My Inquiry
My Account
Taiwan Semiconductor Corporation MBRS16150
- Part No.:
- MBRS16150
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
MBRS16150.pdf
- Description:
- 16A, 150V, SCHOTTKY RECTIFIER
- Quantity:
- Payment:
- Shipping:
Inventory:9,195
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MBRS16150 from Taiwan Semiconductor is a 16A, 150V Schottky barrier rectifier in TO-263AB (D2PAK) package, optimized for high-efficiency DC/DC converters and SMPS secondary-side rectification where low forward voltage and high surge capability are critical. It delivers VF = 0.95 V at 16 A and 25°C, IR = 100 µA at rated VR, and supports TJ up to +150°C.
For engineers reviewing the MBRS16150 datasheet, MBRS16150 pinout, MBRS16150 application, or MBRS16150 equivalent, key selection criteria include its 150V VRRM rating, 150A IFSM surge capacity, RθJC = 1.5°C/W thermal resistance, and moisture sensitivity level 1 compliance - all verified for industrial-grade power conversion designs.
Technical Context
This single-die Schottky rectifier uses platinum-silicide or similar barrier technology to achieve low conduction loss and fast switching with no reverse recovery charge. Its guard ring structure enhances ruggedness against transient overvoltage events, and the TO-263AB package enables high-current PCB mounting with low thermal resistance.
The device operates across -55°C to +150°C junction temperature range and maintains stable reverse leakage (IR ≤ 5 mA at 125°C) even under sustained high-temperature operation - critical for compact, thermally constrained power supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 150 V - Maximum repetitive reverse voltage the device blocks without breakdown; defines usable input/output voltage margin in 48V–72V bus systems. |
| IF | 16 A - Continuous forward current rating at TC = 110°C; supports sustained output currents in 200–300W DC/DC stages. |
| IFSM | 150 A - Non-repetitive surge current (8.3 ms half-sine); withstands inrush and fault transients in SMPS startup and overload conditions. |
| VF @ 16A, 25°C | 0.95 V - Forward voltage drop directly determines conduction loss (Pcond ≈ 15.2 W at full load), impacting thermal design and efficiency. |
| RθJC | 1.5 °C/W - Junction-to-case thermal resistance; enables direct heatsinking to PCB copper or external metal, supporting >10 W dissipation with <15°C rise. |
| IR @ 150V, 25°C | 100 µA - Reverse leakage current at full rated voltage; ensures minimal standby power loss in offline adapters and isolated converters. |
Pinout & Package
TO-263AB (D2PAK) package: 3-terminal surface-mount outline with exposed anode tab (pin 2), cathode (pin 3), and anode (pin 1) - polarity marked on top surface per datasheet marking diagram.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode) | Anode connection | Primary current entry point; electrically tied to exposed metal tab for low-inductance, high-current path and thermal conduction. |
| Pin 2 (Tab/Anode) | Common anode terminal | Exposed copper pad serves as both electrical anode and primary thermal interface; must be soldered to ≥200 mm² copper pour. |
| Pin 3 (Cathode) | Cathode connection | Output node for rectified DC; routed separately to minimize loop inductance in high-frequency switching applications. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring structure | Enhances avalanche ruggedness and prevents edge breakdown under voltage transients - improves reliability in unregulated or loosely regulated outputs. |
| Moisture sensitivity level 1 | No floor life limitation or bake requirement before reflow; compatible with standard SMT assembly lines without special handling. |
| Matte tin-plated leads | Ensures reliable solder wetting and intermetallic formation per J-STD-002; eliminates lead-free solder joint voiding risks. |
| UL 94V-0 molding compound | Self-extinguishing encapsulation meets safety standards for enclosed power supplies and industrial equipment enclosures. |
Applications
| Server PSU Secondary Rectification | Industrial DC/DC Converter Output Stage |
|---|---|
Use Scenario: High-density 12V/48V output rails in 1U server PSUs operating at 200–300 kHz switching frequency. IC Role / Device Role / Timing Role: Primary synchronous rectifier replacement; conducts during low-side switch conduction phase to minimize conduction loss. Use Value: 0.95 V VF at 16 A reduces rectifier loss by ~1.2 W vs. comparable 100V parts, enabling higher power density without forced air cooling. | Use Scenario: 24V input to 5V/3.3V isolated DC/DC modules in programmable logic controllers and motor drives. IC Role / Device Role / Timing Role: Output rectifier in flyback or forward converter secondary winding; handles continuous 12–16 A load with peak surges. Use Value: 150A IFSM and 150°C TJ rating allow operation in sealed enclosures up to 70°C ambient without derating. |
| Telecom AC/DC Adapter | Automotive On-Board Charger Auxiliary Supply |
Use Scenario: Universal-input (90–264 VAC) 65W adapter with active PFC front-end and LLC resonant output stage. IC Role / Device Role / Timing Role: Secondary-side rectifier in LLC transformer secondary; conducts during positive half-cycle of resonant voltage waveform. Use Value: Low IR (100 µA @ 150V) minimizes no-load input power, helping meet Level VI efficiency requirements. | Use Scenario: Auxiliary 12V supply derived from high-voltage battery (400–800V) in EV on-board chargers. IC Role / Device Role / Timing Role: Isolated auxiliary supply rectifier; withstands high dv/dt from SiC primary switches and system-level transients. Use Value: Guard ring protection and 150V VRRM provide margin against reflected spikes from 100V-class auxiliary windings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-16CTQ150 | Same 16A/150V rating, VF = 0.92 V @ 16A/25°C, RθJC = 1.6°C/W, TO-220AC package (through-hole). | Requires through-hole assembly and heatsink mounting; not suitable for fully SMT production or space-constrained layouts. | Select when mechanical robustness or legacy board compatibility outweighs SMT efficiency gains. |
| ON Semiconductor MBR16150CT | 16A/150V dual common-cathode configuration, VF = 0.94 V @ 16A/25°C, TO-220AB package, higher IR (200 µA @ 150V). | Provides dual-output capability but occupies larger footprint; lacks guard ring and MS level 1 rating. | Choose only if dual-channel rectification is required and thermal budget allows higher RθJC. |
Compared with VS-16CTQ150 and MBR16150CT, MBRS16150 offers superior manufacturability (SMT-only, MS level 1), lower thermal resistance (1.5°C/W), and enhanced transient ruggedness (guard ring), making it optimal for high-volume, high-density power supply designs where assembly cost and thermal performance are prioritized.
Availability
MBRS16150 is available at Aetrix Electronics and suitable for switching mode power supplies, DC/DC converters, and industrial adapters requiring stable component supply, long-term lifecycle support, and RoHS-compliant Schottky rectification.
Supply support for MBRS16150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The MBRS16xx series targets high-current, high-voltage Schottky rectification in compact, thermally demanding power conversion systems - emphasizing low VF, rugged surge capability, and SMT manufacturability for next-generation SMPS designs.
FAQ
What is the maximum junction temperature rating for MBRS16150?
The MBRS16150 has a maximum junction temperature (TJ) rating of +150°C, verified per absolute maximum ratings table. This allows operation in high-ambient environments such as enclosed industrial power supplies or automotive under-hood auxiliary circuits. Derating curves confirm usable current down to 110°C case temperature at full 16A rating. MBRS16150 must be mounted on adequate copper area to maintain TJ ≤ 150°C under worst-case load and ambient conditions.
Does MBRS16150 have a guard ring structure, and what does it do?
Yes, MBRS16150 incorporates a guard ring structure explicitly stated in its features list. This design element prevents premature edge breakdown under high dv/dt or transient overvoltage conditions - improving reliability in flyback and LLC converters where reflected spikes occur. The guard ring enhances ruggedness without increasing VF or reducing IF rating, distinguishing MBRS16150 from basic Schottky rectifiers lacking this feature.
What is the reverse leakage current of MBRS16150 at 150V and 125°C?
At 150V reverse voltage and 125°C junction temperature, MBRS16150 exhibits a maximum reverse leakage current (IR) of 5 mA, per the Electrical Specifications table. This value is confirmed for the MBRS16150 variant specifically - lower than earlier variants (e.g., MBRS1690: 7.5 mA), reflecting optimized barrier metallurgy for high-VRRM stability. Designers should verify thermal design ensures TJ stays within limits to avoid excessive standby loss.
Is MBRS16150 suitable for lead-free reflow soldering?
Yes, MBRS16150 is qualified for lead-free reflow soldering per J-STD-002. Its matte tin-plated leads ensure reliable wetting and intermetallic formation at peak temperatures up to 260°C. With moisture sensitivity level 1, no baking is required prior to assembly - simplifying SMT line integration and eliminating floor-life tracking. MBRS16150 complies with JEDEC J-STD-020 and IPC/JEDEC J-STD-033 standards for MSL 1 devices.
What is the thermal resistance from junction to case (RθJC) for MBRS16150?
The junction-to-case thermal resistance (RθJC) of MBRS16150 is 1.5°C/W, as specified in the Thermal Performance section. This low value results from the TO-263AB (D2PAK) package's large exposed anode tab, which provides direct thermal conduction to PCB copper. To achieve this rating, the tab must be fully soldered to ≥200 mm² of 2 oz copper with ≥4 thermal vias - critical for maintaining TJ ≤ 150°C at full 16A load.
MBRS16150 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 150 V
- Current - Average Rectified (Io):
- 16A
- Voltage - Forward (Vf) (Max) @ If:
- 950 mV @ 16 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 100 µA @ 150 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
- Operating Temperature - Junction:
- -55°C ~ 150°C
MBRS16150 FAQ
1.How can I place an order for MBRS16150 through Aetrix?
Please submit a Request for Quotation (RFQ) for MBRS16150 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBRS16150 reliable?
The price and inventory of MBRS16150 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBRS16150 is usually 5 days.
3.What payment methods are accepted for MBRS16150?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBRS16150 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MBRS16150?
MBRS16150 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBRS16150 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBRS16150?
For technical support, including MBRS16150 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBRS16150 requirements.
6.How does Aetrix verify that MBRS16150 is sourced from the original manufacturer or authorized distributors?
All MBRS16150 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBRS16150 meets industry standards.
7.What is the process for return or replacement of MBRS16150?
All MBRS16150 units undergo pre-shipment inspection (PSI). If there is an issue with MBRS16150, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBRS16150 part is unused and in its original packaging.
Return procedure for MBRS16150:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MBRS16150 Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
