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Taiwan Semiconductor Corporation MBRF760H
- Part No.:
- MBRF760H
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-220-2 Full Pack
- Datasheet:
-
MBRF760H.pdf
- Description:
- 7.5A, 60V, PLANAR SCHOTTKY
- Quantity:
- Payment:
- Shipping:
Inventory:7,091
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Product details
Overview
MBRF760H from Taiwan Semiconductor is an AEC-Q101-qualified Schottky barrier rectifier in ITO-220AC package, rated for 7.5A average forward current, 60V repetitive peak reverse voltage, 150A surge current, and 150°C maximum junction temperature. It delivers low forward voltage (0.75V typ. at 7.5A, 25°C) and low reverse leakage (10 mA max. at 125°C), enabling high-efficiency power conversion in automotive-grade DC/DC converters.
For engineers reviewing the MBRF760H datasheet, MBRF760H pinout, MBRF760H application, or MBRF760H equivalent, key selection criteria include its AEC-Q101 qualification, 60V VRRM rating, ITO-220AC thermal performance (RθJC = 7°C/W), single-die configuration, and compatibility with high-surge, high-reliability 12V/24V automotive power rails.
Technical Context
The MBRF760H implements a single-die Schottky junction optimized for low VF and fast switching, with guard ring protection against transient overvoltage. Its 60V VRRM and 150A IFSM support robust operation under load dump and cold-crank conditions in automotive power systems.
Thermally, it uses an ITO-220AC package with matte tin-plated leads and UL 94V-0 molding compound, achieving 7°C/W junction-to-case thermal resistance - critical for sustained 7.5A conduction in constrained heatsink environments without derating below 100°C case temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - Withstands peak reverse transients up to 60V without breakdown; matches 24V automotive system rail requirements. |
| IF(AV) | 7.5 A - Sustains continuous DC output current in SMPS secondaries and DC/DC buck stages without forced air cooling. |
| VF @ 7.5A, 25°C | 0.75 V (typ) - Minimizes conduction loss (5.6W max at full load), improving efficiency over silicon diodes by ~30%. |
| IFSM | 150 A (8.3ms half-sine) - Survives automotive load dump surges without failure; eliminates need for parallel diode redundancy. |
| TJ max | 150 °C - Enables operation in under-hood environments where ambient exceeds 105°C with margin. |
| RθJC | 7 °C/W - Allows direct mounting to chassis or small heatsinks; 10.7°C rise per watt enables 7.5A operation at ≤100°C case temp. |
| IR @ 60V, 125°C | 10 mA (max) - Limits standby power loss in always-on vehicle modules; avoids thermal runaway in high-temp bias networks. |
Pinout & Package
Package: ITO-220AC - Insulated TO-220 variant with electrically isolated tab, UL 94V-0 flame-rated epoxy, matte tin-plated leads compliant with J-STD-002 solderability, and 0.56 N·m max mounting torque.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 1) | Input current entry point | Connected to positive input rail (e.g., switched node of buck converter); carries full load current into device. |
| Cathode (Lead 2) | Output current exit point | Connected to output filter capacitor or ground return; polarity-marked on package body per JEDEC standard. |
| Tab (Isolated) | Thermal path only | Electrically isolated metal surface for heatsinking; no electrical connection required for circuit function. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive temperature cycling, mechanical shock, and humidity testing - suitable for engine control, ADAS, and infotainment power supplies. |
| Guard ring structure | Prevents edge breakdown during dv/dt transients >10,000 V/µs - enhances reliability in noisy 48V mild-hybrid systems. |
| Low VF at high temperature | 0.65 V (typ) at 7.5A and 125°C - maintains efficiency under thermal stress where silicon diodes degrade significantly. |
| UL Recognized (E-326243) | Meets safety standards for end-equipment certification in industrial adapters and medical-adjacent power supplies. |
| Halogen-free construction | Complies with IEC 61249-2-21 - satisfies RoHS and automotive OEM material declarations for sustainable manufacturing. |
Applications
| Automotive DC/DC Converter | Industrial SMPS Secondary |
|---|---|
Use Scenario: Step-down conversion from 48V or 24V battery rail to 5V/3.3V for ECU microcontrollers and sensors. IC Role / Device Role / Timing Role: Output rectifier in synchronous or asynchronous buck topology; handles continuous 7.5A output with minimal conduction loss. Use Value: 0.75V VF reduces power dissipation by ~2.5W vs. comparable silicon diode, lowering heatsink size and enabling compact under-hood placement. | Use Scenario: High-efficiency secondary-side rectification in 100–500W industrial switch-mode power supplies. IC Role / Device Role / Timing Role: Freewheeling diode in flyback or forward converters operating at 50–200 kHz switching frequencies. Use Value: 150A IFSM withstands startup surges and short-circuit recovery without degradation; RθJC = 7°C/W supports natural convection cooling. |
| USB-C PD Adapter | Telecom Power Shelf |
Use Scenario: Compact 65W USB-C power adapter requiring high-density, low-noise 20V output stage. IC Role / Device Role / Timing Role: Output rectifier in active-clamp forward or LLC resonant converter secondary. Use Value: Low IR (100 µA @ 25°C) minimizes standby leakage, supporting Energy Star Level VI compliance; halogen-free construction meets regional environmental mandates. | Use Scenario: -48V telecom rectifier module supplying distributed 12V logic rails across multi-slot chassis. IC Role / Device Role / Timing Role: OR-ing diode in redundant power feed paths; blocks reverse current during hot-swap events. Use Value: 10,000 V/µs dv/dt rating prevents false turn-on during fast bus transients; AEC-Q101 qualification ensures long-term field reliability beyond telecom spec. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-75SQ060N | Same ITO-220AC package, 75A IFSM (vs. 150A), 0.72V VF @ 7.5A, 25°C; not AEC-Q101 qualified. | Targeted at commercial/industrial SMPS; lacks automotive qualification and surge margin. | Select when AEC-Q101 is unnecessary and cost sensitivity outweighs surge headroom. |
| ON Semiconductor MBR760CT | TO-220AB dual common-cathode configuration (not single die); 0.74V VF @ 7.5A, 25°C; AEC-Q101 qualified but higher RθJC (9°C/W). | Requires dual-channel layout; less thermally efficient in single-output designs. | Choose only if dual-output rectification is needed or existing PCB supports TO-220AB footprint. |
Compared with VS-75SQ060N and MBR760CT, the MBRF760H uniquely combines AEC-Q101 qualification, 150A surge rating, and 7°C/W thermal resistance in a single-die ITO-220AC package - making it optimal for space-constrained, high-reliability automotive and industrial power rails where thermal margin and transient immunity are critical.
Availability
MBRF760H is available at Aetrix Electronics and suitable for automotive power conversion, industrial SMPS design, and telecom rectifier modules requiring stable component supply, long lifecycle assurance, and AEC-Q101-compliant sourcing.
Supply support for MBRF760H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving automotive, industrial, and consumer markets since 1979.
The MBRF7xxH series was developed specifically for AEC-Q101-compliant power rectification in harsh-environment automotive subsystems - emphasizing surge resilience, thermal stability, and long-term parametric consistency under temperature cycling.
FAQ
What is the maximum junction temperature rating for the MBRF760H?
The MBRF760H has a maximum junction temperature (TJ max) of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet. This allows reliable operation in under-hood automotive environments where ambient temperatures exceed 105°C. The device's 7°C/W junction-to-case thermal resistance enables effective heat transfer to external heatsinks, ensuring the MBRF760H stays within safe operating limits even at full 7.5A load under elevated ambient conditions.
Is the MBRF760H pin-compatible with standard TO-220 packages?
No - the MBRF760H uses the ITO-220AC package, which features an electrically isolated metal tab, unlike standard TO-220AC. While physical footprint and lead spacing match TO-220AC, the isolation requires verification of mounting hardware insulation and thermal interface design. The MBRF760H pinout is Anode (Lead 1), Cathode (Lead 2), and isolated tab - confirming compatibility only with ITO-220AC-specific footprints. Always consult the Taiwan Semiconductor package outline drawing before PCB layout.
Does the MBRF760H meet AEC-Q101 requirements for automotive use?
Yes - the "H" suffix in MBRF760H explicitly denotes AEC-Q101 qualification per Taiwan Semiconductor's ordering information. This includes passing temperature cycling, mechanical shock, highly accelerated stress test (HAST), and board-level reliability tests defined in the AEC-Q101 standard. The MBRF760H is approved for use in automotive power supplies, body control modules, and ADAS subsystems where component-level stress validation is mandatory.
What is the typical forward voltage drop of the MBRF760H at 7.5A and 125°C?
The typical forward voltage (VF) of the MBRF760H is 0.65 V at 7.5A and 125°C, as specified in the Electrical Specifications table of the Taiwan Semiconductor datasheet. This value reflects stable performance under thermal stress - critical for maintaining efficiency in high-temperature automotive applications. At room temperature (25°C), VF is 0.75 V (typ), showing only modest increase with temperature, unlike silicon diodes whose VF rises significantly with junction heating.
How does the MBRF760H handle reverse leakage current at elevated temperatures?
The MBRF760H specifies a maximum reverse leakage current (IR) of 10 mA at 60V reverse bias and 125°C junction temperature. This is significantly lower than many competing Schottky rectifiers in the same voltage class, reducing standby power loss in always-on vehicle modules. At 25°C, IR is limited to 100 µA, supporting energy-efficient designs meeting strict regulatory thresholds like EU CoC Tier 2 and DoE Level VI.
MBRF760H Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-2 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io):
- 7.5A
- Voltage - Forward (Vf) (Max) @ If:
- 750 mV @ 7.5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 100 µA @ 60 V
- Capacitance @ Vr, F:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AC
- Operating Temperature - Junction:
- -55°C ~ 150°C
MBRF760H FAQ
1.How can I place an order for MBRF760H through Aetrix?
Please submit a Request for Quotation (RFQ) for MBRF760H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBRF760H reliable?
The price and inventory of MBRF760H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBRF760H is usually 5 days.
3.What payment methods are accepted for MBRF760H?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBRF760H transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MBRF760H?
MBRF760H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBRF760H order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBRF760H?
For technical support, including MBRF760H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBRF760H requirements.
6.How does Aetrix verify that MBRF760H is sourced from the original manufacturer or authorized distributors?
All MBRF760H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBRF760H meets industry standards.
7.What is the process for return or replacement of MBRF760H?
All MBRF760H units undergo pre-shipment inspection (PSI). If there is an issue with MBRF760H, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBRF760H part is unused and in its original packaging.
Return procedure for MBRF760H:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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