Diodes Incorporated MBR3045CT-E1

Overview

MBR3045CT-E1 from Diodes Incorporated is a high-efficiency dual Schottky rectifier in TO-220-3 (2) package, rated for 45 V reverse voltage, 15 A average forward current per diode leg, and 0.7 V max forward voltage at 15 A and +25°C. It delivers low switching losses and low noise in high-frequency switch-mode power supplies and DC-DC converters.

For engineers reviewing the MBR3045CT-E1 datasheet, MBR3045CT-E1 pinout, MBR3045CT-E1 application, or MBR3045CT-E1 equivalent, key selection criteria include dual common-cathode configuration, 200 A non-repetitive surge capability, +150°C junction temperature rating, thermal resistance of 2.0 °C/W (junction-to-case), and RoHS-compliant lead-free finish.

Technical Context

This dual Schottky rectifier integrates two independent 15 A diode legs sharing a common cathode terminal, enabling synchronous output rectification in center-tapped or dual-output topologies. Its guard-ring structure enhances ruggedness against transient stress and improves reliability under repetitive surge conditions.

The device operates with minimal conduction loss due to low VF (0.57 V at 15 A and +125°C) and supports high-frequency operation up to 20 kHz square-wave peak current, making it suitable for compact, thermally constrained power converter designs requiring fast recovery and low EMI generation.

Key Specifications

Pinout & Package

MBR3045CT-E1 uses the TO-220-3 (2) package: insulated plastic case with three leads, metal tab electrically connected to cathode (Pin 2), and standard mounting hole for heatsink attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky rectifier applications.

Compared with MBR3045CT-G1 and MBR3045CTF-E1, the MBR3045CT-E1 provides optimal thermal performance in non-isolated, cost-sensitive power supplies while meeting baseline RoHS requirements-making it the preferred choice for mainstream industrial and consumer SMPS designs.

Availability

MBR3045CT-E1 is available at Aetrix Electronics and suitable for AC-DC adapters, industrial power supplies, and LED driver output stages requiring stable component supply, long-term manufacturability, and consistent thermal performance across production batches.

Supply support for MBR3045CT-E1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The MBR3045CT-E1 belongs to Diodes' high-efficiency Schottky rectifier product line, engineered specifically for high-frequency, medium-voltage power conversion where low forward voltage and rugged surge capability are critical.

FAQ

What is the maximum continuous forward current per anode leg?

The MBR3045CT-E1 supports 15 A average rectified forward current per anode leg (A1 or A2) at TC = +126°C, with a total device rating of 30 A when both legs operate simultaneously under proper thermal management.

Is the metal tab electrically isolated in the TO-220-3 (2) package?

No-the metal tab in the TO-220-3 (2) package is internally connected to Pin 2 (common cathode). Electrical isolation from the heatsink requires use of an insulating washer and shoulder washer, or selection of the TO-220F-3 variant.

Can MBR3045CT-E1 replace standard silicon rectifiers in existing designs?

Yes, provided the circuit operates below 45 V reverse voltage and benefits from lower VF. However, Schottky devices exhibit higher reverse leakage (0.1 mA @ +25°C), so verify that IR does not compromise regulation or standby power in low-load conditions.

What is the recommended minimum pad layout for thermal performance?

Diodes Incorporated specifies a minimum copper pad area of 400 mm² (20 mm × 20 mm) on the PCB's primary side, with ≥2 oz copper and thermal vias to inner ground planes, per their package outline documentation (http://www.diodes.com/package-outlines.html).