Taiwan Semiconductor Corporation MBRS1635

Overview

MBRS1635 from Taiwan Semiconductor is a 16A, 35V Schottky barrier rectifier in TO-263AB (D2PAK) package, featuring 0.63V forward voltage at 16A/25°C, 150A surge current capability, and guard ring overvoltage protection. It serves as a high-efficiency output rectifier in low-voltage DC-DC converters and SMPS secondary-side circuits.

For engineers reviewing the MBRS1635 datasheet, MBRS1635 pinout, MBRS1635 application, or MBRS1635 equivalent, key selection criteria include its 35V VRRM rating, thermal resistance of 1.5°C/W, moisture sensitivity level 1 compliance, and suitability for automated SMT placement in high-current power supplies.

Technical Context

This single-die Schottky rectifier uses platinum-silicide barrier technology to achieve low VF and fast switching with no reverse recovery charge. Its TO-263AB package provides low thermal resistance (R_θJC = 1.5°C/W) and supports 16A continuous forward current at case temperatures up to 115°C.

The device integrates a guard ring structure to enhance ruggedness against transient overvoltage events, and meets JESD201 Class 2 whisker resistance and J-STD-020 Level 1 moisture sensitivity requirements for lead-free reflow compatibility.

Key Specifications

Pinout & Package

TO-263AB (D2PAK) surface-mount package with three terminals: Anode (pin 1), Cathode (pin 2), and exposed thermal pad (pin 3, electrically connected to cathode). The molded case meets UL 94V-0 flammability rating and features matte tin-plated leads compliant with J-STD-002 solderability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-MBR1635CT and MBR1635CT, the MBRS1635 offers superior thermal performance (1.5°C/W vs. ≥2.0°C/W), surface-mount compatibility for automated assembly, and guard ring-enhanced reliability-making it optimal for space-constrained, high-volume SMT power supplies.

Availability

MBRS1635 is available at Aetrix Electronics and suitable for switching mode power supplies, laptop adapters, and DC-DC converters requiring stable component supply, RoHS-compliant packaging, and high-current Schottky rectification.

Supply support for MBRS1635 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and computing applications.

The MBRS1635 belongs to TSC's high-current Schottky rectifier product line, engineered specifically for efficiency-critical secondary-side rectification in compact, high-density AC-DC and DC-DC power converters.

FAQ

What is the maximum junction temperature rating for MBRS1635?

The MBRS1635 has a maximum junction temperature (T_J) of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet. This rating allows sustained operation in thermally demanding environments such as enclosed industrial power modules. Derating begins above 25°C case temperature, with full 16A current supported up to ~115°C case temp based on thermal curves. MBRS1635 must be mounted with adequate copper area to maintain this limit.

Does MBRS1635 have a guard ring structure, and what is its function?

Yes, MBRS1635 incorporates a guard ring structure explicitly documented in its features list and mechanical data section. This design mitigates edge breakdown under transient overvoltage conditions, improving ruggedness during surge events like lightning-induced spikes or inductive kickback. The guard ring enhances long-term reliability in unregulated or loosely regulated power systems where voltage excursions may exceed nominal VRRM. MBRS1635 leverages this feature for enhanced field failure immunity.

What is the forward voltage drop of MBRS1635 at rated current and temperature?

The MBRS1635 exhibits a typical forward voltage (V_F) of 0.63 V at 16 A and 25°C junction temperature, and 0.57 V at 16 A and 125°C, per electrical specifications table. These values are measured under pulsed conditions (PW = 0.3 ms) and reflect actual conduction loss behavior across operating temperature range. Designers should use the 125°C value for worst-case thermal analysis in MBRS1635-based power stages.

Is MBRS1635 compatible with lead-free reflow soldering processes?

Yes, MBRS1635 is qualified for lead-free reflow per J-STD-020 Level 1 moisture sensitivity, with matte tin-plated leads meeting J-STD-002 solderability requirements. Its TO-263AB package withstands peak reflow temperatures up to 260°C without delamination or parametric shift. No pre-baking is required prior to assembly, simplifying manufacturing flow for MBRS1635 in high-volume SMT lines.

What is the thermal resistance from junction to case (R_θJC) for MBRS1635?

The MBRS1635 has a typical junction-to-case thermal resistance (R_θJC) of 1.5°C/W, as specified in the Thermal Performance section of the datasheet. This value assumes full soldering of the exposed thermal pad to a minimum 200 mm² copper area on the PCB. Effective heat transfer via this path is essential to sustain 16A continuous current; insufficient pad area or voiding will degrade actual R_θJC and raise junction temperature in MBRS1635 designs.