Taiwan Semiconductor Corporation MBRF750H

Overview

MBRF750H from Taiwan Semiconductor is a 7.5A, 50V AEC-Q101-qualified Schottky barrier rectifier in ITO-220AC package, featuring 0.75V forward voltage at 7.5A and 25°C, 150A surge current capability, and guard ring over-voltage protection. It serves as a primary output rectifier in automotive-grade DC-DC converters and industrial SMPS.

For engineers reviewing the MBRF750H datasheet, MBRF750H pinout, MBRF750H application, or MBRF750H equivalent, key selection criteria include its 50V V_RRM, 10mA reverse leakage at 125°C, junction-to-case thermal resistance of 7°C/W, AEC-Q101 qualification status, and ITO-220AC mounting compatibility with 0.56 N·m torque limit.

Technical Context

This single-die Schottky rectifier operates with low conduction loss due to its metal-semiconductor junction, enabling high-efficiency power conversion in switching topologies. Its guard ring structure enhances ruggedness against transient over-voltage events, while the matte tin-plated leads ensure reliable solderability per J-STD-002.

The device supports continuous operation up to +150°C junction temperature and withstands 150A non-repetitive surge current (8.3ms half-sine), making it suitable for high-reliability 12V/24V automotive power rails and industrial adapter front-ends where thermal management and transient immunity are critical.

Key Specifications

Pinout & Package

Package: ITO-220AC - Insulated TO-220 variant with electrically isolated tab, UL 94V-0 molding compound, and matte tin-plated leads. Mounting torque limited to 0.56 N·m.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-75CTQ050 and MBR750, the MBRF750H uniquely combines AEC-Q101 qualification, ITO-220AC form factor, and 10mA reverse leakage at 125°C-making it optimal for space-constrained automotive modules requiring zero requalification risk.

Availability

MBRF750H is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial SMPS output stages, and medical power adapters requiring stable component supply and long-term lifecycle assurance.

Supply support for MBRF750H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global automotive, industrial, and consumer markets since 1979.

The MBRF7xxH series was developed specifically for AEC-Q101-compliant power conversion in harsh-environment automotive subsystems, emphasizing thermal robustness, surge resilience, and process-controlled Schottky junction reliability.

FAQ

What is the maximum junction temperature rating for MBRF750H?

The MBRF750H has a maximum junction temperature (T_J) of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet. This rating enables reliable operation in under-hood automotive environments and sealed industrial enclosures. Derating curves confirm usable current capacity down to 0A at +150°C case temperature. The MBRF750H must be mounted to a heatsink capable of maintaining T_J ≤ 150°C under worst-case load and ambient conditions.

Is MBRF750H pin-compatible with non-AEC-Q101 versions like MBR750?

Yes, the MBRF750H shares identical ITO-220AC package dimensions, pinout, and terminal layout with MBR750 and other MBRF7xx variants. Both have anode, cathode, and isolated tab terminals in the same physical arrangement. However, MBRF750H includes additional AEC-Q101 qualification testing and tighter process controls-no PCB changes are required when upgrading from MBR750 to MBRF750H in existing designs.

What does the "H" suffix signify in MBRF750H?

The "H" suffix in MBRF750H explicitly denotes AEC-Q101 qualification per Taiwan Semiconductor's ordering nomenclature. This means the MBRF750H has undergone stress testing-including temperature cycling, high-temperature operating life, and unbiased high-humidity bias-to validate reliability for automotive electronic control units. The base part MBRF750 (without "H") is not AEC-Q101 qualified, even if otherwise identical in electrical specs.

What is the forward voltage of MBRF750H at elevated temperature?

At 7.5A and 125°C junction temperature, the MBRF750H exhibits a typical forward voltage (V_F) of 0.65V, per the Electrical Specifications table in the Taiwan Semiconductor datasheet. This value is lower than room-temperature V_F (0.75V), reflecting the negative temperature coefficient of Schottky diodes. Designers should use 0.65V for thermal performance modeling in high-ambient applications.

Does MBRF750H require a thermal pad or insulator when mounted to a heatsink?

No, the MBRF750H uses an ITO-220AC package with an electrically isolated metal tab, eliminating the need for thermal pads or insulators. The tab is internally insulated from both anode and cathode terminals, allowing direct mounting to grounded heatsinks. Mounting torque must not exceed 0.56 N·m to avoid package damage, and the tab surface must remain clean and flat for optimal thermal transfer in the MBRF750H assembly.