repetitive surge current (8.3 ms half-sine); enables robust startup and fault tolerance |
| VF | 0.82 V @ 30A, 25°C - Low conduction loss directly reduces power dissipation and improves system efficiency |
| RθJC | 1.4 °C/W - Thermal resistance from junction to case; enables precise thermal modeling for mounting interface design |
| TJ max | +150 °C - Maximum junction temperature; sets upper boundary for thermal derating curves and reliability margins |
| IR | 1000 µA @ 35V, 25°C - Reverse leakage current; impacts standby power and high-impedance bias networks |
Pinout & Package
Package: TO-247AD (TO-3P), 3-terminal through-hole package with isolated tab, matte tin-plated leads, UL 94V-0 molding compound, and polarity marking per device body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 | Input terminal for first Schottky die | Connects to switching node in dual-phase or interleaved rectification; requires low-inductance layout |
| Cathode (Common) | Shared output node for both dies | Single low-impedance return path; must handle full 30A continuous current and 200A surge |
| Anode 2 | Input terminal for second Schottky die | Enables dual-channel operation or parallel configuration; electrically isolated from Anode 1 |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring structure | Prevents edge breakdown under transient overvoltage, improving reliability in unregulated input conditions |
| AEC-Q101 qualification option | Validated for automotive power modules requiring extended temperature cycling and mechanical shock compliance |
| UL Recognized (E-326243) | Confirms flammability, electrical insulation, and long-term safety compliance for end-equipment certification |
| Halogen-free construction | Meets IEC 61249-2-21; eliminates brominated flame retardants for RoHS-compliant manufacturing and recycling |
| 1.13 N·m max mounting torque | Defines mechanical assembly limit to avoid case cracking or internal bond wire damage during heatsink attachment |
Applications
| SMPS Secondary Rectification | Industrial DC-DC Converters |
|---|---|
Use Scenario: High-current secondary-side rectification in 300–500W offline flyback or forward converters. IC Role / Device Role / Timing Role: Dual-die Schottky rectifier replacing conventional diodes to minimize conduction loss and improve efficiency. Use Value: 0.82V forward drop at 30A reduces power loss by ~35% vs. silicon diodes, lowering thermal load on heatsinks. | Use Scenario: Output rectification in isolated 48V-to-12V telecom or server DC-DC bricks. IC Role / Device Role / Timing Role: Primary high-current freewheeling element in synchronous or quasi-resonant topologies. Use Value: 200A surge rating withstands inrush and short-circuit transients without degradation. |
| Monitor Power Supplies | TV Main Power Rails |
Use Scenario: +12V and +24V rail rectification in LCD monitor auxiliary power stages. IC Role / Device Role / Timing Role: Dual-anode configuration allows independent channel control for multi-rail designs. Use Value: Common-cathode topology simplifies PCB routing and reduces component count versus discrete dual-diode solutions. | Use Scenario: Main 12V/24V bulk rectification in LED-backlit TV power boards. IC Role / Device Role / Timing Role: High-reliability rectifier operating continuously at elevated ambient temperatures (>60°C). Use Value: 150°C max junction temperature and 1000 µA reverse leakage at 25°C ensure stable operation over product lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH03-M3 | Same 30A/35V rating, TO-247AC package, but single-die construction and no AEC-Q101 option | Lacks dual-die isolation; unsuitable for split-input or differential configurations | Select when dual-anode functionality is not required and automotive qualification is unnecessary |
| ON Semiconductor MBR3035CT | 30A/35V, TO-220AB package, higher RθJC (2.5°C/W), no AEC-Q101 variant | Lower thermal performance limits power density; not rated for high-vibration environments | Choose for cost-sensitive, lower-power applications where TO-220 footprint and thermal margin suffice |
Compared with VS-30CPH03-M3 and MBR3035CT, the MBR3035PT provides dual-die isolation, superior thermal resistance (1.4°C/W), and optional AEC-Q101 qualification-making it uniquely suited for high-reliability, high-density, and automotive-adjacent power systems.
Availability
MBR3035PT is available at Aetrix Electronics and suitable for switching mode power supplies, DC-DC converters, and TV/monitor power rails requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MBR3035PT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.
The MBR3035PT belongs to TSC's AEC-Q101-capable Schottky rectifier family, engineered for high-efficiency AC/DC and DC/DC power conversion where low VF, high IFSM, and thermal robustness are critical.
FAQ
What is the maximum junction temperature rating for the MBR3035PT?
The MBR3035PT has a maximum junction temperature (TJ) of +150°C, validated across its full operating range from -55°C to +150°C. This rating enables reliable operation in high-ambient environments such as enclosed power supplies and industrial enclosures. Derating curves in the official datasheet define allowable forward current reduction above 100°C case temperature. The MBR3035PT maintains specified electrical parameters-including 1000 µA reverse leakage at 25°C and 20 mA at 125°C-within this thermal envelope.
Does the MBR3035PT have AEC-Q101 qualification?
The MBR3035PT is available in an AEC-Q101-qualified version denoted by the suffix "H" (e.g., MBR3035PTH). Standard MBR3035PT units are not automatically qualified; only parts ordered with the "H" suffix undergo the full stress test sequence per AEC-Q101 Rev D. This qualification covers temperature cycling, high-temperature operating life, and mechanical shock testing-critical for automotive infotainment and body control module power stages. Always verify the ordering code and packaging label to confirm AEC-Q101 status for the MBR3035PT.
What is the forward voltage drop of the MBR3035PT at full rated current?
The MBR3035PT exhibits a typical forward voltage (VF) of 0.82 V at 30 A and 25°C junction temperature, measured per diode under pulsed conditions. At elevated temperature (125°C), VF drops to 0.73 V due to Schottky's negative temperature coefficient-improving conduction efficiency under thermal stress. These values are confirmed in the Electrical Specifications table of the official datasheet (Version K2103) and reflect actual device behavior, not guaranteed maxima. Designers should use 0.82 V for room-temperature loss calculations and 0.73 V for worst-case thermal analysis of the MBR3035PT.
How does the dual-die configuration of the MBR3035PT affect circuit layout?
As a dual-anode, common-cathode Schottky rectifier, the MBR3035PT provides two independent anode terminals sharing one cathode-enabling interleaved or split-input rectification without external paralleling. This configuration reduces PCB trace inductance and EMI compared to discrete dual-diode layouts. Layout must maintain symmetrical thermal paths to both anodes and ensure the cathode pad accommodates full 30A continuous current. Mounting torque must not exceed 1.13 N·m to prevent case deformation that could compromise internal die attachment integrity for the MBR3035PT.
What is the thermal resistance from junction to case (RθJC) for the MBR3035PT?
The MBR3035PT has a typical junction-to-case thermal resistance (RθJC) of 1.4°C/W, measured under standard mounting conditions with thermal interface material and flat heatsink contact. This value is critical for calculating maximum allowable power dissipation: Pmax = (TJmax − TC) / RθJC. For example, at 100°C case temperature, the MBR3035PT can dissipate up to 35.7 W before reaching its 150°C junction limit. The low RθJC results from optimized copper leadframe and direct die attach-key to achieving high power density in compact TO-247AD packages.
MBR3035PT C0G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 35 V
- Current - Average Rectified (Io) (per Diode):
- 30A
- Voltage - Forward (Vf) (Max) @ If:
- 820 mV @ 30 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 mA @ 35 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247AD (TO-3P)
MBR3035PT C0G FAQ
1.How can I place an order for MBR3035PT C0G through Aetrix?
Please submit a Request for Quotation (RFQ) for MBR3035PT C0G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBR3035PT C0G reliable?
The price and inventory of MBR3035PT C0G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBR3035PT C0G is usually 5 days.
3.What payment methods are accepted for MBR3035PT C0G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBR3035PT C0G transactions.
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4.How is shipping managed for MBR3035PT C0G?
MBR3035PT C0G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBR3035PT C0G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBR3035PT C0G?
For technical support, including MBR3035PT C0G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBR3035PT C0G requirements.
6.How does Aetrix verify that MBR3035PT C0G is sourced from the original manufacturer or authorized distributors?
All MBR3035PT C0G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBR3035PT C0G meets industry standards.
7.What is the process for return or replacement of MBR3035PT C0G?
All MBR3035PT C0G units undergo pre-shipment inspection (PSI). If there is an issue with MBR3035PT C0G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBR3035PT C0G part is unused and in its original packaging.
Return procedure for MBR3035PT C0G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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