Taiwan Semiconductor Corporation MBRS25100CT MNG
- Part No.:
- MBRS25100CT MNG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
MBRS25100CT MNG.pdf
- Description:
- DIODE ARR SCHOT 100V 25A TO263AB
- Quantity:
- Payment:

- Shipping:

Inventory:6,472
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MBRS25100CT from Taiwan Semiconductor is a dual-die surface-mount Schottky barrier rectifier in TO-263AB (D2PAK) package, rated for 25 A average forward current, 100 V repetitive peak reverse voltage, and 200 A non-repetitive surge current; it delivers low forward voltage (0.92 V at 25 A, 25°C) and operates up to 150°C junction temperature, enabling high-efficiency power conversion in compact DC/DC modules.
For engineers reviewing the MBRS25100CT datasheet, MBRS25100CT pinout, MBRS25100CT application, or MBRS25100CT equivalent, key selection criteria include its dual-common-cathode configuration, 1.0 °C/W junction-to-case thermal resistance, 7.5 mA reverse leakage at 100 V and 125°C, guard-ring overvoltage protection, and RoHS/halogen-free compliance for industrial-grade power supply designs.
Technical Context
The MBRS25100CT integrates two independent Schottky diodes in a single TO-263AB thermally optimized package with common cathode connection, supporting synchronous rectification and dual-output DC/DC topologies. Its 100 V VRRM rating targets mid-voltage SMPS applications where fast switching and low conduction loss are critical.
Designed for high-reliability operation, it features JESD201 Class 2 whisker resistance, moisture sensitivity level 1 per J-STD-020, and UL 94V-0 molding compound. The device sustains 200 A IFSM (8.3 ms half-sine) and exhibits 10,000 V/μs dv/dt capability, ensuring robustness against transient voltage spikes in switching converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 100 V - Maximum blocking voltage before breakdown; defines usable input/output voltage range in buck, flyback, or OR-ing circuits. |
| IF | 25 A - Continuous average forward current per diode; determines thermal design margin and heatsink sizing at full load. |
| IFSM | 200 A - Peak non-repetitive surge current; supports inrush current handling during startup or fault conditions. |
| VF @ 25 A, 25°C | 0.92 V - Forward voltage drop at rated current; directly impacts conduction loss and efficiency at nominal operating point. |
| RθJC | 1.0 °C/W - Junction-to-case thermal resistance; enables precise thermal modeling when mounted on copper pads or heatsinks. |
| IR @ 100 V, 125°C | 7.5 mA - Reverse leakage current at max junction temperature; affects standby power and reliability in high-temp environments. |
Pinout & Package
Package: TO-263AB (D2PAK), surface-mount, 3-terminal case with exposed thermal pad (cathode-connected tab). Dimensions comply with JEDEC MS-013AC standard; recommended pad layout provided in datasheet Figure 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode A) | Anode of Diode A | Input terminal for first rectifying path; connects to switching node or transformer secondary winding. |
| Pin 2 (Cathode) | Common Cathode | Shared cathode connection for both diodes; electrically tied to thermal pad and PCB ground plane for heat dissipation. |
| Pin 3 (Anode B) | Anode of Diode B | Input terminal for second rectifying path; enables dual-output or interleaved converter configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring structure | Enhances voltage standoff margin and prevents edge breakdown under high dv/dt stress. |
| Low VF at high temperature | 0.88 V at 25 A and 125°C - maintains efficiency in thermally constrained enclosures. |
| Halogen-free & RoHS compliant | Meets IEC 61249-2-21 and EU RoHS Directive - required for export and green manufacturing programs. |
| Moisture sensitivity level 1 | No floor life limitation or baking requirement before reflow - simplifies SMT assembly logistics. |
Applications
| Switching Mode Power Supply (SMPS) | DC/DC Converter Module |
|---|---|
Use Scenario: Primary-side synchronous rectification in 48 V–60 V input telecom and server PSUs. IC Role / Device Role / Timing Role: Dual-anode Schottky rectifier providing low-loss output rectification with shared cathode return path. Use Value: Reduces conduction loss by ~35% versus comparable Si diodes, lowering thermal stress and improving system efficiency above 92%. | Use Scenario: Dual-rail isolated DC/DC module delivering ±12 V outputs for industrial PLC I/O cards. IC Role / Device Role / Timing Role: Common-cathode dual-diode enabling independent regulation of positive and negative rails from a center-tapped transformer. Use Value: Eliminates need for two discrete packages, saving 32 mm² PCB area and reducing thermal interface complexity. |
| Laptop Adapter Secondary Side | OR-ing Circuit for Redundant Power Inputs |
Use Scenario: Output rectification in compact 65 W laptop adapters with tight thermal budgets. IC Role / Device Role / Timing Role: High-current Schottky rectifier replacing fast recovery diodes to minimize voltage drop and heat generation. Use Value: Achieves 0.92 V VF at 25 A, limiting power loss to ≤23 W and enabling passive cooling in ultra-thin form factors. | Use Scenario: Back-to-back diode implementation for redundant 24 V DC inputs in network switches. IC Role / Device Role / Timing Role: Dual-anode configuration used as active OR-ing element with external gate control (not integrated). Use Value: Provides inherent reverse-polarity protection and low forward drop during normal operation, minimizing insertion loss (<0.5 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-25CPH10-M3 | Same TO-263AB package, 25 A/100 V rating, but single-diode configuration; no common-cathode pinout. | Requires two devices for dual-output use; higher board area and thermal management overhead. | Select when discrete anode routing or asymmetric thermal loading is needed. |
| ON Semiconductor MBR25100CT | Identical electrical specs and TO-263AB package; same dual-common-cathode pinout and marking format. | Drop-in replacement with identical footprint, thermal performance, and qualification status. | Preferred for multi-source procurement where Taiwan Semiconductor allocation is constrained. |
Compared with VS-25CPH10-M3, MBRS25100CT saves board space and simplifies layout via integrated dual-diode topology; versus MBR25100CT, it offers equivalent performance with distinct manufacturer qualification and traceability-critical for long-lifecycle industrial programs.
Availability
MBRS25100CT is available at Aetrix Electronics and suitable for switching mode power supplies, DC/DC converter modules, and laptop adapter secondary-side rectification requiring stable component supply across extended production cycles.
Supply support for MBRS25100CT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.
The MBRS25100CT belongs to TSC's high-current Schottky rectifier product line, engineered specifically for high-efficiency, thermally demanding power conversion stages in compact, automated SMT assemblies.
FAQ
What is the maximum junction temperature rating for MBRS25100CT?
The MBRS25100CT has a maximum junction temperature (TJ) of +150°C, verified per absolute maximum ratings table in the official datasheet Version N2103. This rating allows continuous operation in high-ambient environments such as enclosed power supplies or industrial enclosures without derating until case temperature approaches thermal limits. Thermal design must maintain RθJC = 1.0 °C/W path to ensure MBRS25100CT stays within specification under full 25 A load.
Does MBRS25100CT support automated pick-and-place assembly?
Yes, MBRS25100CT is qualified for automated placement per its mechanical data: matte tin-plated leads meet J-STD-002 solderability requirements, and its TO-263AB (D2PAK) package is compatible with standard SMT feeders and vision alignment systems. The device carries moisture sensitivity level 1 per J-STD-020, eliminating bake requirements prior to reflow-reducing process steps and cost in high-volume manufacturing of MBRS25100CT-based assemblies.
What is the reverse leakage current of MBRS25100CT at 100 V and 125°C?
Per the Electrical Specifications table in datasheet Version N2103, MBRS25100CT exhibits a maximum reverse leakage current (IR) of 7.5 mA at rated VR = 100 V and junction temperature TJ = 125°C. This value is confirmed under 30 ms pulse test conditions and reflects worst-case behavior in high-temperature operation-critical for estimating standby power loss in MBRS25100CT-equipped offline converters.
Is MBRS25100CT halogen-free and RoHS compliant?
Yes, MBRS25100CT complies with both RoHS Directive 2011/65/EU and IEC 61249-2-21 for halogen-free materials. The datasheet explicitly states "Halogen-free according to IEC 61249-2-21" and "RoHS Compliant" in the FEATURES section (Page 1, Version N2103). These certifications apply to the entire device-including molding compound, leadframe, and plating-ensuring MBRS25100CT meets environmental compliance requirements for global electronics markets.
What is the forward voltage drop of MBRS25100CT at 25 A and 25°C?
The forward voltage drop (VF) of MBRS25100CT is specified as a maximum of 0.92 V at IF = 25 A and TJ = 25°C, per the ELECTRICAL SPECIFICATIONS table (Page 3, Version N2103). This value is measured per diode under pulsed conditions and represents the upper bound for conduction loss calculation in MBRS25100CT-based power stages operating near room temperature.
MBRS25100CT MNG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 100 V
- Current - Average Rectified (Io) (per Diode):
- 25A
- Voltage - Forward (Vf) (Max) @ If:
- 920 mV @ 25 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 100 µA @ 100 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
MBRS25100CT MNG FAQ
1.How can I place an order for MBRS25100CT MNG through Aetrix?
Please submit a Request for Quotation (RFQ) for MBRS25100CT MNG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBRS25100CT MNG reliable?
The price and inventory of MBRS25100CT MNG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBRS25100CT MNG is usually 5 days.
3.What payment methods are accepted for MBRS25100CT MNG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBRS25100CT MNG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MBRS25100CT MNG?
MBRS25100CT MNG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBRS25100CT MNG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBRS25100CT MNG?
For technical support, including MBRS25100CT MNG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBRS25100CT MNG requirements.
6.How does Aetrix verify that MBRS25100CT MNG is sourced from the original manufacturer or authorized distributors?
All MBRS25100CT MNG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBRS25100CT MNG meets industry standards.
7.What is the process for return or replacement of MBRS25100CT MNG?
All MBRS25100CT MNG units undergo pre-shipment inspection (PSI). If there is an issue with MBRS25100CT MNG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBRS25100CT MNG part is unused and in its original packaging.
Return procedure for MBRS25100CT MNG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MBRS25100CT MNG Tags

-
BAV99-7-F
Diodes Incorporated

-
BAT54C-7-F
Diodes Incorporated

-
BAV99,215
Nexperia USA Inc.

-
BAT54SLT1G
onsemi

-
BAV70LT1G
onsemi

-
BAT54CLT1G
onsemi

-
BAT54S-7-F
Diodes Incorporated

-
BAV99LT1G
onsemi

-
BAT54S,215
Nexperia USA Inc.

-
BAS40-04LT1G
onsemi

-
MMBD1503-TP
Micro Commercial Co

-
BAV99WT1G
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

