Diodes Incorporated MBRD1040-T
- Part No.:
- MBRD1040-T
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
MBRD1040-T.pdf
- Description:
- DIODE SCHOTTKY 40V 10A TO252
- Quantity:
- Payment:

- Shipping:

Inventory:3,678
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MBRD1040-T from Diodes Incorporated is a 10A, 40V low-forward-voltage Schottky barrier rectifier in DPAK package, designed for high-efficiency DC output rectification and freewheeling in low-voltage, high-frequency power supplies. It features 0.47V typical VF at 8A/25°C, 100A non-repetitive surge rating, and junction-to-case thermal resistance of 6.0°C/W - enabling compact thermal design in SMPS and OR-ing circuits.
For engineers reviewing the MBRD1040-T datasheet, MBRD1040-T pinout, MBRD1040-T application, or MBRD1040-T equivalent, key selection criteria include forward voltage drop at operating current, thermal resistance under PCB copper layout constraints, reverse leakage at elevated temperature, and mandatory PCB-level connection between pins 1 and 3 for current sharing and thermal path integrity.
Technical Context
This device implements a single-phase, half-wave Schottky rectifier structure with guard-ring die construction for transient robustness. Its 40V VRRM rating and 0.41–0.51V VFM range (depending on current and junction temperature) target 5V–12V output rails where conduction loss minimization is critical.
Thermal performance is defined by RJC = 6.0°C/W and RJA = 80°C/W (standard FR-4), requiring external PCB copper to serve as heatsink via pins 1 & 3 tie-down and bottom-side thermal pad (pin 4). The 700pF junction capacitance supports operation up to several MHz in switching converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum repetitive reverse blocking voltage; sets upper limit for input/output voltage differential in buck, flyback, or OR-ing topologies. |
| IO | 10 A - Average rectified output current at TA = 25°C; derates to ~6A at 100°C ambient per Fig. 4. |
| VFM | 0.47 V typ. @ 8A, 25°C - Directly determines conduction loss (PCOND ≈ I × VF) in 5–12V systems. |
| IFSM | 100 A - Peak surge current handling for 8.3ms half-sine; supports inrush and fault-current transients without bond-wire failure. |
| RJC | 6.0 °C/W - Junction-to-case thermal resistance; requires direct thermal coupling from die to PCB copper via pins 1/3 and exposed pad (pin 4). |
| Cj | 700 pF @ 4V - Junction capacitance at low reverse bias; impacts switching loss and EMI in >100kHz converters. |
| IRM | 12.5 mA max @ 100°C, 35V - Reverse leakage defines standby power loss and thermal runaway risk in parallel configurations. |
Pinout & Package
Package: DPAK (TO-252AA), surface-mount, with exposed thermal pad on underside (pin 4). Pins 1 and 3 are electrically identical anode terminals and must be connected together on the PCB to ensure current sharing and optimal thermal transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Primary anode connection; must be soldered and tied to Pin 3 on PCB for full 10A current capacity and thermal path. |
| Pin 2 | Cathode | Output node for rectified DC; connects to load or filter capacitor; carries full output current. |
| Pin 3 | Anode | Secondary anode terminal; electrically redundant with Pin 1; PCB trace connection ensures current balancing and thermal spreading. |
| Pin 4 (Bottom-side pad) | Thermal Sink / Anode | Exposed copper pad tied internally to anode; provides primary heat conduction path to PCB; requires solder mask opening and thermal vias. |
Key Features
| Feature | Design Value |
|---|---|
| Low VF Schottky architecture | 0.47V typ. @ 8A/25°C reduces conduction loss by ≥30% vs. standard PN rectifiers in 5V/12V rails. |
| Guard-ring die construction | Enhances ruggedness against voltage transients and ESD events without external snubbers in industrial power supplies. |
| DPAK thermal pad (Pin 4) | Enables 6.0°C/W RJC when mounted per AP02001 layout - critical for maintaining TJ < 150°C at full load. |
| 100A IFSM rating | Supports peak currents during cold-start or short-circuit conditions in server VRMs and telecom DC/DC modules. |
| UL 94V-0 molded plastic case | Meets flammability requirements for enclosed power adapters and industrial control enclosures. |
Applications
| Server VRM Output Rectification | Industrial DC/DC Converter Freewheeling |
|---|---|
Use Scenario: 12V input to 1.2V/10A output stage in multi-phase buck converter for CPU power delivery. IC Role / Device Role / Timing Role: Synchronous rectifier replacement; conducts during low-side MOSFET on-time to minimize conduction loss. Use Value: 0.47V VF cuts diode conduction loss to ~4.7W vs. ~8W for 0.8V Si diode - directly improving efficiency and reducing heatsink size. |
Use Scenario: Flyback secondary-side rectification in 24V industrial PLC power supply with 50kHz switching frequency. IC Role / Device Role / Timing Role: Unidirectional current path for energy transfer from transformer secondary to output capacitor. Use Value: 700pF Cj limits reverse recovery ringing, easing EMI filter design and enabling stable regulation under dynamic load steps. |
| Automotive Infotainment Power Supply | OR-ing Diode in Redundant 5V Systems |
Use Scenario: 12V automotive battery input to 5V/3A infotainment module with cold-crank tolerance down to 6V. IC Role / Device Role / Timing Role: Input polarity protection and pre-regulator rectifier before LDO or buck controller. Use Value: 40V VRRM withstands load-dump transients up to 40V; low VF preserves headroom during cranking. |
Use Scenario: Dual 5V/6A power sources feeding common bus in network switch with hot-swap capability. IC Role / Device Role / Timing Role: Unidirectional isolation element preventing backfeed between supplies during failover. Use Value: 12.5mA IRM at 100°C ensures minimal reverse leakage imbalance - critical for stable current sharing and no-bus-drop switchover. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SS1040-T | Same 40V/10A rating but SMB package; RJC = 15°C/W; no exposed thermal pad. | Limited to lower-power applications (<5A continuous) due to higher thermal resistance and no bottom-side heatsinking. | Select when board space is constrained and thermal budget allows higher TJ; avoid in sealed enclosures or high-ambient environments. |
| MBRD1045G | 45V VRRM, same DPAK package; VF = 0.52V typ. @ 8A; RJC = 6.0°C/W. | Higher blocking voltage enables use in 24V-input systems; 0.05V higher VF increases conduction loss by ~10% at 10A. | Select when system requires >40V transient margin (e.g., 24V industrial buses); accept minor efficiency trade-off for robustness. |
Compared with SS1040-T and MBRD1045G, MBRD1040-T delivers optimal balance of low VF, DPAK thermal performance, and 40V rating for cost-sensitive 12V-output power stages - making it preferred for high-density, thermally constrained designs where 40V margin suffices.
Availability
MBRD1040-T is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, automotive infotainment power supplies, and redundant OR-ing circuits requiring stable component supply across production lifecycles.
Supply support for MBRD1040-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for industrial, computing, and automotive markets.
The MBRD1040-T belongs to Diodes' low-VF Schottky rectifier product line, engineered specifically for high-efficiency, high-current DC/DC conversion in space-constrained power supplies where thermal management and conduction loss dominate design trade-offs.
FAQ
Why must pins 1 and 3 be connected on the PCB?
Pins 1 and 3 are internally connected anode terminals. Connecting them externally ensures balanced current distribution and maximizes thermal conduction through both leads and the exposed pad (pin 4). Omitting this connection risks localized overheating, current crowding, and premature failure at rated 10A load.
What is the maximum ambient temperature for continuous 10A operation?
Per Figure 4, continuous 10A operation is only supported up to ~25°C ambient on standard FR-4. At 75°C ambient, derated current is ~6.5A; at 100°C, it drops to ~4.5A. Achieving full 10A at higher temperatures requires enhanced PCB copper area and thermal vias per AP02001 layout guidelines.
Can MBRD1040-T replace a standard PN rectifier like 1N5408?
Yes - but only in low-voltage, high-frequency applications where its 40V VRRM and Schottky advantages apply. It cannot replace 1N5408 in 400V AC/DC front-ends due to lower blocking voltage. In 12V SMPS, MBRD1040-T reduces losses by >50% versus 1N5408, but requires careful thermal layout not needed for the slower, higher-VF PN device.
Is the bottom-side thermal pad (pin 4) electrically isolated?
No - the exposed pad is internally connected to the anode (same potential as pins 1 and 3). It must be routed to the anode net on the PCB and cannot be grounded or left floating. Solder mask openings and thermal vias to inner-layer copper planes are required to realize the specified 6.0°C/W RJC.
MBRD1040-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 10A
- Voltage - Forward (Vf) (Max) @ If:
- 510 mV @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 300 µA @ 35 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252 (DPAK)
- Operating Temperature - Junction:
- -65°C ~ 150°C
MBRD1040-T FAQ
1.How can I place an order for MBRD1040-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MBRD1040-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBRD1040-T reliable?
The price and inventory of MBRD1040-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBRD1040-T is usually 5 days.
3.What payment methods are accepted for MBRD1040-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBRD1040-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MBRD1040-T?
MBRD1040-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBRD1040-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBRD1040-T?
For technical support, including MBRD1040-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBRD1040-T requirements.
6.How does Aetrix verify that MBRD1040-T is sourced from the original manufacturer or authorized distributors?
All MBRD1040-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBRD1040-T meets industry standards.
7.What is the process for return or replacement of MBRD1040-T?
All MBRD1040-T units undergo pre-shipment inspection (PSI). If there is an issue with MBRD1040-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBRD1040-T part is unused and in its original packaging.
Return procedure for MBRD1040-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MBRD1040-T Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

