Diodes Incorporated MBRM560-13

Overview

MBRM560-13 from Diodes Incorporated is a 5A, 60V surface-mount Schottky barrier rectifier in POWERMITE®3 package, featuring low forward voltage (0.65V @ 5A, 25°C), low reverse leakage (2μA @ 60V, 25°C), and guard ring die construction for transient protection-used in low-voltage DC/DC converter output rectification and polarity protection circuits.

For engineers reviewing the MBRM560-13 datasheet, MBRM560-13 pinout, MBRM560-13 application, or MBRM560-13 equivalent, key selection criteria include thermal resistance (R_θJS = 2.7°C/W), surge rating (100A I_FSM), RoHS-compliant matte tin plating, and mandatory PCB-level connection of Pins 1 & 2 per mechanical diagram.

Technical Context

This Schottky rectifier operates with majority-carrier conduction to eliminate minority-carrier storage delay, enabling high-frequency switching (>100 kHz) in SMPS secondary-side rectification. Its guard ring structure enhances ruggedness against voltage transients without external snubbers.

The device exhibits temperature-dependent forward voltage drop (0.60V @ 5A, 125°C) and reverse leakage rise (200μA @ 60V, 100°C), requiring thermal derating above 75°C ambient per Figure 5. Junction-to-soldering-point thermal resistance is fixed at 2.7°C/W, independent of board layout.

Key Specifications

Pinout & Package

Package: POWERMITE®3 - Molded plastic case (UL 94V-0), 0.072g mass, moisture sensitivity level 1, lead-free matte tin plating. Dimensions: 4.03–4.09 mm (A), 6.40–6.61 mm (B), 1.10–1.14 mm (E), 5.01–5.17 mm (H), 4.37–4.43 mm (J).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS56-E3/57T and SB560-E3/57T, MBRM560-13 delivers superior thermal management via its bottom-side cathode pad and tighter V_F tolerance, making it preferred for high-density power modules where board space and thermal headroom are constrained.

Availability

MBRM560-13 is available at Aetrix Electronics and suitable for DC/DC converter output rectification, polarity protection circuits, and free-wheeling diode applications requiring stable component supply and long-term industrial availability.

Supply support for MBRM560-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, communications, and consumer markets since 1959.

The POWERMITE®3 Schottky rectifier product line targets high-efficiency, space-constrained power conversion with emphasis on thermal performance, transient resilience, and RoHS compliance for modern SMPS designs.

FAQ

What does "NOT RECOMMENDED FOR NEW DESIGN" mean for MBRM560-13?

This designation indicates Diodes Incorporated has superseded MBRM560-13 with newer-generation Schottky rectifiers offering improved V_F, lower leakage, or enhanced thermal metrics. However, MBRM560-13 remains fully qualified, in active production, and supported for legacy program continuity and repair stocking.

Why must Pins 1 and 2 be connected on the PCB?

Pins 1 and 2 are internally tied anode terminals. Connecting them externally ensures balanced current distribution across both leads, reduces localized heating, and maintains rated 5A current capacity. Omitting this connection risks exceeding current density limits on Pin 1 alone.

Can MBRM560-13 replace a standard PN rectifier in an existing design?

Yes-if the circuit operates below 60V reverse bias and benefits from zero reverse recovery. Replace with direct footprint adaptation and verify thermal margin: Schottky's lower V_F reduces power loss, but its higher leakage at elevated temperature may affect standby current in battery systems.

Is the POWERMITE®3 package thermally enhanced compared to SOD-123 or SMA?

Yes-the exposed bottom-side cathode pad in POWERMITE®3 provides a direct thermal path to the PCB, achieving R_θJS = 2.7°C/W. This is up to 5× better than SOD-123 (R_θJA ≈ 120°C/W) and enables 5A continuous operation without external heatsinks on properly designed boards.