Diodes Incorporated MBRM360-13-F

Overview

MBRM360-13-F from Diodes Incorporated is a 3A, 60V surface-mount Schottky barrier rectifier in POWERMITE®3 package, featuring low forward voltage (0.59 V @ 3A, 25°C), low reverse leakage (2.0 µA @ 60V, 25°C), and 130 pF junction capacitance at 4V - optimized for low-voltage, high-frequency DC/DC converters, freewheeling diodes in synchronous buck stages, and polarity protection in industrial power supplies.

For engineers reviewing the MBRM360-13-F datasheet, MBRM360-13-F pinout, MBRM360-13-F application, or MBRM360-13-F equivalent, this Schottky rectifier delivers verified thermal resistance (R_θJS = 3.2°C/W), guard-ring die construction for transient robustness, and RoHS-compliant matte tin plating - critical for compact, thermally constrained 12V/24V embedded power rails.

Technical Context

This Schottky rectifier uses a planar guard-ring die structure to suppress edge breakdown and improve surge immunity under repetitive transients. Its low V_F and fast recovery (no minority-carrier storage) enable high-efficiency operation in switching frequencies up to 1 MHz without reverse recovery loss.

Thermal performance is defined relative to soldering point (not ambient): R_θJS = 3.2°C/W enables 3A continuous conduction with ≤38.4°C junction rise above board temperature when properly mounted on copper heatsink pads. Reverse leakage remains below 200 µA up to 125°C, supporting stable operation in sealed industrial enclosures.

Key Specifications

Pinout & Package

Package: POWERMITE®3 - molded plastic case (UL 94V-0), 3-pin SMT package with bottom-side heat sink (Pin 3). Dimensions: 4.03–4.09 mm (A) × 6.40–6.61 mm (B) × 1.83 mm (D) height. Pins 1 & 2 must be electrically connected on PCB for optimal current sharing and thermal path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS36-E3/57T and SB360-E3/57T, MBRM360-13-F offers the lowest forward voltage and reverse leakage in the POWERMITE®3 form factor, delivering superior thermal efficiency and battery runtime - making it optimal for space- and power-constrained industrial SMPS where layout reuse is required.

Availability

MBRM360-13-F is available at Aetrix Electronics and suitable for industrial power supplies, automotive body electronics, and telecom DC/DC converters requiring stable component supply and long-term manufacturability assurance.

Supply support for MBRM360-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management and signal integrity solutions for industrial, computing, and automotive markets.

MBRM360 belongs to Diodes' POWERMITE® Schottky rectifier product line, engineered specifically for high-current density, low-profile SMT power conversion where thermal resistance and leakage control are design-critical.

FAQ

Is MBRM360-13-F suitable for new designs despite the "NOT RECOMMENDED FOR NEW DESIGN" notice?

No - Diodes Incorporated explicitly marks MBRM360 as "NOT RECOMMENDED FOR NEW DESIGN USE" in its official datasheet (DS30355 Rev. 5-2). This indicates active obsolescence planning; newer alternatives like the PDS360 series offer improved V_F, lower leakage, and extended lifetime. Aetrix recommends verifying replacement part availability before committing to MBRM360-13-F in production.

What is the correct PCB pad layout for MBRM360-13-F's thermal pad (Pin 3)?

Per Diodes Application Note AP02001, Pin 3 requires a minimum 0.75" × 1.0" copper area on the top layer, connected via ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Pins 1 and 2 each need 0.25" × 1.0" pads, and must be shorted together on the PCB to balance current distribution and reduce bond-wire stress.

How does the guard ring construction affect reliability in automotive load-dump conditions?

The guard ring die structure prevents premature edge breakdown during 12V system load-dump transients (ISO 7637-2 Pulse 5a, 120V/100ms). Unlike non-guarded Schottkys, MBRM360 maintains stable 60V blocking without parametric shift after repeated 80V/50ms surges - validated per AEC-Q101 stress testing protocols.

Can MBRM360-13-F be used in parallel with identical units to increase current capacity?

No - parallel operation is not recommended due to mismatched forward voltage (±0.04 V typical) causing current imbalance. At 3A total, one device may carry >2.1A while the other carries <0.9A, exceeding its thermal limit. For >3A, select a single higher-rated device such as MBRM560 (5A/60V) in the same POWERMITE®3 package.