Taiwan Semiconductor Corporation MBRS16100

Overview

MBRS16100 from Taiwan Semiconductor is a 16A, 100V Schottky barrier rectifier in TO-263AB (D2PAK) package, optimized for high-efficiency DC/DC conversion with low forward voltage (0.85 V at 16 A, 25°C) and high surge capability (150 A IFSM). It serves as the primary output rectifier in compact, high-frequency switching power supplies.

For engineers reviewing the MBRS16100 datasheet, MBRS16100 pinout, MBRS16100 application, or MBRS16100 equivalent, key selection criteria include its 100 V VRRM rating, 1.5 °C/W RθJC thermal resistance, 7.5 mA IR at 125°C, and compatibility with automated SMT placement in space-constrained industrial and computing power designs.

Technical Context

This single-die Schottky rectifier uses a planar guard-ring structure to enhance overvoltage ruggedness without compromising forward conduction. Its low VF and fast recovery enable high efficiency in 100–500 kHz SMPS topologies where conduction loss dominates.

The TO-263AB package provides low thermal resistance (1.5 °C/W junction-to-case) and supports 16 A continuous forward current at case temperatures up to 115°C, validated per JESD 201 Class 2 whisker testing and J-STD-020 Level 1 moisture sensitivity.

Key Specifications

Pinout & Package

TO-263AB (D2PAK) surface-mount package with three terminals: Anode (pin 1), Cathode (pin 2), and exposed thermal pad (pin 3, electrically connected to cathode). Matte tin-plated leads meet J-STD-002 solderability requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-MBR16100CT and MBR16100CT, MBRS16100 offers superior SMT manufacturability, lower thermal resistance, and integrated guard-ring protection-critical for high-reliability, space-constrained 48 V–100 V bus applications.

Availability

MBRS16100 is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, telecom adapters, and embedded computing PSUs requiring stable component supply across multi-year production cycles.

Supply support for MBRS16100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and telecom markets since 1979.

The MBRS16xx series targets high-efficiency, high-reliability surface-mount rectification in next-generation power supplies where thermal performance, surge robustness, and SMT scalability are critical.

FAQ

What is the maximum junction temperature rating for MBRS16100?

The MBRS16100 has a maximum junction temperature (TJ) rating of +150°C, verified per absolute maximum ratings table. This allows sustained operation at case temperatures up to 115°C when mounted on ≥200 mm² copper area, making it suitable for thermally constrained environments such as sealed industrial enclosures where the MBRS16100 maintains stable forward voltage and leakage performance.

Does MBRS16100 require a heatsink in typical 16 A applications?

No, MBRS16100 does not require an external heatsink in most 16 A applications when properly mounted: its 1.5 °C/W RθJC and TO-263AB thermal pad allow sufficient heat transfer to PCB copper. At 16 A and 25°C ambient, a 200 mm² 2-oz copper pour limits junction temperature rise to ~45°C-well within the MBRS16100's 150°C TJ limit and eliminating need for mechanical heatsinks in space-limited designs.

Is MBRS16100 compatible with lead-free reflow profiles?

Yes, MBRS16100 is fully compatible with standard lead-free reflow profiles (JEDEC J-STD-020 Level 1), with matte tin-plated leads qualified per J-STD-002. Its moisture sensitivity level 1 eliminates pre-bake requirements, and the UL 94V-0 molding compound withstands peak reflow temperatures up to 260°C-ensuring reliable solder joint formation without delamination or voiding during MBRS16100 assembly.

How does the guard ring in MBRS16100 improve system reliability?

The integrated guard ring in MBRS16100 prevents localized electric field concentration at the silicon edge, suppressing premature avalanche breakdown during voltage transients. In real-world use, this extends surge endurance beyond 10⁵ cycles at 100 V VRRM-directly enhancing long-term reliability of MBRS16100 in telecom power supplies exposed to IEC 61000-4-5 line surges without requiring additional external protection components.

What is the reverse leakage current of MBRS16100 at elevated temperature?

At rated 100 V reverse voltage and 125°C junction temperature, MBRS16100 exhibits a maximum reverse leakage current (IR) of 7.5 mA, per electrical specifications table. This value is confirmed under 30 ms pulse test conditions and remains stable across lifetime stress testing-enabling MBRS16100 to maintain low standby power in always-on embedded systems where thermal derating is critical.