Diodes Incorporated MBR3040PT

Overview

MBR3040PT from Diodes Incorporated is a 30A, 40V dual common-cathode Schottky barrier rectifier in TO-3P package, featuring 0.72V forward voltage at 30A/25°C, 200A non-repetitive surge capability, and 1.4°C/W junction-to-case thermal resistance-designed for high-efficiency DC-DC output rectification in telecom power supplies.

For engineers reviewing the MBR3040PT datasheet, MBR3040PT pinout, MBR3040PT application, or MBR3040PT equivalent, key selection criteria include its low V_F at high current, TO-3P thermal performance, 40V blocking rating, and suitability for 12V/24V/48V secondary-side rectification in switched-mode power supplies.

Technical Context

This device integrates two Schottky diodes in a single TO-3P thermally optimized package with common-cathode configuration, enabling synchronous rectifier replacement in center-tapped transformer topologies. Its guard ring die construction provides transient overvoltage protection without external components.

Rated for continuous 30A average forward current at T_C = 125°C and capable of 200A peak surge (8.3ms half-sine), it operates across –65°C to +150°C junction temperature range with 500pF typical junction capacitance at 1MHz/4V reverse bias.

Key Specifications

Pinout & Package

TO-3P molded plastic package (UL 94V-0), 5.6g weight, lead-free tin-plated terminals. Dimensions per AP02002: body width 20.63–22.38 mm, height 15.38–16.25 mm, mounting hole Ø2.9–3.65 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current Schottky rectifier applications.

Compared with VS-30CPH04 and MBR3040CT, the MBR3040PT offers superior thermal performance (1.4°C/W), integrated transient protection via guard ring, and TO-3P mechanical robustness-making it optimal for space-constrained, high-reliability telecom and industrial power systems.

Availability

MBR3040PT is available at Aetrix Electronics and suitable for telecom rectifiers, industrial DC-DC converters, server power supplies, and renewable energy inverters requiring stable component supply and long-term manufacturability assurance.

Supply support for MBR3040PT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.

The MBR30xxPT series belongs to Diodes' high-current Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in telecom, server, and industrial power conversion systems.

FAQ

What is the maximum junction temperature for continuous operation?

The MBR3040PT supports continuous operation up to +150°C junction temperature, with derating beginning at T_C = 125°C per Figure 1 in DS23017. At T_C = 100°C, the device sustains 30A average current; above that, linear derating applies until zero current at 150°C.

Is the MBR3040PT RoHS compliant and halogen-free?

Yes, the MBR3040PT features a lead-free finish and complies with EU RoHS Directive 2011/65/EU. Diodes Incorporated confirms it meets their "Green" standard-fully halogen- and antimony-free-as defined in their quality documentation and verified per JESD22-A112 test methods.

Can this part replace a single-anode Schottky diode in existing designs?

No-it is a dual common-cathode device with two anodes and one shared cathode. Direct substitution requires verifying circuit topology: it replaces two discrete Schottky diodes in center-tapped or dual-phase configurations, not single-diode placements. Layout changes may be needed for pin mapping and thermal pad routing.

Does the TO-3P package require thermal compound when mounted to a heatsink?

Thermal compound is recommended for optimal heat transfer, though not strictly required. With clean, flat mating surfaces and sufficient mounting pressure (≥20 lbf), bare metal contact achieves ~90% of rated R_θJC; compound improves consistency and reduces interfacial resistance by ~15%, especially under variable thermal cycling conditions.